HCC4572BF datasheet, PDF - EEWORLD Datasheet

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HCC4572BF: DescriptionHEX GATE; Categorylogic logic; File Size194KB，6 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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HCC4572BF Overview

HEX GATE

HCC4572BF Parametric

Parameter Name	Attribute value
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	FRIT SEALED, CERAMIC, DIP-16
Contacts	16
Reach Compliance Code	unknown
Other features	MIXED WITH 2-IN NOR & 2-IN NAND
series	4000/14000/40000
JESD-30 code	R-GDIP-T16
Logic integrated circuit type	INVERTER
Number of functions	4
Number of entries	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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HCC4572B

HCF4572B

HEX GATE

PRODUCT PREVIEW

VERY LOW QUIESCENT CURRENT

HIGH NOISE IMMUNITY

SINGLE SUPPLY OPERATION

SUPPLY VOLTAGE RANGE 3V TO 18V

HIGH INPUT IMPEDANCE

PIN LAYOUT OPTIMISED FOR MAXIMUM

FLEXIBILITY

(Plastic Package)

(Ceramic Frit Seal Package)

(Micro Package)

(Plastic Chip Carrier)

ORDER CODES :

HCC4572 BF

HCF4572 BM1

HCF4572 BEY

HCF4572 BC1

PIN CONNECTION

(top view)

DESCRIPTION

The HCC4572B and HCF4572B are a monolithic in-

tegrated circuits, available in 16-lead dual-in-line

plastic and ceramic packages and plastic micro

packages.

The HCC4572B and HCF4572B are hex functional

gates containing one NOR gate, one NAND gate

and four inverters. These devices are intended for

application where low power dissipation and/or high

noise immunity is required.

September 1990

1/6

HCC4572BF Related Products

	HCC4572BF	HCC4572B	HCF4572B	HCF4572BC1	HCF4572BM1	HCF4572BEY
Description	HEX GATE	HEX GATE	HEX GATE	HEX GATE	HEX GATE	HEX GATE
Maker	STMicroelectronics	-	-	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	DIP	-	-	QLCC	SOIC	DIP
package instruction	FRIT SEALED, CERAMIC, DIP-16	-	-	QCCJ,	MICRO, SO-16	PLASTIC, DIP-16
Contacts	16	-	-	20	16	16
Reach Compliance Code	unknown	-	-	unknow	unknown	unknown
Other features	MIXED WITH 2-IN NOR & 2-IN NAND	-	-	MIXED WITH 2-IN NOR & 2-IN NAND	MIXED WITH 2-IN NOR & 2-IN NAND	MIXED WITH 2-IN NOR & 2-IN NAND
series	4000/14000/40000	-	-	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	R-GDIP-T16	-	-	S-PQCC-J20	R-PDSO-G16	R-PDIP-T16
Logic integrated circuit type	INVERTER	-	-	INVERTER	INVERTER	INVERTER
Number of functions	4	-	-	4	4	4
Number of entries	1	-	-	1	1	1
Number of terminals	16	-	-	20	16	16
Maximum operating temperature	125 °C	-	-	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-	-	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	-	-	QCCJ	SOP	DIP
Package shape	RECTANGULAR	-	-	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	-	-	CHIP CARRIER	SMALL OUTLINE	IN-LINE
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	-	-	4.57 mm	1.75 mm	5.1 mm
Maximum supply voltage (Vsup)	18 V	-	-	15 V	15 V	15 V
Minimum supply voltage (Vsup)	3 V	-	-	3 V	3 V	3 V
Nominal supply voltage (Vsup)	5 V	-	-	5 V	5 V	5 V
surface mount	NO	-	-	YES	YES	NO
technology	CMOS	-	-	CMOS	CMOS	CMOS
Temperature level	MILITARY	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	-	-	J BEND	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	-	-	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	-	-	QUAD	DUAL	DUAL
width	7.62 mm	-	-	8.965 mm	3.9 mm	7.62 mm

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