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73K222L-IH

Description
1.2kbps DATA, MODEM, PQCC28, PLASTIC, LCC-28
CategoryWireless rf/communication    Telecom circuit   
File Size945KB,25 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

73K222L-IH Overview

1.2kbps DATA, MODEM, PQCC28, PLASTIC, LCC-28

73K222L-IH Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeQLCC
package instructionPLASTIC, LCC-28
Contacts28
Reach Compliance Codeunknown
Other featuresFULL DUPLEX
data rate1.2 Mbps
JESD-30 codeS-PQCC-J28
length11.5062 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum seat height4.57 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width11.5062 mm
Base Number Matches1

73K222L-IH Related Products

73K222L-IH 73K222SL-IC 73K222L-IP 73K222SL-IP
Description 1.2kbps DATA, MODEM, PQCC28, PLASTIC, LCC-28 1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22 1.2kbps DATA, MODEM, PDIP28, 0.600 INCH, PLASTIC, DIP-28 1.2kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code QLCC DIP DIP DIP
package instruction PLASTIC, LCC-28 0.400 INCH, CERDIP-22 DIP, 0.400 INCH, PLASTIC, DIP-22
Contacts 28 22 28 22
Reach Compliance Code unknown unknown unknown unknown
Other features FULL DUPLEX FULL DUPLEX FULL DUPLEX FULL DUPLEX
data rate 1.2 Mbps 1.2 Mbps 1.2 Mbps 1.2 Mbps
JESD-30 code S-PQCC-J28 R-GDIP-T22 R-PDIP-T28 R-PDIP-T22
length 11.5062 mm 27.559 mm 35.941 mm 27.686 mm
Number of functions 1 1 1 1
Number of terminals 28 22 28 22
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ DIP DIP DIP
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 5.08 mm 5.588 mm 5.08 mm
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES NO NO NO
Telecom integrated circuit types MODEM MODEM MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location QUAD DUAL DUAL DUAL
width 11.5062 mm 10.16 mm 15.24 mm 10.16 mm
Base Number Matches 1 1 1 1
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