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MC68EC030CFE25C

Description
Microprocessors - MPU 32B ON-CHIP CACHE
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size520KB,36 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MC68EC030CFE25C Overview

Microprocessors - MPU 32B ON-CHIP CACHE

MC68EC030CFE25C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFP
package instructionQFP,
Contacts132
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresDYNAMIC BUS SIZING;UPTO 9.2 MIPS
Address bus width32
bit size32
boundary scanNO
maximum clock frequency25 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-CQFP-G132
JESD-609 codee3
length24.13 mm
low power modeNO
Humidity sensitivity level1
Number of terminals132
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height3.175 mm
speed25 MHz
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyHCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width24.13 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
Freescale Semiconductor, Inc.
MOTOROLA
Order this document
by MC68EC030/D
SEMICONDUCTOR
TECHNICAL DATA
MC68EC030
Technical Summary
Second-Generation 32-Bit Enhanced Embedded
Controller
The MC68EC030 is a 32-bit embedded controller that streamlines the functionality of an MC68030 for
the requirements of embedded control applications. The MC68EC030 is optimized to maintain
performance while using cost-effective memory subsystems. The rich instruction set and addressing
mode capabilities of the MC68020, MC68030, and MC68040 have been maintained, allowing a clear
migration path for M68000 systems. The main features of the MC68EC030 are as follows:
Object-Code Compatible with the MC68020, MC68030, and Earlier M68000 Microprocessors
Burst-Mode Bus Interface for Efficient DRAM Access
On-Chip Data Cache (256 Bytes) and On-Chip Instruction Cache (256 Byte)
Dynamic Bus Sizing for Direct Interface to 8-, 16-, and 32-Bit Devices
25- and 40-MHz Operating Frequency (up to 9.2 MIPS)
Advanced Plastic Pin Grid Array Packaging for Through-Hole Applications
Freescale Semiconductor, Inc...
Additional features of the MC68EC030 include:
Complete 32-Bit Nonmultiplexed Address and Data Buses
Sixteen 32-Bit General-Purpose Data and Address Registers
Two 32-Bit Supervisor Stack Pointers and Eight Special-Purpose Control Registers
Two Access Control Registers Allow Blocks To Be Defined for Cacheability Protection
Pipelined Architecture with Increased Parallelism Allows:
– Internal Caches Accesses in Parallel with Bus Transfers
– Overlapped Instruction Execution
Enhanced Bus Controller Supports Asynchronous Bus Cycles (three clocks minimum),
Synchronous Bus Cycle (two clocks minimum), and Burst Data Transfers (one clock)
Complete Support for Coprocessors with the M68000 Coprocessor Interface
Internal Status Indication for Hardware Emulation Support
4-Gbyte Direct Addressing Range
Implemented in Motorola's HCMOS Technology That Allows CMOS and HMOS (High-Density
NMOS) Gates To Be Combined for Maximum Speed, Low Power, and Small Die Size
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
©MOTOROLA INC., 1991
For More Information On This Product,
Go to: www.freescale.com
µ MOTOROLA
Rev. 1

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Description Microprocessors - MPU 32B ON-CHIP CACHE Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code QFP PGA PGA PGA QFP PGA PGA QFP PGA
package instruction QFP, LEAD FREE, PGA-128 LEAD FREE, PGA-128 LEAD FREE, PGA-128 QFP, LEAD FREE, PGA-128 LEAD FREE, PGA-128 QFP, QFP132,1.2SQ LEAD FREE, PGA-128
Contacts 132 128 128 128 132 128 128 132 128
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 3A991 EAR99
Address bus width 32 32 32 32 32 32 32 32 32
bit size 32 32 32 32 32 32 32 32 32
boundary scan NO NO NO NO NO NO NO NO NO
maximum clock frequency 25 MHz 33 MHz 25 MHz 25 MHz 25 MHz 50 MHz 20 MHz 33 MHz 33 MHz
External data bus width 32 32 32 32 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES YES YES YES YES
JESD-30 code S-CQFP-G132 S-CPGA-P128 S-CPGA-P128 S-CPGA-P128 S-CQFP-G132 S-CPGA-P128 S-CPGA-P128 S-CQFP-G132 S-CPGA-P128
length 24.13 mm 34.545 mm 34.545 mm 34.545 mm 24.13 mm 34.545 mm 34.545 mm 24.13 mm 34.545 mm
low power mode NO NO NO NO NO NO NO NO NO
Number of terminals 132 128 128 128 132 128 128 132 128
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C 85 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QFP PGA PGA PGA QFP PGA PGA QFP PGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK GRID ARRAY GRID ARRAY FLATPACK GRID ARRAY
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED 260 NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.175 mm 4.7 mm 4.7 mm 4.7 mm 3.175 mm 4.7 mm 4.7 mm 3.175 mm 4.7 mm
speed 25 MHz 33 MHz 25 MHz 25 MHz 25 MHz 50 MHz 20 MHz 33 MHz 33 MHz
Maximum supply voltage 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO YES NO NO YES NO
technology HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal form GULL WING PIN/PEG PIN/PEG PIN/PEG GULL WING PIN/PEG PIN/PEG GULL WING PIN/PEG
Terminal pitch 0.635 mm 2.54 mm 2.54 mm 2.54 mm 0.635 mm 2.54 mm 2.54 mm 0.635 mm 2.54 mm
Terminal location QUAD PERPENDICULAR PERPENDICULAR PERPENDICULAR QUAD PERPENDICULAR PERPENDICULAR QUAD PERPENDICULAR
Maximum time at peak reflow temperature 40 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 40 NOT SPECIFIED NOT SPECIFIED 40 NOT SPECIFIED
width 24.13 mm 34.545 mm 34.545 mm 34.545 mm 24.13 mm 34.545 mm 34.545 mm 24.13 mm 34.545 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
Maker NXP - NXP NXP NXP NXP - NXP NXP
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