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HPMX-5002-TR1

Description
IF Modulator/Demodulator IC
CategoryWireless rf/communication    Telecom circuit   
File Size140KB,14 Pages
ManufacturerHP(Keysight)
Websitehttp://www.semiconductor.agilent.com/
Download Datasheet Parametric Compare View All

HPMX-5002-TR1 Overview

IF Modulator/Demodulator IC

HPMX-5002-TR1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHP(Keysight)
Parts packaging codeQFP
package instructionLFQFP, QFP48,.35SQ,20
Contacts48
Reach Compliance Codeunknow
JESD-30 codeS-PQFP-G48
JESD-609 codee0
length7 mm
Number of functions1
Number of terminals48
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP48,.35SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum slew rate0.027 mA
Nominal supply voltage3 V
surface mountYES
technologyBIPOLAR
Telecom integrated circuit typesCORDLESS TELEPHONE BASEBAND CIRCUIT
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width7 mm
IF Modulator/Demodulator IC
Technical Data
HPMX-5002
Features
• Use with HPMX-5001
Up/Down Converter Chip
for DECT Telephone
Applications
• 2.7– 5.5 V Single Supply
Voltage
• >75 dB RSSI Range
• Internal Data Slicer
• On-chip LO Generation,
Including VCO, Prescalers
and Phase/ Frequency
Detector
• Flexible Chip Biasing,
Including Standby Mode
• Supports Reference Crystal
Frequencies of 9, 12, and 16
Times the DECT Bit Rate
(1.152 MHz)
• IF Input Frequency Range
up to 250 MHz
• TQFP-48 Surface Mount
Package
Plastic TQFP-48 Package
Description
The Hewlett-Packard HPMX-5002
IF Modulator/Demodulator
provides all of the active compo-
nents necessary for the demodula-
tion of a downconverted DECT
signal. Designed specifically for
DECT, the HPMX-5002 contains a
down-conversion mixer (to a 2nd
IF), limiting amplifier chain,
discriminator/data slicer, lock
detector, and RSSI circuits. The
LO2 generation is also included
on-chip, via a VCO, dividers, and
phase/frequency detector. The
divide ratios are programmable to
support reference frequencies of
either 9, 12, or 16 times the DECT
bit rate of 1.152 MHz allowing the
use of common, low cost crystals.
The LO2 VCO can also be utilized in
transmit mode by directly modulat-
ing the external VCO tank. An AGC
loop in the buffered VCO output
suppresses harmonics and reduces
signal level variability.
The HPMX-5002 is designed to meet
the size and power demands of
portable applications. Battery cell
count and cost are reduced due to
the 2.7 V minimum supply voltage.
The TQFP-48 package, combined
with the high level of integration,
means smaller footprints and fewer
components. Flexible chip biasing
takes full advantage of the power
savings inherent in time-duplexed
systems such as DECT.
5965-9106E
X
HPM3
943
5
643
0
– 50
2
019
Pin Configuration
48
1
37
36
HPMX–5002
9433
6435
12
13
019
25
24
Applications
• DECT, Unlicensed PCS and
ISM Band Handsets,
Basestations and Wireless
LANs
7-105

HPMX-5002-TR1 Related Products

HPMX-5002-TR1 HPMX-5002 HPMX-5002-STR HPMX-5002-TY1
Description IF Modulator/Demodulator IC IF Modulator/Demodulator IC IF Modulator/Demodulator IC IF Modulator/Demodulator IC
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker HP(Keysight) HP(Keysight) HP(Keysight) HP(Keysight)
package instruction LFQFP, QFP48,.35SQ,20 QFP, QFP48,.35SQ,20 LFQFP, QFP48,.35SQ,20 LFQFP, QFP48,.35SQ,20
Reach Compliance Code unknow unknow unknow unknow
JESD-30 code S-PQFP-G48 S-PQFP-G48 S-PQFP-G48 S-PQFP-G48
JESD-609 code e0 e0 e0 e0
Number of terminals 48 48 48 48
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP QFP LFQFP LFQFP
Encapsulate equivalent code QFP48,.35SQ,20 QFP48,.35SQ,20 QFP48,.35SQ,20 QFP48,.35SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
power supply 3/5 V 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.027 mA 0.027 mA 0.027 mA 0.027 mA
surface mount YES YES YES YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD
Parts packaging code QFP - QFP QFP
Contacts 48 - 48 48
length 7 mm - 7 mm 7 mm
Number of functions 1 - 1 1
Maximum seat height 1.6 mm - 1.6 mm 1.6 mm
Nominal supply voltage 3 V - 3 V 3 V
Telecom integrated circuit types CORDLESS TELEPHONE BASEBAND CIRCUIT - CORDLESS TELEPHONE BASEBAND CIRCUIT CORDLESS TELEPHONE BASEBAND CIRCUIT
width 7 mm - 7 mm 7 mm
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