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MC54HC4066J

Description
QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14
CategoryAnalog mixed-signal IC    The signal circuit   
File Size176KB,12 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Related ProductsFound15parts with similar functions to MC54HC4066J
Download Datasheet Parametric Compare View All

MC54HC4066J Overview

QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14

MC54HC4066J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerON Semiconductor
Parts packaging codeDIP
package instructionDIP, DIP14,.3
Contacts14
Reach Compliance Code_compli
Analog Integrated Circuits - Other TypesSPST
JESD-30 codeR-GDIP-T14
JESD-609 codee0
length19.495 mm
normal positionNO
Number of channels4
Number of functions1
Number of terminals14
Nominal off-state isolation50 dB
On-state resistance matching specifications40 Ω
Maximum on-state resistance (Ron)255 Ω
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
outputSEPARATE OUTPUT
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply2/12 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)12 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)4.5 V
surface mountNO
Maximum disconnect time37 ns
Maximum connection time45 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad Analog Switch/
Multiplexer/Demultiplexer
MC54/74HC4066
High–Performance Silicon–Gate CMOS
The MC54/74HC4066 utilizes silicon–gate CMOS technology to achieve
fast propagation delays, low ON resistances, and low OFF–channel leakage
current. This bilateral switch/multiplexer/demultiplexer controls analog and
digital voltages that may vary across the full power–supply range (from VCC
to GND).
The HC4066 is identical in pinout to the metal–gate CMOS MC14016 and
MC14066. Each device has four independent switches. The device has
been designed so that the ON resistances (RON) are much more linear over
input voltage than RON of metal–gate CMOS analog switches.
This device is identical in both function and pinout to the HC4016. The
ON/OFF control inputs are compatible with standard CMOS outputs; with
pullup resistors, they are compatible with LSTTL outputs. For analog
switches with voltage–level translators, see the HC4316.
Fast Switching and Propagation Speeds
High ON/OFF Output Voltage Ratio
Low Crosstalk Between Switches
Diode Protection on All Inputs/Outputs
Wide Power–Supply Voltage Range (VCC – GND) = 2.0 to 12.0 Volts
Analog Input Voltage Range (VCC – GND) = 2.0 to 12.0 Volts
Improved Linearity and Lower ON Resistance over Input Voltage than
the MC14016 or MC14066 or HC4016
Low Noise
Chip Complexity: 44 FETs or 11 Equivalent Gates
14
1
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
14
1
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
14
1
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
ORDERING INFORMATION
MC54HCXXXXJ
MC74HCXXXXN
MC74HCXXXXD
MC74HCXXXXDT
Ceramic
Plastic
SOIC
TSSOP
LOGIC DIAGRAM
PIN ASSIGNMENT
XA
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VCC
A ON/OFF
CONTROL
D ON/OFF
CONTROL
XD
YD
YC
XC
XA
A ON/OFF CONTROL
XB
B ON/OFF CONTROL
XC
C ON/OFF CONTROL
XD
D ON/OFF CONTROL
1
2
YA
YA
YB
13
4
3
YB
ANALOG
OUTPUTS/INPUTS
5
8
9
XB
B ON/OFF
CONTROL
C ON/OFF
CONTROL
GND
YC
FUNCTION TABLE
6
11
10
On/Off Control
Input
YD
L
H
State of
Analog Switch
Off
On
12
ANALOG INPUTS/OUTPUTS = XA, XB, XC, XD
PIN 14 = VCC
PIN 7 = GND
10/95
©
Motorola, Inc. 1995
1
REV 6

MC54HC4066J Related Products

MC54HC4066J MC74HC4066 MC74HC4066N MC74HC4066DT MC74HC4066D MC54HC4066
Description QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14 QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP14
Number of functions 1 4 1 1 1 4
Number of terminals 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 Cel 125 °C 125 °C 125 °C 125 Cel
Minimum operating temperature -55 °C -55 Cel -55 °C -55 °C -55 °C -55 Cel
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Is it Rohs certified? incompatible - incompatible conform to incompatible -
Maker ON Semiconductor - ON Semiconductor ON Semiconductor ON Semiconductor -
Parts packaging code DIP - DIP TSSOP SOIC -
package instruction DIP, DIP14,.3 - DIP, DIP14,.3 TSSOP, TSSOP14,.25 SOP, SOP14,.25 -
Contacts 14 - 14 14 14 -
Reach Compliance Code _compli - not_compliant unknow _compli -
Analog Integrated Circuits - Other Types SPST - SPST SPST SPST -
JESD-30 code R-GDIP-T14 - R-PDIP-T14 R-PDSO-G14 R-PDSO-G14 -
JESD-609 code e0 - e0 e4 e0 -
length 19.495 mm - 18.86 mm 5 mm 8.65 mm -
normal position NO - NO NO NO -
Number of channels 4 - 4 4 4 -
Nominal off-state isolation 50 dB - 50 dB 50 dB 50 dB -
On-state resistance matching specifications 40 Ω - 40 Ω 40 Ω 40 Ω -
Maximum on-state resistance (Ron) 255 Ω - 255 Ω 255 Ω 255 Ω -
output SEPARATE OUTPUT - SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT -
Package body material CERAMIC, GLASS-SEALED - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code DIP - DIP TSSOP SOP -
Encapsulate equivalent code DIP14,.3 - DIP14,.3 TSSOP14,.25 SOP14,.25 -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR -
Package form IN-LINE - IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE -
power supply 2/12 V - 2/12 V 2/12 V 2/12 V -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified -
Maximum seat height 5.08 mm - 4.69 mm 1.2 mm 1.75 mm -
Maximum supply voltage (Vsup) 12 V - 12 V 12 V 12 V -
Minimum supply voltage (Vsup) 2 V - 2 V 2 V 2 V -
Nominal supply voltage (Vsup) 4.5 V - 4.5 V 4.5 V 4.5 V -
surface mount NO - NO YES YES -
Maximum disconnect time 37 ns - 37 ns 37 ns 37 ns -
Maximum connection time 45 ns - 45 ns 45 ns 45 ns -
switch BREAK-BEFORE-MAKE - MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK -
technology CMOS - CMOS CMOS CMOS -
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) -
Terminal pitch 2.54 mm - 2.54 mm 0.65 mm 1.27 mm -
width 7.62 mm - 7.62 mm 4.4 mm 3.9 mm -

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