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AT25F1024

Description
128K X 8 SPI BUS SERIAL EEPROM, PDSO8
Categorystorage   
File Size248KB,18 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

AT25F1024 Overview

128K X 8 SPI BUS SERIAL EEPROM, PDSO8

AT25F1024 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals8
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage2.7 V
Rated supply voltage3 V
maximum clock frequency20 MHz
Processing package description0.150 INCH, Plastic, MS-012AA, SOIC-8
stateDISCONTINUED
CraftsmanshipCMOS
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal spacing1.27 mm
terminal coatingtin lead
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
memory width8
organize128K × 8
storage density1.05E6 deg
operating modeSynchronize
Number of digits131072 words
Number of digits128K
Memory IC typebus serial electrically erasable read-only memory
serial parallelserial
Maximum TWC of write cycle10 ms
Features
Serial Peripheral Interface (SPI) Compatible
Supports SPI Modes 0 (0,0) and 3 (1,1)
20 MHz Clock Rate
Byte Mode and 256-byte Page Mode for Program Operations
Sector Architecture:
– Two Sectors with 32K Bytes Each (512K)
– Four Sectors with 32K Bytes Each (1M)
– 128 Pages per Sector
Product Identification Mode
Low-voltage Operation
– 2.7 (V
CC
= 2.7V to 3.6V)
Sector Write Protection
Write Protect (WP) Pin and Write Disable Instructions for
both Hardware and Software Data Protection
Self-timed Program Cycle (60 µs/Byte Typical)
Self-timed Sector Erase Cycle (1 second/Sector Typical)
Single Cycle Reprogramming (Erase and Program) for Status Register
High Reliability
– Endurance: 10,000 Write Cycles Typical
Lead-free Devices Available
8-lead JEDEC SOIC and 8-lead SAP Packages
SPI Serial
Memory
512K (65,536 x 8)
1M (131,072 x 8)
Description
The AT25F512/1024 provides 524,288/1,048,576 bits of serial reprogrammable Flash
memory organized as 65,536/131,072 words of 8 bits each. The device is optimized
for use in many industrial and commercial applications where low-power and low-volt-
age operation are essential. The AT25F512/1024 is available in a space-saving 8-lead
JEDEC SOIC and 8-lead SAP packages.
The AT25F512/1024 is enabled through the Chip Select pin (CS) and accessed via a
3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO), and
Serial Clock (SCK). All write cycles are completely self-timed.
BLOCK WRITE protection for top 1/4, top 1/2 or the entire memory array (1M) or
entire memory array (512K) is enabled by programming the status register. Separate
write enable and write disable instructions are provided for additional data protection.
Hardware data protection is provided via the WP pin to protect against inadvertent
write attempts to the status register. The HOLD pin may be used to suspend any serial
communication without resetting the serial sequence.
AT25F512
AT25F1024
Pin Configurations
Pin Name
CS
SCK
SI
SO
GND
VCC
WP
HOLD
Function
Chip Select
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
Power Supply
Write Protect
Suspends Serial Input
VCC
HOLD
SCK
SI
CS
SO
WP
GND
8-lead SOIC
1
2
3
4
8
7
6
5
VCC
HOLD
SCK
SI
8-lead SAP
8
7
6
5
1
2
3
4
CS
SO
WP
GND
Bottom View
Rev. 1440P–SEEPR–6/04
1

AT25F1024 Related Products

AT25F1024 AT25F512_04 AT25F512 AT25F512N-10SI-2.7 AT25F512Y4-10YU-2.7 AT25F512N-10SU-2.7 AT25F1024Y4-10YU-2.7 AT25F1024N-10SU-2.7 AT25F1024N-10SI-2.7
Description 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8 128K X 8 SPI BUS SERIAL EEPROM, PDSO8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8 8 8
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
surface mount Yes Yes Yes YES YES YES YES YES YES
Terminal form GULL WING GULL WING GULL WING GULL WING NO LEAD GULL WING NO LEAD GULL WING GULL WING
Terminal location pair pair pair DUAL DUAL DUAL DUAL DUAL DUAL
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 8 8 8 8 8 8 8 8 8
organize 128K × 8 128K × 8 128K × 8 64KX8 64KX8 64KX8 128KX8 128KX8 128KX8
Is it lead-free? - - - Contains lead Lead free Lead free - Lead free Contains lead
Is it Rohs certified? - - - incompatible conform to conform to conform to conform to incompatible
Parts packaging code - - - SOIC SOIC SOIC SOIC SOIC SOIC
package instruction - - - 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 HVSON, SOLCC8,.25 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 HVSON, SOLCC8,.25 0.150 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-012AA, SOIC-8 SOP, SOP8,.25
Contacts - - - 8 8 8 8 8 8
Reach Compliance Code - - - unknow compliant unknown compliant unknow unknow
ECCN code - - - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) - - - 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Durability - - - 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 code - - - R-PDSO-G8 R-XDSO-N8 R-PDSO-G8 R-XDSO-N8 R-PDSO-G8 R-PDSO-G8
JESD-609 code - - - e0 e4 e3 e4 e3 e0
length - - - 4.9 mm 6 mm 4.9 mm 6 mm 4.9 mm 4.9 mm
memory density - - - 524288 bi 524288 bit 524288 bit 1048576 bit 1048576 bi 1048576 bi
Memory IC Type - - - FLASH FLASH FLASH FLASH FLASH FLASH
Humidity sensitivity level - - - 1 3 1 3 1 1
word count - - - 65536 words 65536 words 65536 words 131072 words 131072 words 131072 words
character code - - - 64000 64000 64000 128000 128000 128000
Operating mode - - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Package body material - - - PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - - SOP HVSON SOP HVSON SOP SOP
Encapsulate equivalent code - - - SOP8,.25 SOLCC8,.25 SOP8,.25 SOLCC8,.25 SOP8,.25 SOP8,.25
Package shape - - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - - SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial - - - SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) - - - 240 260 260 260 260 240
power supply - - - 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage - - - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Certification status - - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - - - 1.75 mm 0.9 mm 1.75 mm 0.9 mm 1.75 mm 1.75 mm
Serial bus type - - - SPI SPI SPI SPI SPI SPI
Maximum standby current - - - 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate - - - 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) - - - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - - - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) - - - 3 V 3 V 3 V 3 V 3 V 3 V
technology - - - CMOS CMOS CMOS CMOS CMOS CMOS
Terminal surface - - - Tin/Lead (Sn/Pb) Gold (Au) - with Nickel (Ni) barrier Matte Tin (Sn) Gold (Au) - with Nickel (Ni) barrier Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal pitch - - - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Maximum time at peak reflow temperature - - - 30 40 40 40 40 30
type - - - NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width - - - 3.9 mm 4.9 mm 3.9 mm 4.9 mm 3.9 mm 3.9 mm
write protect - - - HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches - - - - 1 1 1 1 1

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