Standard SRAM, 2KX8, 200ns, CMOS, CDIP24, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Maker | Harris |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 200 ns |
| Other features | TTL COMPATIBLE |
| JESD-30 code | R-GDIP-T24 |
| memory density | 16384 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.72 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 8403601JX | 8403607ZA | 8403607ZX | HM4-6516/883 | 8403601JA | 8403601ZX | |
|---|---|---|---|---|---|---|
| Description | Standard SRAM, 2KX8, 200ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 2KX8, 120ns, CMOS, CQCC32, CERAMIC, CC-32 | Standard SRAM, 2KX8, 120ns, CMOS, CQCC32, CERAMIC, CC-32 | Standard SRAM, 2KX8, 200ns, CMOS, CQCC32 | Standard SRAM, 2KX8, 200ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 2KX8, 200ns, CMOS, CQCC32, CERAMIC, CC-32 |
| package instruction | DIP, | QCCN, | QCCN, | QCCN, LCC32,.45X.55 | DIP, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 200 ns | 120 ns | 120 ns | 200 ns | 200 ns | 200 ns |
| Other features | TTL COMPATIBLE | TTL COMPATIBLE | TTL COMPATIBLE | ADDRESS LATCH | TTL COMPATIBLE | TTL COMPATIBLE |
| JESD-30 code | R-GDIP-T24 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-GDIP-T24 | R-CQCC-N32 |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 32 | 32 | 32 | 24 | 32 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | QCCN | QCCN | QCCN | DIP | QCCN |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD |
| Maker | Harris | Harris | Harris | - | Harris | Harris |
| Maximum seat height | 5.72 mm | 3.05 mm | 3.05 mm | - | 5.72 mm | 3.05 mm |
| width | 15.24 mm | 11.43 mm | 11.43 mm | - | 15.24 mm | 11.43 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |