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TMP47C860F

Description
CMOS 4-BIT MICROCONTROLLER
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,59 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TMP47C860F Overview

CMOS 4-BIT MICROCONTROLLER

TMP47C860F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeQFP
package instructionQFP,
Contacts64
Reach Compliance Codeunknow
Has ADCYES
JESD-30 codeS-PQFP-G64
JESD-609 codee0
length14 mm
Number of I/O lines56
Number of terminals64
Maximum operating temperature70 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
ROM programmabilityMROM
Maximum seat height3.15 mm
Maximum supply voltage6 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

TMP47C860F Related Products

TMP47C860F TMP47C060E TMP47C860N TMP47C660F TMP47C660N TMP47C660
Description CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER CMOS 4-BIT MICROCONTROLLER
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible -
Maker Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor -
Parts packaging code QFP DIP DIP QFP DIP -
package instruction QFP, AWSDIP, SDIP, QFP, SDIP, -
Contacts 64 64 64 64 64 -
Reach Compliance Code unknow unknow unknow unknow unknow -
Has ADC YES - YES YES YES -
JESD-30 code S-PQFP-G64 R-PDIP-T64 R-PDIP-T64 S-PQFP-G64 R-PDIP-T64 -
JESD-609 code e0 e0 e0 e0 e0 -
length 14 mm 57.5 mm 57.5 mm 14 mm 57.5 mm -
Number of I/O lines 56 - 56 56 56 -
Number of terminals 64 64 64 64 64 -
Maximum operating temperature 70 °C - 70 °C 70 °C 70 °C -
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code QFP AWSDIP SDIP QFP SDIP -
Package shape SQUARE RECTANGULAR RECTANGULAR SQUARE RECTANGULAR -
Package form FLATPACK IN-LINE, PIGGYBACK, WINDOW, SHRINK PITCH IN-LINE, SHRINK PITCH FLATPACK IN-LINE, SHRINK PITCH -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
ROM programmability MROM UVPROM MROM MROM MROM -
Maximum seat height 3.15 mm 7.07 mm 5 mm 3.15 mm 5 mm -
Maximum supply voltage 6 V - 6 V 6 V 6 V -
Minimum supply voltage 4.5 V - 4.5 V 4.5 V 4.5 V -
surface mount YES NO NO YES NO -
technology CMOS CMOS CMOS CMOS CMOS -
Temperature level OTHER - OTHER OTHER OTHER -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE -
Terminal pitch 0.8 mm 1.778 mm 1.778 mm 0.8 mm 1.778 mm -
Terminal location QUAD DUAL DUAL QUAD DUAL -
width 14 mm 19.05 mm 19.05 mm 14 mm 19.05 mm -
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER -
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