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73K222L-IP

Description
1.2kbps DATA, MODEM, PDIP28, 0.600 INCH, PLASTIC, DIP-28
CategoryWireless rf/communication    Telecom circuit   
File Size945KB,25 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

73K222L-IP Overview

1.2kbps DATA, MODEM, PDIP28, 0.600 INCH, PLASTIC, DIP-28

73K222L-IP Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeDIP
package instructionDIP,
Contacts28
Reach Compliance Codeunknown
Other featuresFULL DUPLEX
data rate1.2 Mbps
JESD-30 codeR-PDIP-T28
length35.941 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.588 mm
Nominal supply voltage5 V
surface mountNO
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1

73K222L-IP Related Products

73K222L-IP 73K222SL-IC 73K222L-IH 73K222SL-IP
Description 1.2kbps DATA, MODEM, PDIP28, 0.600 INCH, PLASTIC, DIP-28 1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22 1.2kbps DATA, MODEM, PQCC28, PLASTIC, LCC-28 1.2kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code DIP DIP QLCC DIP
package instruction DIP, 0.400 INCH, CERDIP-22 PLASTIC, LCC-28 0.400 INCH, PLASTIC, DIP-22
Contacts 28 22 28 22
Reach Compliance Code unknown unknown unknown unknown
Other features FULL DUPLEX FULL DUPLEX FULL DUPLEX FULL DUPLEX
data rate 1.2 Mbps 1.2 Mbps 1.2 Mbps 1.2 Mbps
JESD-30 code R-PDIP-T28 R-GDIP-T22 S-PQCC-J28 R-PDIP-T22
length 35.941 mm 27.559 mm 11.5062 mm 27.686 mm
Number of functions 1 1 1 1
Number of terminals 28 22 28 22
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP QCCJ DIP
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.588 mm 5.08 mm 4.57 mm 5.08 mm
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO YES NO
Telecom integrated circuit types MODEM MODEM MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD DUAL
width 15.24 mm 10.16 mm 11.5062 mm 10.16 mm
Base Number Matches 1 1 1 1
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