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MCM63Z737

Description
128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM
File Size148KB,20 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MCM63Z737 Overview

128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MCM63Z737/D
Advance Information
128K x 36 and 256K x 18 Bit
Flow–Through ZBT™ RAM
Synchronous Fast Static RAM
The ZBT RAM is a 4M–bit synchronous fast static RAM designed to provide
zero bus turnaround. The ZBT RAM allows 100% use of bus cycles during
back–to–back read/write and write/read cycles. The MCM63Z737 is organized
as 128K words of 36 bits each and the MCM63Z819 is organized as 256K words
of 18 bits each, fabricated with high performance silicon gate CMOS technology.
This device integrates input registers, a 2–bit address counter, and high speed
SRAM onto a single monolithic circuit for reduced parts count in communication
applications. Synchronous design allows precise cycle control with the use of an
external clock (CK). CMOS circuitry reduces the overall power consumption of
the integrated functions for greater reliability.
Addresses (SA), data inputs (DQ), and all control signals except output enable
(G) and linear burst order (LBO) are clock (CK) controlled through positive–
edge–triggered noninverting registers.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (CK) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
For read cycles, a flow–through SRAM allows output data to simply flow freely
from the memory array.
3.3 V LVTTL and LVCMOS Compatible
MCM63Z737/MCM63Z819–11 = 11 ns Access/15 ns Cycle (66 MHz)
MCM63Z737/MCM63Z819–15 = 15 ns Access/20 ns Cycle (50 MHz)
Selectable Burst Sequencing Order (Linear/Interleaved)
Internally Self–Timed Write Cycle
Single–Cycle Deselect
Byte Write Control
ADV Controlled Burst
100–Pin TQFP Package
MCM63Z737
MCM63Z819
TQ PACKAGE
TQFP
CASE 983A–01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by
Micron Technology, Inc. and Motorola, Inc.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
2/6/98
©
Motorola, Inc. 1998
MOTOROLA FAST SRAM
MCM63Z737
D
MCM63Z819
1

MCM63Z737 Related Products

MCM63Z737 MCM63Z819TQ15R MCM63Z819TQ15 MCM63Z819TQ11 MCM63Z737TQ15R MCM63Z737TQ11R MCM63Z737TQ15 MCM63Z737TQ11
Description 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
Parts packaging code - QFP QFP QFP QFP - QFP QFP
package instruction - LQFP, LQFP, LQFP, LQFP, TQFP-100 LQFP, LQFP,
Contacts - 100 100 100 100 - 100 100
Reach Compliance Code - unknow unknow unknow unknow unknow unknow unknow
ECCN code - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time - 15 ns 15 ns 11 ns 15 ns 11 ns 15 ns 11 ns
JESD-30 code - R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code - e0 e0 e0 e0 e0 e0 e0
length - 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density - 4718592 bi 4718592 bi 4718592 bi 4718592 bi 4718592 bi 4718592 bi 4718592 bi
Memory IC Type - ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width - 18 18 18 36 36 36 36
Number of functions - 1 1 1 1 1 1 1
Number of terminals - 100 100 100 100 100 100 100
word count - 262144 words 262144 words 262144 words 131072 words 131072 words 131072 words 131072 words
character code - 256000 256000 256000 128000 128000 128000 128000
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize - 256KX18 256KX18 256KX18 128KX36 128KX36 128KX36 128KX36
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - LQFP LQFP LQFP LQFP LQFP LQFP LQFP
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum supply voltage (Vsup) - 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) - 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - YES YES YES YES YES YES YES
technology - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch - 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location - QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

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