HCF4572BM1 datasheet, PDF - EEWORLD Datasheet

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HCF4572BM1: DescriptionHEX GATE; Categorylogic logic; File Size194KB，6 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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HCF4572BM1 Overview

HEX GATE

HCF4572BM1 Parametric

Parameter Name	Attribute value
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	MICRO, SO-16
Contacts	16
Reach Compliance Code	unknown
Other features	MIXED WITH 2-IN NOR & 2-IN NAND
series	4000/14000/40000
JESD-30 code	R-PDSO-G16
length	9.9 mm
Logic integrated circuit type	INVERTER
Number of functions	4
Number of entries	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	15 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	3.9 mm
Base Number Matches	1

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HCC4572B

HCF4572B

HEX GATE

PRODUCT PREVIEW

VERY LOW QUIESCENT CURRENT

HIGH NOISE IMMUNITY

SINGLE SUPPLY OPERATION

SUPPLY VOLTAGE RANGE 3V TO 18V

HIGH INPUT IMPEDANCE

PIN LAYOUT OPTIMISED FOR MAXIMUM

FLEXIBILITY

(Plastic Package)

(Ceramic Frit Seal Package)

(Micro Package)

(Plastic Chip Carrier)

ORDER CODES :

HCC4572 BF

HCF4572 BM1

HCF4572 BEY

HCF4572 BC1

PIN CONNECTION

(top view)

DESCRIPTION

The HCC4572B and HCF4572B are a monolithic in-

tegrated circuits, available in 16-lead dual-in-line

plastic and ceramic packages and plastic micro

packages.

The HCC4572B and HCF4572B are hex functional

gates containing one NOR gate, one NAND gate

and four inverters. These devices are intended for

application where low power dissipation and/or high

noise immunity is required.

September 1990

1/6

HCF4572BM1 Related Products

	HCF4572BM1	HCC4572B	HCC4572BF	HCF4572B	HCF4572BC1	HCF4572BEY
Description	HEX GATE	HEX GATE	HEX GATE	HEX GATE	HEX GATE	HEX GATE
Maker	STMicroelectronics	-	STMicroelectronics	-	STMicroelectronics	STMicroelectronics
Parts packaging code	SOIC	-	DIP	-	QLCC	DIP
package instruction	MICRO, SO-16	-	FRIT SEALED, CERAMIC, DIP-16	-	QCCJ,	PLASTIC, DIP-16
Contacts	16	-	16	-	20	16
Reach Compliance Code	unknown	-	unknown	-	unknow	unknown
Other features	MIXED WITH 2-IN NOR & 2-IN NAND	-	MIXED WITH 2-IN NOR & 2-IN NAND	-	MIXED WITH 2-IN NOR & 2-IN NAND	MIXED WITH 2-IN NOR & 2-IN NAND
series	4000/14000/40000	-	4000/14000/40000	-	4000/14000/40000	4000/14000/40000
JESD-30 code	R-PDSO-G16	-	R-GDIP-T16	-	S-PQCC-J20	R-PDIP-T16
Logic integrated circuit type	INVERTER	-	INVERTER	-	INVERTER	INVERTER
Number of functions	4	-	4	-	4	4
Number of entries	1	-	1	-	1	1
Number of terminals	16	-	16	-	20	16
Maximum operating temperature	85 °C	-	125 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-55 °C	-	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	CERAMIC, GLASS-SEALED	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	-	DIP	-	QCCJ	DIP
Package shape	RECTANGULAR	-	RECTANGULAR	-	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE	-	IN-LINE	-	CHIP CARRIER	IN-LINE
Certification status	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	-	5.08 mm	-	4.57 mm	5.1 mm
Maximum supply voltage (Vsup)	15 V	-	18 V	-	15 V	15 V
Minimum supply voltage (Vsup)	3 V	-	3 V	-	3 V	3 V
Nominal supply voltage (Vsup)	5 V	-	5 V	-	5 V	5 V
surface mount	YES	-	NO	-	YES	NO
technology	CMOS	-	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	-	MILITARY	-	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	-	THROUGH-HOLE	-	J BEND	THROUGH-HOLE
Terminal pitch	1.27 mm	-	2.54 mm	-	1.27 mm	2.54 mm
Terminal location	DUAL	-	DUAL	-	QUAD	DUAL
width	3.9 mm	-	7.62 mm	-	8.965 mm	7.62 mm

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