MC56F82348MLHR datasheet, PDF - EEWORLD Datasheet

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MC56F82348MLHR: DescriptionIC,MICROCONTROLLER,32-BIT,56800E CPU,CMOS,QFP,64PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1003KB，68 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC56F82348MLHR Overview

IC,MICROCONTROLLER,32-BIT,56800E CPU,CMOS,QFP,64PIN,PLASTIC

MC56F82348MLHR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	4000165411
Reach Compliance Code	compliant
Country Of Origin	Mainland China
ECCN code	3A991.A.2
Factory Lead Time	16 weeks
YTEOL	11.3
JESD-609 code	e3
Humidity sensitivity level	3
Peak Reflow Temperature (Celsius)	260
Terminal surface	Tin (Sn)
Maximum time at peak reflow temperature	40
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, CONTROLLER

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NXP Semiconductors

Data Sheet: Technical Data

Document Number MC56F823XX

Rev. 3.0, 09/2016

Supports MC56F82323VFM,

MC56F82316VLF, MC56F82313VLC

Features

• This family of digital signal controllers (DSCs) is

based on the 32-bit 56800EX core. On a single chip,

each device combines the processing power of a DSP

and the functionality of an MCU, with a flexible set of

peripherals to support many target applications:

– Industrial control

– Home appliances

– Smart sensors

– Wireless charging

– Power distribution systems

– Motor control (ACIM, BLDC, PMSM, SR, stepper)

– Photovoltaic systems

– Circuit breaker

– Medical device/equipment

– Instrumentation

• DSC based on 32-bit 56800EX core

– Up to 50 MIPS at 50 MHz core frequency

– DSP and MCU functionality in a unified, C-efficient

architecture

• On-chip memory

– Up to 32 KB flash memory

– Up to 6 KB data/program RAM

– On-chip flash memory and RAM can be mapped

into both program and data memory spaces

• Analog

– Two high-speed, 5-channel, 12-bit ADCs with

dynamic x1, x2, and x4 programmable amplifier

– Three analog comparators with integrated 6-bit DAC

references

– Up to two 12-bit digital-to-analog converters (DAC)

• One FlexPWM module with up to 6 PWM outputs

• Communication interfaces

– Up to two high-speed queued SCI (QSCI) modules

with LIN slave functionality

– One queued SPI (QSPI) module

– One I2C/SMBus port

• Timers

– One 16-bit quad timer (1 x 4 16-bit timer)

– Two Periodic Interval Timers (PITs)

• Security and integrity

– Cyclic Redundancy Check (CRC) generator

– Windowed Computer operating properly (COP)

watchdog

– External Watchdog Monitor (EWM)

• Clocks

– Two on-chip relaxation oscillators: 8 MHz (400 kHz

at standby mode) and 200 kHz

– Crystal / resonator oscillator

• System

– DMA controller

– Integrated power-on reset (POR) and low-voltage

interrupt (LVI) and brown-out reset module

– Inter-module crossbar connection

– JTAG/enhanced on-chip emulation (EOnCE) for

unobtrusive, real-time debugging

• Operating characteristics

– Single supply: 3.0 V to 3.6 V

– 5 V–tolerant I/O (except for RESETB pin which is a

3.3 V pin only)

– Operation ambient temperature: -40°C to 105°C

• 48-pin LQFP, 32-pin LQFP and 32-pin QFN packages

MC56F823xx

MC56F823XX

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

Overview............................................................................................ 3

1.1

1.2

1.3

1.4

1.5

1.6

1.7

MC56F823xx Product Family.................................................3

56800EX 32-bit Digital Signal Controller (DSC) core...........3

Operation Parameters.............................................................. 4

On-Chip Memory and Memory Protection............................. 5

Interrupt Controller................................................................. 5

Peripheral highlights............................................................... 6

Block diagrams........................................................................11

6.1

6.2

6.3

6.4

Thermal handling ratings........................................................ 27

Moisture handling ratings........................................................27

ESD handling ratings.............................................................. 27

Voltage and current operating ratings..................................... 28

General............................................................................................... 29

7.1

7.2

7.3

7.4

7.5

General characteristics............................................................ 29

AC electrical characteristics....................................................30

Nonswitching electrical specifications....................................31

Switching specifications..........................................................36

Thermal specifications............................................................ 37

MC56F823xx signal and pin descriptions..........................................14

2.1

Signal groups...........................................................................20

Ordering parts.....................................................................................21

3.1

Determining valid orderable parts...........................................21

Peripheral operating requirements and behaviors.............................. 39

8.1

8.2

8.3

8.4

8.5

8.6

8.7

Core modules...........................................................................39

System modules.......................................................................40

Clock modules.........................................................................40

Memories and memory interfaces........................................... 43

Analog..................................................................................... 45

Timer....................................................................................... 51

Communication interfaces.......................................................52

Part identification............................................................................... 21

4.1

4.2

4.3

4.4

Description.............................................................................. 21

Format..................................................................................... 21

Fields....................................................................................... 22

Example...................................................................................22

Terminology and guidelines...............................................................22

5.1

5.2

5.3

5.4

5.5

5.6

5.7

5.8

5.9

Definition: Operating requirement.......................................... 22

Definition: Operating behavior............................................... 23

Definition: Attribute................................................................23

Definition: Rating....................................................................23

Result of exceeding a rating.................................................... 24

Relationship between ratings and operating requirements......24

Guidelines for ratings and operating requirements................. 25

Definition: Typical value........................................................ 25

Typical value conditions......................................................... 26

Design Considerations....................................................................... 57

9.1

9.2

9.3

Thermal design considerations................................................57

Electrical design considerations.............................................. 59

Power-on Reset design considerations....................................60

10 Obtaining package dimensions.......................................................... 63

11 Pinout................................................................................................. 63

11.1 Signal Multiplexing and Pin Assignments.............................. 63

11.2 Pinout diagrams.......................................................................65

12 Product documentation.......................................................................66

13 Revision History.................................................................................67

Ratings................................................................................................27

MC56F823xx, Rev. 3.0, 09/2016

NXP Semiconductors

MC56F82348MLHR Related Products

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Description	IC,MICROCONTROLLER,32-BIT,56800E CPU,CMOS,QFP,64PIN,PLASTIC	Digital Signal Processors & Controllers - DSP, DSC 32-bit DSC 56800EX core 32KBFlash 50MHz	Digital Signal Processors & Controllers - DSP, DSC 32BIT CORE,64KB FLASH	Digital Signal Processors & Controllers - DSP, DSC 32BIT CORE,48K FLASH,8K	Digital Signal Processors & Controllers - DSP, DSC 32BIT CORE,64KB FLASH	Digital Signal Processors & Controllers - DSP, DSC 32bit core,64kB FLASH	Digital Signal Processors & Controllers - DSP, DSC 32bit core,48K FLASH,8K	Digital Signal Processors & Controllers - DSP, DSC 32BIT CORE,16K FLASH,4K	Digital Signal Processors & Controllers - DSP, DSC 8 BIT CORE,48K FLASH,8K
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Humidity sensitivity level	3	3	3	3	3	3	3	3	3
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260	260
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40	40
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, CONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
JESD-609 code	e3	-	e3	e3	-	e3	e3	e3	-
Terminal surface	Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
bit size	-	32	32	32	32	32	32	32	32
JESD-30 code	-	S-PQCC-N32	S-PQFP-G48	S-PQFP-G64	S-XQCC-N32	S-PQFP-G32	S-PQFP-G32	S-PQFP-G48	S-XQCC-N32
Number of terminals	-	32	48	64	32	32	32	48	32
Maximum operating temperature	-	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	-	QCCN	QFP	QFP	QCCN	QFP	QFP	QFP	QCCN
Package shape	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	CHIP CARRIER	FLATPACK	FLATPACK	CHIP CARRIER	FLATPACK	FLATPACK	FLATPACK	CHIP CARRIER
RAM (bytes)	-	6144	8192	8192	8192	8192	8192	4096	8192
rom(word)	-	32768	65536	49152	65536	65536	49152	16384	49152
ROM programmability	-	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
speed	-	50 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	50 MHz	100 MHz
Nominal supply voltage	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	-	NO LEAD	GULL WING	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING	NO LEAD
Terminal location	-	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Base Number Matches	-	1	1	1	1	1	1	1	1
package instruction	-	-	LQFP-48	LQFP-64	QFN-32	LQFP-32	LQFP-32	-	QFN-32
Has ADC	-	-	YES	YES	YES	YES	YES	-	YES
maximum clock frequency	-	-	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	-	50 MHz
DAC channel	-	-	YES	YES	YES	YES	YES	-	YES
DMA channel	-	-	YES	YES	YES	YES	YES	-	YES
Number of I/O lines	-	-	39	54	26	26	26	-	26
On-chip program ROM width	-	-	8	8	8	8	8	-	8
PWM channel	-	-	YES	YES	YES	YES	YES	-	YES
Maximum supply voltage	-	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V
Minimum supply voltage	-	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	-	2.7 V

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