K5A3X80YTC datasheet, PDF - EEWORLD Datasheet

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K5A3X80YTC: DescriptionMCP MEMORY; File Size619KB，45 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K5A3X80YTC Overview

MCP MEMORY

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K5A3x80YT(B)C

Document Title

Multi-Chip Package MEMORY

Preliminary

MCP MEMORY

32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 8M(1Mx8/512Kx16) Full CMOS SRAM

Revision History

Revision No. History

0.0

Initial Draft

Draft Date

November 6, 2002

Remark

Preliminary

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and

products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.

-1-

Revision 0.0

November 2002

K5A3X80YTC Related Products

	K5A3X80YTC	K5A3280YBC-T755	K5A3280YBC-T855	K5A3280YTC-T755	K5A3280YTC-T855	K5A3380YBC-T755	K5A3380YBC-T855	K5A3380YTC-T755	K5A3380YTC-T855
Description	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY	MCP MEMORY
Maker	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
package instruction	-	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32	FBGA, BGA69,10X10,32
Reach Compliance Code	-	compli	compli	compli	compli	compli	compli	compli	compli
Maximum access time	-	70 ns	80 ns	70 ns	80 ns	70 ns	80 ns	70 ns	80 ns
JESD-30 code	-	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69	S-PBGA-B69
Memory IC Type	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
Mixed memory types	-	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM
Number of terminals	-	69	69	69	69	69	69	69	69
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	FBGA	FBGA	FBGA	FBGA	FBGA	FBGA	FBGA	FBGA
Encapsulate equivalent code	-	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32
Package shape	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
power supply	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	-	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A
Maximum slew rate	-	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Nominal supply voltage (Vsup)	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM

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