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TMP47C660N

Description
CMOS 4-BIT MICROCONTROLLER
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,59 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TMP47C660N Overview

CMOS 4-BIT MICROCONTROLLER

TMP47C660N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeDIP
package instructionSDIP,
Contacts64
Reach Compliance Codeunknow
Has ADCYES
Address bus width
bit size4
maximum clock frequency6 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDIP-T64
JESD-609 codee0
length57.5 mm
Number of I/O lines56
Number of terminals64
Maximum operating temperature70 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeSDIP
Package shapeRECTANGULAR
Package formIN-LINE, SHRINK PITCH
Certification statusNot Qualified
ROM programmabilityMROM
Maximum seat height5 mm
Maximum slew rate6 mA
Maximum supply voltage6 V
Minimum supply voltage4.5 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch1.778 mm
Terminal locationDUAL
width19.05 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

TMP47C660N Related Products

TMP47C660N TMP47C060E TMP47C860N TMP47C860F TMP47C660F TMP47C660
Description CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible -
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor -
Parts packaging code DIP DIP DIP QFP QFP -
package instruction SDIP, AWSDIP, SDIP, QFP, QFP, -
Contacts 64 64 64 64 64 -
Reach Compliance Code unknow unknow unknow unknow unknow -
Has ADC YES - YES YES YES -
JESD-30 code R-PDIP-T64 R-PDIP-T64 R-PDIP-T64 S-PQFP-G64 S-PQFP-G64 -
JESD-609 code e0 e0 e0 e0 e0 -
length 57.5 mm 57.5 mm 57.5 mm 14 mm 14 mm -
Number of I/O lines 56 - 56 56 56 -
Number of terminals 64 64 64 64 64 -
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C -
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SDIP AWSDIP SDIP QFP QFP -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE -
Package form IN-LINE, SHRINK PITCH IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH IN-LINE, SHRINK PITCH FLATPACK FLATPACK -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
ROM programmability MROM UVPROM MROM MROM MROM -
Maximum seat height 5 mm 7.07 mm 5 mm 3.15 mm 3.15 mm -
Maximum supply voltage 6 V - 6 V 6 V 6 V -
Minimum supply voltage 4.5 V - 4.5 V 4.5 V 4.5 V -
surface mount NO NO NO YES YES -
technology CMOS CMOS CMOS CMOS CMOS -
Temperature level OTHER - OTHER OTHER OTHER -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING -
Terminal pitch 1.778 mm 1.778 mm 1.778 mm 0.8 mm 0.8 mm -
Terminal location DUAL DUAL DUAL QUAD QUAD -
width 19.05 mm 19.05 mm 19.05 mm 14 mm 14 mm -
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER -
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