73K222SL-IP datasheet, PDF - EEWORLD Datasheet

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73K222SL-IP: Description1.2kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22; CategoryWireless rf/communication Telecom circuit; File Size945KB，25 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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73K222SL-IP Overview

1.2kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22

73K222SL-IP Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	0.400 INCH, PLASTIC, DIP-22
Contacts	22
Reach Compliance Code	unknown
Other features	FULL DUPLEX
data rate	1.2 Mbps
JESD-30 code	R-PDIP-T22
length	27.686 mm
Number of functions	1
Number of terminals	22
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.08 mm
Nominal supply voltage	5 V
surface mount	NO
Telecom integrated circuit types	MODEM
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	10.16 mm
Base Number Matches	1

73K222SL-IP Related Products

	73K222SL-IP	73K222SL-IC	73K222L-IP	73K222L-IH
Description	1.2kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22	1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22	1.2kbps DATA, MODEM, PDIP28, 0.600 INCH, PLASTIC, DIP-28	1.2kbps DATA, MODEM, PQCC28, PLASTIC, LCC-28
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DIP	DIP	QLCC
package instruction	0.400 INCH, PLASTIC, DIP-22	0.400 INCH, CERDIP-22	DIP,	PLASTIC, LCC-28
Contacts	22	22	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown
Other features	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX	FULL DUPLEX
data rate	1.2 Mbps	1.2 Mbps	1.2 Mbps	1.2 Mbps
JESD-30 code	R-PDIP-T22	R-GDIP-T22	R-PDIP-T28	S-PQCC-J28
length	27.686 mm	27.559 mm	35.941 mm	11.5062 mm
Number of functions	1	1	1	1
Number of terminals	22	22	28	28
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.588 mm	4.57 mm
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES
Telecom integrated circuit types	MODEM	MODEM	MODEM	MODEM
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD
width	10.16 mm	10.16 mm	15.24 mm	11.5062 mm
Base Number Matches	1	1	1	1

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