CMOS 4-BIT MICROCONTROLLER
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIP |
| package instruction | AWSDIP, |
| Contacts | 64 |
| Reach Compliance Code | unknow |
| Address bus width | 13 |
| External data bus width | 8 |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| length | 57.5 mm |
| Number of terminals | 64 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | AWSDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH |
| Certification status | Not Qualified |
| ROM programmability | UVPROM |
| Maximum seat height | 7.07 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.778 mm |
| Terminal location | DUAL |
| width | 19.05 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| TMP47C060E | TMP47C860N | TMP47C860F | TMP47C660F | TMP47C660N | TMP47C660 | |
|---|---|---|---|---|---|---|
| Description | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER | CMOS 4-BIT MICROCONTROLLER |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | - |
| Parts packaging code | DIP | DIP | QFP | QFP | DIP | - |
| package instruction | AWSDIP, | SDIP, | QFP, | QFP, | SDIP, | - |
| Contacts | 64 | 64 | 64 | 64 | 64 | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | - |
| JESD-30 code | R-PDIP-T64 | R-PDIP-T64 | S-PQFP-G64 | S-PQFP-G64 | R-PDIP-T64 | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - |
| length | 57.5 mm | 57.5 mm | 14 mm | 14 mm | 57.5 mm | - |
| Number of terminals | 64 | 64 | 64 | 64 | 64 | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | AWSDIP | SDIP | QFP | QFP | SDIP | - |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | - |
| Package form | IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK | FLATPACK | IN-LINE, SHRINK PITCH | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| ROM programmability | UVPROM | MROM | MROM | MROM | MROM | - |
| Maximum seat height | 7.07 mm | 5 mm | 3.15 mm | 3.15 mm | 5 mm | - |
| surface mount | NO | NO | YES | YES | NO | - |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | - |
| Terminal pitch | 1.778 mm | 1.778 mm | 0.8 mm | 0.8 mm | 1.778 mm | - |
| Terminal location | DUAL | DUAL | QUAD | QUAD | DUAL | - |
| width | 19.05 mm | 19.05 mm | 14 mm | 14 mm | 19.05 mm | - |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - |
| Has ADC | - | YES | YES | YES | YES | - |
| Number of I/O lines | - | 56 | 56 | 56 | 56 | - |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C | - |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| Maximum supply voltage | - | 6 V | 6 V | 6 V | 6 V | - |
| Minimum supply voltage | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| Temperature level | - | OTHER | OTHER | OTHER | OTHER | - |
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