HCC4572B datasheet, PDF - EEWORLD Datasheet

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HCC4572B: DescriptionHEX GATE; File Size194KB，6 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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HCC4572B Overview

HEX GATE

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HCC4572B

HCF4572B

HEX GATE

PRODUCT PREVIEW

VERY LOW QUIESCENT CURRENT

HIGH NOISE IMMUNITY

SINGLE SUPPLY OPERATION

SUPPLY VOLTAGE RANGE 3V TO 18V

HIGH INPUT IMPEDANCE

PIN LAYOUT OPTIMISED FOR MAXIMUM

FLEXIBILITY

(Plastic Package)

(Ceramic Frit Seal Package)

(Micro Package)

(Plastic Chip Carrier)

ORDER CODES :

HCC4572 BF

HCF4572 BM1

HCF4572 BEY

HCF4572 BC1

PIN CONNECTION

(top view)

DESCRIPTION

The HCC4572B and HCF4572B are a monolithic in-

tegrated circuits, available in 16-lead dual-in-line

plastic and ceramic packages and plastic micro

packages.

The HCC4572B and HCF4572B are hex functional

gates containing one NOR gate, one NAND gate

and four inverters. These devices are intended for

application where low power dissipation and/or high

noise immunity is required.

September 1990

1/6

HCC4572B Related Products

	HCC4572B	HCC4572BF	HCF4572B	HCF4572BC1	HCF4572BM1	HCF4572BEY
Description	HEX GATE	HEX GATE	HEX GATE	HEX GATE	HEX GATE	HEX GATE
Maker	-	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	-	DIP	-	QLCC	SOIC	DIP
package instruction	-	FRIT SEALED, CERAMIC, DIP-16	-	QCCJ,	MICRO, SO-16	PLASTIC, DIP-16
Contacts	-	16	-	20	16	16
Reach Compliance Code	-	unknown	-	unknow	unknown	unknown
Other features	-	MIXED WITH 2-IN NOR & 2-IN NAND	-	MIXED WITH 2-IN NOR & 2-IN NAND	MIXED WITH 2-IN NOR & 2-IN NAND	MIXED WITH 2-IN NOR & 2-IN NAND
series	-	4000/14000/40000	-	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	-	R-GDIP-T16	-	S-PQCC-J20	R-PDSO-G16	R-PDIP-T16
Logic integrated circuit type	-	INVERTER	-	INVERTER	INVERTER	INVERTER
Number of functions	-	4	-	4	4	4
Number of entries	-	1	-	1	1	1
Number of terminals	-	16	-	20	16	16
Maximum operating temperature	-	125 °C	-	85 °C	85 °C	85 °C
Minimum operating temperature	-	-55 °C	-	-40 °C	-40 °C	-40 °C
Package body material	-	CERAMIC, GLASS-SEALED	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	DIP	-	QCCJ	SOP	DIP
Package shape	-	RECTANGULAR	-	SQUARE	RECTANGULAR	RECTANGULAR
Package form	-	IN-LINE	-	CHIP CARRIER	SMALL OUTLINE	IN-LINE
Certification status	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	5.08 mm	-	4.57 mm	1.75 mm	5.1 mm
Maximum supply voltage (Vsup)	-	18 V	-	15 V	15 V	15 V
Minimum supply voltage (Vsup)	-	3 V	-	3 V	3 V	3 V
Nominal supply voltage (Vsup)	-	5 V	-	5 V	5 V	5 V
surface mount	-	NO	-	YES	YES	NO
technology	-	CMOS	-	CMOS	CMOS	CMOS
Temperature level	-	MILITARY	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	-	THROUGH-HOLE	-	J BEND	GULL WING	THROUGH-HOLE
Terminal pitch	-	2.54 mm	-	1.27 mm	1.27 mm	2.54 mm
Terminal location	-	DUAL	-	QUAD	DUAL	DUAL
width	-	7.62 mm	-	8.965 mm	3.9 mm	7.62 mm

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