TMP47C860N datasheet, PDF - EEWORLD Datasheet

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TMP47C860N: DescriptionCMOS 4-BIT MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，59 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMP47C860N Overview

CMOS 4-BIT MICROCONTROLLER

TMP47C860N Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Objectid	1419965431
Parts packaging code	DIP
package instruction	SDIP,
Contacts	64
Reach Compliance Code	unknow
compound_id	11073026
Has ADC	YES
Address bus width
bit size	4
maximum clock frequency	6 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T64
JESD-609 code	e0
length	57.5 mm
Number of I/O lines	56
Number of terminals	64
Maximum operating temperature	70 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	5 mm
Maximum slew rate	6 mA
Maximum supply voltage	6 V
Minimum supply voltage	4.5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
width	19.05 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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TMP47C860N Related Products

	TMP47C860N	TMP47C060E	TMP47C860F	TMP47C660F	TMP47C660N	TMP47C660
Description	CMOS 4-BIT MICROCONTROLLER	CMOS 4-BIT MICROCONTROLLER	CMOS 4-BIT MICROCONTROLLER	CMOS 4-BIT MICROCONTROLLER	CMOS 4-BIT MICROCONTROLLER	CMOS 4-BIT MICROCONTROLLER
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	-
Maker	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor	-
Parts packaging code	DIP	DIP	QFP	QFP	DIP	-
package instruction	SDIP,	AWSDIP,	QFP,	QFP,	SDIP,	-
Contacts	64	64	64	64	64	-
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	-
Has ADC	YES	-	YES	YES	YES	-
JESD-30 code	R-PDIP-T64	R-PDIP-T64	S-PQFP-G64	S-PQFP-G64	R-PDIP-T64	-
JESD-609 code	e0	e0	e0	e0	e0	-
length	57.5 mm	57.5 mm	14 mm	14 mm	57.5 mm	-
Number of I/O lines	56	-	56	56	56	-
Number of terminals	64	64	64	64	64	-
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	-
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	SDIP	AWSDIP	QFP	QFP	SDIP	-
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	-
Package form	IN-LINE, SHRINK PITCH	IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH	FLATPACK	FLATPACK	IN-LINE, SHRINK PITCH	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
ROM programmability	MROM	UVPROM	MROM	MROM	MROM	-
Maximum seat height	5 mm	7.07 mm	3.15 mm	3.15 mm	5 mm	-
Maximum supply voltage	6 V	-	6 V	6 V	6 V	-
Minimum supply voltage	4.5 V	-	4.5 V	4.5 V	4.5 V	-
surface mount	NO	NO	YES	YES	NO	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	OTHER	-	OTHER	OTHER	OTHER	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	-
Terminal pitch	1.778 mm	1.778 mm	0.8 mm	0.8 mm	1.778 mm	-
Terminal location	DUAL	DUAL	QUAD	QUAD	DUAL	-
width	19.05 mm	19.05 mm	14 mm	14 mm	19.05 mm	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-

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