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HCF4572B

Description
HEX GATE
File Size194KB,6 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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HCF4572B Overview

HEX GATE

HCC4572B
HCF4572B
HEX GATE
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PRODUCT PREVIEW
VERY LOW QUIESCENT CURRENT
HIGH NOISE IMMUNITY
SINGLE SUPPLY OPERATION
SUPPLY VOLTAGE RANGE 3V TO 18V
HIGH INPUT IMPEDANCE
PIN LAYOUT OPTIMISED FOR MAXIMUM
FLEXIBILITY
EY
(Plastic Package)
F
(Ceramic Frit Seal Package)
M1
C1
(Micro Package)
(Plastic Chip Carrier)
ORDER CODES :
HCC4572 BF
HCF4572 BM1
HCF4572 BEY
HCF4572 BC1
PIN CONNECTION
(top view)
DESCRIPTION
The HCC4572B and HCF4572B are a monolithic in-
tegrated circuits, available in 16-lead dual-in-line
plastic and ceramic packages and plastic micro
packages.
The HCC4572B and HCF4572B are hex functional
gates containing one NOR gate, one NAND gate
and four inverters. These devices are intended for
application where low power dissipation and/or high
noise immunity is required.
September 1990
1/6

HCF4572B Related Products

HCF4572B HCC4572B HCC4572BF HCF4572BC1 HCF4572BM1 HCF4572BEY
Description HEX GATE HEX GATE HEX GATE HEX GATE HEX GATE HEX GATE
Maker - - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code - - DIP QLCC SOIC DIP
package instruction - - FRIT SEALED, CERAMIC, DIP-16 QCCJ, MICRO, SO-16 PLASTIC, DIP-16
Contacts - - 16 20 16 16
Reach Compliance Code - - unknown unknow unknown unknown
Other features - - MIXED WITH 2-IN NOR & 2-IN NAND MIXED WITH 2-IN NOR & 2-IN NAND MIXED WITH 2-IN NOR & 2-IN NAND MIXED WITH 2-IN NOR & 2-IN NAND
series - - 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000
JESD-30 code - - R-GDIP-T16 S-PQCC-J20 R-PDSO-G16 R-PDIP-T16
Logic integrated circuit type - - INVERTER INVERTER INVERTER INVERTER
Number of functions - - 4 4 4 4
Number of entries - - 1 1 1 1
Number of terminals - - 16 20 16 16
Maximum operating temperature - - 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature - - -55 °C -40 °C -40 °C -40 °C
Package body material - - CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - DIP QCCJ SOP DIP
Package shape - - RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form - - IN-LINE CHIP CARRIER SMALL OUTLINE IN-LINE
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - - 5.08 mm 4.57 mm 1.75 mm 5.1 mm
Maximum supply voltage (Vsup) - - 18 V 15 V 15 V 15 V
Minimum supply voltage (Vsup) - - 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) - - 5 V 5 V 5 V 5 V
surface mount - - NO YES YES NO
technology - - CMOS CMOS CMOS CMOS
Temperature level - - MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - - THROUGH-HOLE J BEND GULL WING THROUGH-HOLE
Terminal pitch - - 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location - - DUAL QUAD DUAL DUAL
width - - 7.62 mm 8.965 mm 3.9 mm 7.62 mm

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