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M7A3P1000-2FG256I

Description
FPGA - Field Programmable Gate Array ProASIC3
CategoryProgrammable logic devices    Programmable logic   
File Size306KB,8 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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M7A3P1000-2FG256I Overview

FPGA - Field Programmable Gate Array ProASIC3

M7A3P1000-2FG256I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionBGA,
Reach Compliance Codeunknown
maximum clock frequency350 MHz
JESD-30 codeS-PBGA-B256
length17 mm
Humidity sensitivity level3
Configurable number of logic blocks24576
Equivalent number of gates1000000
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize24576 CLBS, 1000000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.425 V
Nominal supply voltage1.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD/TIN LEAD SILVER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
CoreAhbSram
Product Summary
Intended Use
Provides an Advanced Microcontroller Bus
Architecture (AMBA) Advanced High-Performance
Bus (AHB) Interface to the Embedded SRAM Blocks
within Fusion, IGLOO
®
, IGLOOe, IGLOO PLUS,
ProASIC
®
3, ProASIC3E, and ProASIC3L devices
Core Verification
A Bus Functional Model (BFM) Scriplet File Is
Included with the Core. This File Contains
Commands which Exercise and Test the Core
during BFM-Based Simulation of Processor
Systems, which Instantiate the Core along with
One of Actel's ARM
®
-Based Processor Cores, such
as CoreMP7 or Cortex
TM
-M1.
Key Features
Implements Standard Slave AHB Bus Hardware
Interface
32-Bit Interface, Allowing Byte, Halfword, or Word
Accesses to SRAM
Ability to Logically Merge Multiple SRAM Blocks
into One Large Area of SRAM
Memory Size Can Be Configured from 2048 bytes
to 32768 bytes, in Steps of 2048 bytes
Contents
General Description ...................................................
Device Utilization and Performance ........................
I/O Signal Descriptions ...............................................
Generic/Parameter Descriptions ................................
Timing Diagrams ........................................................
Ordering Information ................................................
List of Changes ...........................................................
Datasheet Categories .................................................
1
1
2
2
3
3
3
4
Supported Device Families
Fusion
IGLOO, IGLOOe, IGLOO PLUS
ProASIC3, ProASIC3E, ProASIC3L
General Description
CoreAhbSram provides an AHB bus interface to the
embedded SRAM blocks within Fusion, IGLOO, IGLOOe,
IGLOO PLUS, ProASIC3, ProASIC3E, and ProASIC3L
devices. In these devices, software running on an AHB-
based microprocessor will be able to read and write the
embedded SRAM. Note that this datasheet focuses on
the operation of the CoreAhbSram and does not provide
detailed information on the structure or the behavior of
the Fusion, IGLOO, IGLOOe, IGLOO PLUS, ProASIC3L,
ProASIC3, or ProASIC3E SRAM. Refer to the
Fusion Family
of Mixed-Signal FPGAs,
IGLOO Low-Power Flash FPGAs
with Flash*Freeze Technology, IGLOOe Low-Power Flash
FPGAs with Flash*Freeze Technology, IGLOO PLUS Low-
Power Flash FPGAs with Flash*Freeze Technology,
or
Actel ProASIC3 FPGA,
datasheets for details on the
internal SRAM.
Core Deliverables
VHDL and Verilog Delivered as Plaintext or
Obfuscated RTL via Actel Libero
®
Integrated
Design Environment (IDE) Catalog Manager or
CoreConsole IP Deployment Platform
November 2008
© 2008 Actel Corporation
v 2 .2
1

M7A3P1000-2FG256I Related Products

M7A3P1000-2FG256I M7A3P1000-1FG256 M7A3P1000-2PQ208I M7A3P1000-2FG144I M7A3P1000-2PQ208 M7A3P1000-2FG484 M7A3P1000-2FGG256 M7A3P1000-2FGG144 M7A3P1000-1FG144
Description FPGA - Field Programmable Gate Array ProASIC3 FPGA - Field Programmable Gate Array ProASIC3 FPGA - Field Programmable Gate Array ProASIC3 Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PQFP208, 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 FPGA - Field Programmable Gate Array ProASIC3 FPGA - Field Programmable Gate Array ProASIC3 FPGA - Field Programmable Gate Array ProASIC3 FPGA - Field Programmable Gate Array ProASIC3
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible conform to conform to incompatible
package instruction BGA, BGA, 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 LBGA, 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 BGA, BGA, LBGA, LBGA,
Reach Compliance Code unknown unknown unknown unknown unknown compliant compliant compliant unknown
maximum clock frequency 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz 350 MHz
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PQFP-G208 S-PBGA-B144 S-PQFP-G208 S-PBGA-B484 S-PBGA-B256 S-PBGA-B144 S-PBGA-B144
length 17 mm 17 mm 28 mm 13 mm 28 mm 23 mm 17 mm 13 mm 13 mm
Configurable number of logic blocks 24576 24576 24576 24576 24576 24576 24576 24576 24576
Equivalent number of gates 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Number of terminals 256 256 208 144 208 484 256 144 144
Maximum operating temperature 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA FQFP LBGA FQFP BGA BGA LBGA LBGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE FLATPACK, FINE PITCH GRID ARRAY GRID ARRAY GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable logic type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.7 mm 1.8 mm 4.1 mm 1.55 mm 4.1 mm 2.44 mm 1.8 mm 1.55 mm 1.55 mm
Maximum supply voltage 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V 1.575 V
Minimum supply voltage 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V 1.425 V
Nominal supply voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form BALL BALL GULL WING BALL GULL WING BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 0.5 mm 1 mm 0.5 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM QUAD BOTTOM QUAD BOTTOM BOTTOM BOTTOM BOTTOM
width 17 mm 17 mm 28 mm 13 mm 28 mm 23 mm 17 mm 13 mm 13 mm
Maker Microsemi Microsemi Microsemi Microsemi - - - - Microsemi
Humidity sensitivity level 3 3 - 3 3 3 3 3 3
Peak Reflow Temperature (Celsius) 225 225 - 225 - 225 260 260 225
Terminal surface TIN LEAD/TIN LEAD SILVER TIN LEAD/TIN LEAD SILVER - Tin/Lead/Silver (Sn/Pb/Ag) TIN LEAD Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead/Silver (Sn/Pb/Ag)
Maximum time at peak reflow temperature 30 30 - 30 - 30 40 40 30
JESD-609 code - - - e0 e0 e0 e1 e1 e0

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