MASK ROM, 2MX8, 250ns, CMOS, PDIP42, PLASTIC, DIP-42
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP42,.6 |
| Contacts | 42 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 250 ns |
| Spare memory width | 16 |
| JESD-30 code | R-PDIP-T42 |
| JESD-609 code | e0 |
| length | 52.8 mm |
| memory density | 16777216 bi |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 42 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP42,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 3.5/5.5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.065 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 3.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |

| HN624116P-25L | HN624116FB-25L | HN624116F-25L | HN624116F-30L | HN624116FB-30L | HN624116P-30L | |
|---|---|---|---|---|---|---|
| Description | MASK ROM, 2MX8, 250ns, CMOS, PDIP42, PLASTIC, DIP-42 | MASK ROM, 2MX8, 250ns, CMOS, PDSO44, PLASTIC, SOP-44 | MASK ROM, 2MX8, 250ns, CMOS, PDSO48, PLASTIC, SOP-48 | MASK ROM, 2MX8, 300ns, CMOS, PDSO48, PLASTIC, SOP-48 | MASK ROM, 2MX8, 300ns, CMOS, PDSO44, PLASTIC, SOP-44 | MASK ROM, 2MX8, 300ns, CMOS, PDIP42, PLASTIC, DIP-42 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | SOIC | SOIC | SOIC | SOIC | DIP |
| package instruction | DIP, DIP42,.6 | SOP, SOP44,.63 | SSOP, SOP48,.61,32 | SSOP, SOP48,.61,32 | SOP, SOP44,.63 | DIP, DIP42,.6 |
| Contacts | 42 | 44 | 48 | 48 | 44 | 42 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 250 ns | 250 ns | 250 ns | 300 ns | 300 ns | 300 ns |
| Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 code | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G44 | R-PDIP-T42 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 52.8 mm | 28.5 mm | 20 mm | 20 mm | 28.5 mm | 52.8 mm |
| memory density | 16777216 bi | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 42 | 44 | 48 | 48 | 44 | 42 |
| word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SSOP | SSOP | SOP | DIP |
| Encapsulate equivalent code | DIP42,.6 | SOP44,.63 | SOP48,.61,32 | SOP48,.61,32 | SOP44,.63 | DIP42,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 3.5/5.5 V | 3.5/5.5 V | 3.5/5.5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 3.22 mm | 3 mm | 3 mm | 3.22 mm | 5.08 mm |
| Maximum standby current | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A |
| Maximum slew rate | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA | 0.065 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 3.5 V | 3.5 V | 3.5 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 12.6 mm | 14 mm | 14 mm | 12.6 mm | 15.24 mm |
| Maker | - | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |