EEWORLDEEWORLDEEWORLD

Part Number

Search

TBJD475K050LRSB0800

Description
Tantalum Capacitors - Solid SMD 50V 4.7uF 10% 2917 CASE D
CategoryPassive components   
File Size242KB,11 Pages
ManufacturerAVX
Download Datasheet Parametric View All

TBJD475K050LRSB0800 Online Shopping

Suppliers Part Number Price MOQ In stock  
TBJD475K050LRSB0800 - - View Buy Now

TBJD475K050LRSB0800 Overview

Tantalum Capacitors - Solid SMD 50V 4.7uF 10% 2917 CASE D

TBJD475K050LRSB0800 Parametric

Parameter NameAttribute value
Product CategoryTantalum Capacitors - Solid SMD
ManufacturerAVX
RoHSNo
PackagingReel
Capacitance - nF4700 nF
Factory Pack Quantity500
TBJ Series
COTS-Plus
The TBJ COTS-Plus series, based on the
CWR11 form factor, is a high reliability
series encompassing the current range of
EIA Low ESR ratings. These ratings are
available with Weibull grading (B and C),
surge current testing (A, B, C) per MIL-PRF-
55365 Rev. G, and optional Group A from
MIL-PRF-55365.
For Space Level applications, AVX
SRC9000 qualification is recommended.
Please refer to the TBJ COTS-Plus
SRC9000 Datasheet for part number
availability.
There are five termination finishes available:
solder plated, fused solder plated, hot
solder dipped, 100% Tin and gold plated
(these correspond to “H”, “K”, “C”, “7” and
“B” termination, respectively). The molding
compound has been selected to meet the
requirements
of
UL94V-0
(Flame
Retardancy) and outgassing requirements
of ASTM E-595.
For moisture sensitivity levels please refer to
the High Reliability Tantalum MSL section
located in the back of the High Reliability
Tantalum Catalog.
CASE DIMENSIONS:
millimeters (inches)
L
W
Code
H
EIA
Code
1206
1210
2312
2917
2917
2924
EIA
Metric
3216-18
3528-21
6032-28
7343-31
7343-43
7361-38
L±0.20
(0.008)
3.20 (0.126)
3.50 (0.138)
6.00 (0.236)
7.30 (0.287)
7.30 (0.287)
7.30 (0.287)
W+0.20 (0.008)
-0.10 (0.004)
1.60 (0.063)
2.80 (0.110)
3.20 (0.126)
4.30 (0.169)
4.30 (0.169)
6.10 (0.240)
H+0.20 (0.008)
-0.10 (0.004)
1.60 (0.063)
1.90 (0.075)
2.60 (0.102)
2.90 (0.114)
4.10 (0.162)
3.55 (0.140)
W
1
±0.20
(0.008)
1.20 (0.047)
2.20 (0.087)
2.20 (0.087)
2.40 (0.094)
2.40 (0.094)
3.10 (0.120)
A+0.30 (0.012)
-0.20 (0.008)
0.80 (0.031)
0.80 (0.031)
1.30 (0.051)
1.30 (0.051)
1.30 (0.051)
1.30 (0.051)
S Min.
1.10 (0.043)
1.40 (0.055)
2.90 (0.114)
4.40 (0.173)
4.40 (0.173)
4.40 (0.173)
A
B
C
D
E
V
A
S
A
W
1
MARKING
A, B, C, D, E, V CASE
AVX LOGO
Capacitance Value in pF
227 = 220µF
Rated Voltage Code
A = 10V
ID Code
Polarity
Band
(Anode+)
W
1
dimension applies to the termination width for A dimensional area only.
227 A
XXXXX
HOW TO ORDER
AVX PART NUMBER:
TBJ D
Type
Case
Size
227
*
035
C
B
S
Z
0
0
00
Surge Test
Option
00 = None
23 = 10 Cycles, +25ºC
24 = 10 Cycles,
-55ºC & +85ºC
45 = 10 cycles,
-55ºC & +85ºC
before Weibull
Capacitance Capacitance
Voltage
ESR
Code
Tolerance
Code
C = Std ESR
pF code:
K = ±10% 002 = 2Vdc L = Low ESR
1st two digits
M = ±20% 004 = 4Vdc
represent
006 = 6.3Vdc
significant
010 = 10Vdc
figures 3rd
016 = 16Vdc
digit represents
020 = 20Vdc
multiplier
025 = 25Vdc
(number of
zeros to follow)
035 = 35Vdc
050 = 50Vdc
Packaging Inspection Level
Reliability Grade
S = Std.
B = Bulk
Weibull:
Conformance B = 0.1%/1000 hrs.
R = 7" T&R
S = 13" T&R L = Group A
90% conf.
W = Waffle
C = 0.01%/1000 hrs.
90% conf.
Z = Non-ER
Qualification Termination Finish
Level
H = Solder Plated
0 = N/A
0 = Fused Solder
Plated
8 = Hot Solder
Dipped
9 = Gold Plated
7 = Matte Sn
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
TECHNICAL SPECIFICATIONS
Technical Data:
Capacitance Range:
Capacitance Tolerance:
Rated Voltage (V
R
)
Category Voltage (V
C
)
Surge Voltage (V
S
)
Surge Voltage (V
S
)
Temperature Range:
Unless otherwise specified, all technical
0.10 μF to 1500 μF
±10%; ±20%
85°C:
2
4
6
10
125°C:
1.4
2.7
4
7
85°C:
2.6
5.2
8
13
125°C:
1.7
3.4
5
8
-55°C to +125°C
data relate to an ambient temperature of 25°C
16
10
20
13
20
13
26
16
25
17
32
20
35
23
46
28
50
33
65
40
38
100516
MSP430 Classic Textbook Recommendations
MSP430 Series MCU Principles and Engineering Design Practice / edited by Wang Zhaobin [et al.]Introduction: This book uses the MSP430F261x series of microcontrollers as a platform to explain in detail...
灞波儿奔 Microcontroller MCU
TI MSP430 course self-study notes
I have been in contact with 51 for more than a year. A few days ago, I happened to see TI's MSP430 training lecture in the forum. The prizes were very tempting O(∩_∩)O haha~ So I decided to learn it. ...
HALO--117 Microcontroller MCU
Solution for burning nand under linux
Hi everyone, I am working on a project recently. The plan is to boot the bare board from the SD card. There is no content on the board. After the system is up, the character module is loaded and the o...
zhing21 Embedded System
Case Structure
Case StructureFrom LabVIEW WikiJump to: navigation, searchContents[hide]1 Introduction 2 General Items 3 Editing tips and tricks3.1 Selection mechanism3.1.1 Boolean 3.1.2Integer3.1.2.1 Floats 3.1.2.2 ...
安_然 Test/Measurement
GaN Technology Then and Now
Gallium nitride (GaN) transistors were first introduced in the 1990s and are now widely used in commercial and defense applications, but engineering applications can be very different. Not convinced? ...
兰博 RF/Wirelessly
About Windows 4.2 and 5.0
I am a newbie who has just started to get involved in this field. I have many questions. 1: When building the operating system image, 5.0 requires you to select both copy files to release directory af...
wuh2003 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1854  1524  594  2605  2419  38  31  12  53  49 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号