MCC
Features
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l
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omponents
21201 Itasca Street Chatsworth
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MMBD4148CA
High Conductance
Ultra Fast Diode
350mW
SOT-23
A
D
Surface Mount Package Ideally Suited for Automatic Insertion
150 C Junction Temperature
High Conductance
o
Mechanical Data
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Case: SOT-23, Molded Plastic
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Terminals: Solderable per MIL-STD-202, Method 208
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Marking: D6
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Weight: 0.008 grams ( approx.)
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Characteristic
Working Inverse Voltage
DC Forward Current
Average Rectified Current
Recurrent Peak Forward Current
Peak Forward Surge Current@ t=1.0s
@ t=1.0us
Power Dissipation
Thermal Resistance
Operation & Storage Temp. Range
Symbol
V
IV
I
F M
I
F(AV)
I
FRM
I
FSM
P
d
R
Tj, T
STG
Value
75
600
200
700
1.0
2.0
350
357
-55 to +150
o
Unit
V
mA
mA
mA
G
F
E
C
B
H
J
A
K
mW
C/W
o
DIMENSIONS
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
C
Note:
1)
These ratings are based on a max. junction temperature of 150 degrees C
2)
These are steady state limits. The factory should be consulted on applications
involving pulsed or low duty cycle operation
Electrical Characteristics @ 25
o
C Unless Otherwise Specified
Charateristic
Breakdown Voltage
Maximum
Instantaneous
Forward Voltage
Maximum
Instantaneous Reverse
Current
Junction Capacitance
Reverse Recovery
Time
Symbol
V
R
V
F
Min
75
Max
Unit
Test Cond.
V I
R
=100uA
V
nA
uA
uA
pF
I
F
=10mA
DIM
A
B
C
D
E
F
G
H
J
K
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
1.0
25
50
5.0
4
4
I
R
C
j
t
rr
V
R
=20V
V
R
=20V T
A
=150
o
C
V
R
=75V
V
R
=0V, f=1.0MHz
I
F
=10mA, V
R
=6.0V,
ns I
RR
=1.0mA,
R
L
=100 OHM
.037
.950
.037
.950
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