K5A3380YBC-T755 datasheet, PDF

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K5A3380YBC-T755: DescriptionMCP MEMORY; Categorystorage storage; File Size619KB，45 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K5A3380YBC-T755 Overview

MCP MEMORY

K5A3380YBC-T755 Parametric

Parameter Name	Attribute value
Maker	SAMSUNG
package instruction	FBGA, BGA69,10X10,32
Reach Compliance Code	compli
Maximum access time	70 ns
JESD-30 code	S-PBGA-B69
Memory IC Type	MEMORY CIRCUIT
Mixed memory types	FLASH+SRAM
Number of terminals	69
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA69,10X10,32
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	3 V
Certification status	Not Qualified
Maximum standby current	0.000015 A
Maximum slew rate	0.05 mA
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM

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K5A3x80YT(B)C

Document Title

Multi-Chip Package MEMORY

Preliminary

MCP MEMORY

32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 8M(1Mx8/512Kx16) Full CMOS SRAM

Revision History

Revision No. History

0.0

Initial Draft

Draft Date

November 6, 2002

Remark

Preliminary

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and

products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.

-1-

Revision 0.0

November 2002

K5A3380YBC-T755 Related Products

	K5A3380YBC-T755	K5A3280YBC-T755	K5A3280YBC-T855	K5A3280YTC-T755	K5A3280YTC-T855	K5A3380YBC-T855	K5A3380YTC-T755	K5A3380YTC-T855	K5A3X80YTC
Description	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	-
package instruction	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	-
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli	-
Maximum access time	70 ns	70 ns	80 ns	70 ns	80 ns	80 ns	70 ns	80 ns	-
JESD-30 code	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	-
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	-
Mixed memory types	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	-
Number of terminals	69	69	69	69	69	69	69	69	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	FBGA	FBGA	FBGA	FBGA	FBGA	FBGA	FBGA	FBGA	-
Encapsulate equivalent code	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	-
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	-
power supply	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum standby current	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	-
Maximum slew rate	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	-
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	-
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	-
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-

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