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71V2546S133BGI8

Description
PBGA-119, Reel
Categorystorage   
File Size251KB,22 Pages
ManufacturerIDT (Integrated Device Technology)
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71V2546S133BGI8 Overview

PBGA-119, Reel

71V2546S133BGI8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codePBGA
package instructionBGA, BGA119,7X17,50
Contacts119
Manufacturer packaging codeBG119
Reach Compliance Codenot_compliant
ECCN code3A991.B.2.A
Samacsys DescriptionPBGA 14. X 22.0 MM X 1.27 MM PITCH
Maximum access time4.2 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
JESD-609 codee0
length22 mm
memory density4718592 bit
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals119
word count131072 words
character code128000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature-40 °C
organize128KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply2.5,3.3 V
Certification statusNot Qualified
Maximum seat height2.36 mm
Maximum standby current0.045 A
Minimum standby current3.14 V
Maximum slew rate0.31 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature20
width14 mm
Base Number Matches1
128K x 36
3.3V Synchronous ZBT™ SRAM
2.5V I/O, Burst Counter
Pipelined Outputs
71V2546S
Features
128K x 36 memory configurations
Supports high performance system speed - 150 MHz
(3.8 ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read
cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
Three chip enables for simple depth expansion
3.3V power supply (±5%), 2.5V I/O Supply (V
DDQ)
Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP) and 119 ball grid array (BGA)
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
LBO
Address A [0:16]
CE1,
CE,
CE2
R/W
CEN
ADV/LD
BWx
D
Clk
D
Q
Control
D
Q
128Kx36 BIT
MEMORY ARRAY
Address
Input Register
DI
DO
Q
Control Logic
Mux
Sel
D
Clk
Clock
Output Register
Q
OE
Gate
5294 drw 01a
Data I/O [0:31],
I/O P[1:4]
ZBT and ZeroBus Turnaround are trademarks of Renesas and the architecture is supported by Micron Technology and Motorola Inc.
1
Aug.12.20

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Description PBGA-119, Reel TQFP-100, Tray PBGA-119, Reel PBGA-119, Tray PBGA-119, Tray PBGA-119, Tray PBGA-119, Reel PBGA-119, Tray PBGA-119, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Lead free Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible conform to incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code PBGA TQFP PBGA PBGA PBGA PBGA PBGA PBGA PBGA
package instruction BGA, BGA119,7X17,50 LQFP, QFP100,.63X.87 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50 BGA, BGA119,7X17,50
Contacts 119 100 119 119 119 119 119 119 119
Manufacturer packaging code BG119 PKG100 BG119 BG119 BG119 BG119 BG119 BG119 BG119
Reach Compliance Code not_compliant compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 4.2 ns 3.8 ns 3.8 ns 4.2 ns 5 ns 5 ns 5 ns 3.8 ns 4.2 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK) 133 MHz 150 MHz 150 MHz 133 MHz 100 MHz 100 MHz 100 MHz 150 MHz 133 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B119 R-PQFP-G100 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 R-PBGA-B119
JESD-609 code e0 e3 e0 e0 e0 e0 e0 e0 e0
length 22 mm 20 mm 22 mm 22 mm 22 mm 22 mm 22 mm 22 mm 22 mm
memory density 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 36 36 36 36 36 36 36 36 36
Humidity sensitivity level 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 119 100 119 119 119 119 119 119 119
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Minimum operating temperature -40 °C - - -40 °C -40 °C -40 °C - - -40 °C
organize 128KX36 128KX36 128KX36 128KX36 128KX36 128KX36 128KX36 128KX36 128KX36
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA LQFP BGA BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA119,7X17,50 QFP100,.63X.87 BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50 BGA119,7X17,50
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 260 225 225 225 225 225 225 225
power supply 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V 2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.36 mm 1.6 mm 2.36 mm 2.36 mm 2.36 mm 2.36 mm 2.36 mm 2.36 mm 2.36 mm
Maximum standby current 0.045 A 0.04 A 0.04 A 0.045 A 0.045 A 0.04 A 0.04 A 0.04 A 0.04 A
Minimum standby current 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
Maximum slew rate 0.31 mA 0.325 mA 0.325 mA 0.31 mA 0.26 mA 0.25 mA 0.25 mA 0.325 mA 0.3 mA
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER COMMERCIAL COMMERCIAL OTHER OTHER OTHER COMMERCIAL COMMERCIAL OTHER
Terminal surface Tin/Lead (Sn63Pb37) Matte Tin (Sn) - annealed Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal form BALL GULL WING BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 0.65 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM QUAD BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 20 30 20 20 20 20 20 20 20
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Samacsys Description PBGA 14. X 22.0 MM X 1.27 MM PITCH TQFP 14.0 X 20.0 X 1.4 MM - - PBGA 14. X 22.0 MM X 1.27 MM PITCH PBGA 14. X 22.0 MM X 1.27 MM PITCH PBGA 14. X 22.0 MM X 1.27 MM PITCH PBGA 14. X 22.0 MM X 1.27 MM PITCH PBGA 14. X 22.0 MM X 1.27 MM PITCH
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