HPMX-5002-TY1 datasheet, PDF - EEWORLD Datasheet

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HPMX-5002-TY1: DescriptionIF Modulator/Demodulator IC; CategoryWireless rf/communication Telecom circuit; File Size140KB，14 Pages; ManufacturerHP（Keysight）; Websitehttp://www.semiconductor.agilent.com/

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HPMX-5002-TY1 Overview

IF Modulator/Demodulator IC

HPMX-5002-TY1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	HP（Keysight）
Parts packaging code	QFP
package instruction	LFQFP, QFP48,.35SQ,20
Contacts	48
Reach Compliance Code	unknow
JESD-30 code	S-PQFP-G48
JESD-609 code	e0
length	7 mm
Number of functions	1
Number of terminals	48
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP48,.35SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum slew rate	0.027 mA
Nominal supply voltage	3 V
surface mount	YES
technology	BIPOLAR
Telecom integrated circuit types	CORDLESS TELEPHONE BASEBAND CIRCUIT
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	7 mm

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IF Modulator/Demodulator IC

Technical Data

HPMX-5002

Features

• Use with HPMX-5001

Up/Down Converter Chip

for DECT Telephone

Applications

• 2.7– 5.5 V Single Supply

Voltage

• >75 dB RSSI Range

• Internal Data Slicer

• On-chip LO Generation,

Including VCO, Prescalers

and Phase/ Frequency

Detector

• Flexible Chip Biasing,

Including Standby Mode

• Supports Reference Crystal

Frequencies of 9, 12, and 16

Times the DECT Bit Rate

(1.152 MHz)

• IF Input Frequency Range

up to 250 MHz

• TQFP-48 Surface Mount

Package

Plastic TQFP-48 Package

Description

The Hewlett-Packard HPMX-5002

IF Modulator/Demodulator

provides all of the active compo-

nents necessary for the demodula-

tion of a downconverted DECT

signal. Designed specifically for

DECT, the HPMX-5002 contains a

down-conversion mixer (to a 2nd

IF), limiting amplifier chain,

discriminator/data slicer, lock

detector, and RSSI circuits. The

LO2 generation is also included

on-chip, via a VCO, dividers, and

phase/frequency detector. The

divide ratios are programmable to

support reference frequencies of

either 9, 12, or 16 times the DECT

bit rate of 1.152 MHz allowing the

use of common, low cost crystals.

The LO2 VCO can also be utilized in

transmit mode by directly modulat-

ing the external VCO tank. An AGC

loop in the buffered VCO output

suppresses harmonics and reduces

signal level variability.

The HPMX-5002 is designed to meet

the size and power demands of

portable applications. Battery cell

count and cost are reduced due to

the 2.7 V minimum supply voltage.

The TQFP-48 package, combined

with the high level of integration,

means smaller footprints and fewer

components. Flexible chip biasing

takes full advantage of the power

savings inherent in time-duplexed

systems such as DECT.

5965-9106E

HPM3

943

643

– 50

019

Pin Configuration

HPMX–5002

9433

6435

019

Applications

• DECT, Unlicensed PCS and

ISM Band Handsets,

Basestations and Wireless

LANs

7-105

HPMX-5002-TY1 Related Products

	HPMX-5002-TY1	HPMX-5002	HPMX-5002-STR	HPMX-5002-TR1
Description	IF Modulator/Demodulator IC	IF Modulator/Demodulator IC	IF Modulator/Demodulator IC	IF Modulator/Demodulator IC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	HP（Keysight）	HP（Keysight）	HP（Keysight）	HP（Keysight）
package instruction	LFQFP, QFP48,.35SQ,20	QFP, QFP48,.35SQ,20	LFQFP, QFP48,.35SQ,20	LFQFP, QFP48,.35SQ,20
Reach Compliance Code	unknow	unknow	unknow	unknow
JESD-30 code	S-PQFP-G48	S-PQFP-G48	S-PQFP-G48	S-PQFP-G48
JESD-609 code	e0	e0	e0	e0
Number of terminals	48	48	48	48
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	QFP	LFQFP	LFQFP
Encapsulate equivalent code	QFP48,.35SQ,20	QFP48,.35SQ,20	QFP48,.35SQ,20	QFP48,.35SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
power supply	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.027 mA	0.027 mA	0.027 mA	0.027 mA
surface mount	YES	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Parts packaging code	QFP	-	QFP	QFP
Contacts	48	-	48	48
length	7 mm	-	7 mm	7 mm
Number of functions	1	-	1	1
Maximum seat height	1.6 mm	-	1.6 mm	1.6 mm
Nominal supply voltage	3 V	-	3 V	3 V
Telecom integrated circuit types	CORDLESS TELEPHONE BASEBAND CIRCUIT	-	CORDLESS TELEPHONE BASEBAND CIRCUIT	CORDLESS TELEPHONE BASEBAND CIRCUIT
width	7 mm	-	7 mm	7 mm

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