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73K222SL-IC

Description
1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22
CategoryWireless rf/communication    Telecom circuit   
File Size945KB,25 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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73K222SL-IC Overview

1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22

73K222SL-IC Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeDIP
package instruction0.400 INCH, CERDIP-22
Contacts22
Reach Compliance Codeunknown
Other featuresFULL DUPLEX
data rate1.2 Mbps
JESD-30 codeR-GDIP-T22
length27.559 mm
Number of functions1
Number of terminals22
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.08 mm
Nominal supply voltage5 V
surface mountNO
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width10.16 mm
Base Number Matches1

73K222SL-IC Related Products

73K222SL-IC 73K222L-IP 73K222L-IH 73K222SL-IP
Description 1.2kbps DATA, MODEM, CDIP22, 0.400 INCH, CERDIP-22 1.2kbps DATA, MODEM, PDIP28, 0.600 INCH, PLASTIC, DIP-28 1.2kbps DATA, MODEM, PQCC28, PLASTIC, LCC-28 1.2kbps DATA, MODEM, PDIP22, 0.400 INCH, PLASTIC, DIP-22
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code DIP DIP QLCC DIP
package instruction 0.400 INCH, CERDIP-22 DIP, PLASTIC, LCC-28 0.400 INCH, PLASTIC, DIP-22
Contacts 22 28 28 22
Reach Compliance Code unknown unknown unknown unknown
Other features FULL DUPLEX FULL DUPLEX FULL DUPLEX FULL DUPLEX
data rate 1.2 Mbps 1.2 Mbps 1.2 Mbps 1.2 Mbps
JESD-30 code R-GDIP-T22 R-PDIP-T28 S-PQCC-J28 R-PDIP-T22
length 27.559 mm 35.941 mm 11.5062 mm 27.686 mm
Number of functions 1 1 1 1
Number of terminals 22 28 28 22
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP QCCJ DIP
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.588 mm 4.57 mm 5.08 mm
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO YES NO
Telecom integrated circuit types MODEM MODEM MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD DUAL
width 10.16 mm 15.24 mm 11.5062 mm 10.16 mm
Base Number Matches 1 1 1 1

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