1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | 0.400 INCH, CERDIP-22 |
| Contacts | 22 |
| Reach Compliance Code | unknown |
| Other features | FULL DUPLEX |
| data rate | 1.2 Mbps |
| JESD-30 code | R-GDIP-T22 |
| length | 27.559 mm |
| Number of functions | 1 |
| Number of terminals | 22 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| Telecom integrated circuit types | MODEM |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 10.16 mm |
| Base Number Matches | 1 |
| 73K222SL-IC | 73K222L-IP | 73K222L-IH | 73K222SL-IP | |
|---|---|---|---|---|
| Description | 1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22 | 1.2kbps DATA, MODEM, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 1.2kbps DATA, MODEM, PQCC28, PLASTIC, LCC-28 | 1.2kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | DIP | DIP | QLCC | DIP |
| package instruction | 0.400 INCH, CERDIP-22 | DIP, | PLASTIC, LCC-28 | 0.400 INCH, PLASTIC, DIP-22 |
| Contacts | 22 | 28 | 28 | 22 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Other features | FULL DUPLEX | FULL DUPLEX | FULL DUPLEX | FULL DUPLEX |
| data rate | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps |
| JESD-30 code | R-GDIP-T22 | R-PDIP-T28 | S-PQCC-J28 | R-PDIP-T22 |
| length | 27.559 mm | 35.941 mm | 11.5062 mm | 27.686 mm |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 22 | 28 | 28 | 22 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | QCCJ | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.588 mm | 4.57 mm | 5.08 mm |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO |
| Telecom integrated circuit types | MODEM | MODEM | MODEM | MODEM |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL |
| width | 10.16 mm | 15.24 mm | 11.5062 mm | 10.16 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |