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MCM63P631ATQ100

Description
64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM
Categorystorage    storage   
File Size149KB,16 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MCM63P631ATQ100 Overview

64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM

MCM63P631ATQ100 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknow
ECCN code3A991.B.2.A
Maximum access time4.5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density2097152 bi
Memory IC TypeCACHE SRAM
memory width32
Number of functions1
Number of ports1
Number of terminals100
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX32
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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Product Preview
MCM63P631A
64K x 32 Bit Pipelined BurstRAM
Synchronous Fast Static RAM
The MCM63P631A is a 2M bit synchronous fast static RAM designed to pro-
vide a burstable, high performance, secondary cache for the 68K Family, Pow-
erPC™, and Pentium™ microprocessors. It is organized as 64K words of 32 bits
each. This device integrates input registers, an output register, a 2–bit address
counter, and high speed SRAM onto a single monolithic circuit for reduced parts
count in cache data RAM applications. Synchronous design allows precise cycle
control with the use of an external clock (K). CMOS circuitry reduces the overall
power consumption of the integrated functions for greater reliability.
Addresses (SA), data inputs (DQx), and all control signals except output
enable (G), sleep mode (ZZ), and Linear Burst Order (LBO) are clock (K) con-
trolled through positive–edge–triggered noninverting registers.
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst
addresses can be generated internally by the MCM63P631A (burst sequence
operates in linear or interleaved mode dependent upon state of LBO) and con-
trolled by the burst address advance (ADV) input pin.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (K) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
Synchronous byte write (SBx), synchronous global write (SGW), and synchro-
nous write enable SW are provided to allow writes to either individual bytes or to
all bytes. The four bytes are designated as “a”, “b”, “c”, and “d”. SBa controls
DQa, SBb controls DQb, etc. Individual bytes are written if the selected byte
writes SBx are asserted with SW. All bytes are written if either SGW is asserted
or if all SBx and SW are asserted.
For read cycles, pipelined SRAMs output data is temporarily stored by an
edge–triggered output register and then released to the output buffers at the next
rising edge of clock (K).
The MCM63P631A operates from a 3.3 V power supply, all inputs and outputs
are LVTTL compatible.
MCM63P631A–117 = 4.5 ns access / 8.5 ns cycle (117 MHz)
MCM63P631A–100 = 4.5 ns access / 10 ns cycle (100 MHz)
MCM63P631A–75 = 7 ns access / 13.3 ns cycle (75 MHz)
MCM63P631A–66 = 8 ns access / 15 ns cycle (66 MHz)
Single 3.3 V + 10%, – 5% Power Supply
ADSP, ADSC, and ADV Burst Control Pins
Selectable Burst Sequencing Order (Linear/Interleaved)
Internally Self–Timed Write Cycle
Byte Write and Global Write Control
Sleep Mode (ZZ)
PB1 Version 2.0 Compatible
Single–Cycle Deselect Timing
JEDEC Standard 100–Pin TQFP Package
TQ PACKAGE
TQFP
CASE 983A–01
The PowerPC name is a trademark of IBM Corp., used under license therefrom.
Pentium is a trademark of Intel Corp.
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
9/30/97
©
Motorola, Inc. 1997
MOTOROLA FAST SRAM
MCM63P631A
1

MCM63P631ATQ100 Related Products

MCM63P631ATQ100 MCM63P631ATQ75R MCM63P631ATQ75 MCM63P631ATQ66R MCM63P631ATQ66 MCM63P631ATQ117R MCM63P631ATQ117 MCM63P631ATQ100R MCM63P631A
Description 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM 64K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) -
Parts packaging code QFP QFP QFP QFP QFP QFP - - -
package instruction LQFP, LQFP, LQFP, LQFP, LQFP, LQFP, TQFP-100 TQFP-100 -
Contacts 100 100 100 100 100 100 - - -
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow unknown -
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A -
Maximum access time 4.5 ns 7 ns 7 ns 8 ns 8 ns 4.5 ns 4.5 ns 4.5 ns -
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE -
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 -
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm -
memory density 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bit -
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM -
memory width 32 32 32 32 32 32 32 32 -
Number of functions 1 1 1 1 1 1 1 1 -
Number of ports 1 1 1 1 1 1 1 1 -
Number of terminals 100 100 100 100 100 100 100 100 -
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words -
character code 64000 64000 64000 64000 64000 64000 64000 64000 -
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C -
organize 64KX32 64KX32 64KX32 64KX32 64KX32 64KX32 64KX32 64KX32 -
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE -
Exportable YES YES YES YES YES YES YES YES -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE -
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm -
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V -
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V -
surface mount YES YES YES YES YES YES YES YES -
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL -
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING -
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm -
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD -
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm -
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