GS82582T37GE-333 datasheet, PDF

Datasheet> All Categories > storage> GS82582T37GE-333

GS82582T37GE-333: DescriptionSRAM 1.5/1.8V 8M x 36 288M; Categorystorage; File Size320KB，28 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

Download Datasheet Parametric Compare View All

GS82582T37GE-333 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	GS82582T37GE-333	-	-	View	Buy Now

GS82582T37GE-333 Overview

SRAM 1.5/1.8V 8M x 36 288M

GS82582T37GE-333 Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	GSI Technology
Product Category	SRAM
RoHS	Details
Memory Size	288 Mbit
Organization	8 M x 36
Maximum Clock Frequency	333 MHz
Interface Type	Parallel
Supply Voltage - Max	1.9 V
Supply Voltage - Min	1.7 V
Supply Current - Max	660 mA
Minimum Operating Temperature	0 C
Maximum Operating Temperature	+ 70 C
Mounting Style	SMD/SMT
Package / Case	BGA-165
Packaging	Tray
Memory Type	DDR-II
Type	SigmaDDR-II+ B2
Moisture Sensitive	Yes
Factory Pack Quantity	10

Preview

Download Datasheet

View All

GS82582T19/37GE-450/400/375/333

165-Bump BGA

Commercial Temp

Industrial Temp

Features

• 2.0 Clock Latency

• Simultaneous Read and Write SigmaDDR™ Interface

• Common I/O bus

• JEDEC-standard pinout and package

• Double Data Rate interface

• Byte Write controls sampled at data-in time

• Burst of 2 Read and Write

• On-Die Termination (ODT) on Data (D), Byte Write (BW),

and Clock (K, K) inputs

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation with self-timed Late Write

• Fully coherent read and write pipelines

• ZQ pin for programmable output drive strength

• Data Valid pin (QVLD) Support

• IEEE 1149.1 JTAG-compliant Boundary Scan

• RoHS-compliant 165-bump BGA package

288Mb SigmaDDR-II+

Burst of 2 SRAM

450 MHz–333 MHz

1.8 V V

1.8 V or 1.5 V I/O

SRAMs. The GS82582T19/37GE SigmaDDR-II+ SRAMs are

just one element in a family of low power, low voltage HSTL

I/O SRAMs designed to operate at the speeds needed to

implement economical high performance networking systems.

Clocking and Addressing Schemes

The GS82582T19/37GE SigmaDDR-II+ SRAMs are

synchronous devices. They employ two input register clock

inputs, K and K. K and K are independent single-ended clock

inputs, not differential inputs to a single differential clock input

buffer.

Each internal read and write operation in a SigmaDDR-II+ B2

RAM is two times wider than the device I/O bus. An input data

bus de-multiplexer is used to accumulate incoming data before

it is simultaneously written to the memory array. An output

data multiplexer is used to capture the data produced from a

single memory array read and then route it to the appropriate

output drivers as needed. Therefore, the address field of a

SigmaDDR-II+ B2 RAM is always one address pin less than

the advertised index depth (e.g., the 16M x 18 has an 8M

addressable index).

SigmaDDR™ Family Overview

The GS82582T19/37GE are built in compliance with the

SigmaDDR-II+ SRAM pinout standard for Common I/O

synchronous SRAMs. They are 301,989,888-bit (288Mb)

Parameter Synopsis

-450

tKHKH

tKHQV

2.2 ns

0.45 ns

-400

2.5 ns

0.45 ns

-375

2.66 ns

0.45 ns

-333

3.0 ns

0.45 ns

Rev: 1.04b 11/2017

1/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS82582T19/37GE-450/400/375/333

Background

Common I/O SRAMs, from a system architecture point of view, are attractive in read dominated or block transfer applications.

Therefore, the SigmaDDR-II+ SRAM interface and truth table are optimized for burst reads and writes. Common I/O SRAMs are

unpopular in applications where alternating reads and writes are needed because bus turnaround delays can cut high speed

Common I/O SRAM data bandwidth in half.

Burst Operations

Read and write operations are "Burst" operations. In every case where a read or write command is accepted by the SRAM, it will

respond by issuing or accepting two beats of data, executing a data transfer on subsequent rising edges of K and K, as illustrated in

the timing diagrams.This means that it is possible to load new addresses every K clock cycle. Addresses can be loaded less often, if

intervening deselect cycles are inserted.

Deselect Cycles

Chip Deselect commands are pipelined to the same degree as read commands. This means that if a deselect command is applied to

the SRAM on the next cycle after a read command captured by the SRAM, the device will complete the two beat read data transfer

and then execute the deselect command, returning the output drivers to High-Z. A high on the LD pin prevents the RAM from

loading read or write command inputs and puts the RAM into deselect mode as soon as it completes all outstanding burst transfer

operations.

SigmaDDR-II+ Burst of 2 SRAM Read Cycles

The SRAM executes pipelined reads. The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The read

command (LD low and R/W high) is clocked into the SRAM by a rising edge of K.

SigmaDDR-II+ Burst of 2 SRAM Write Cycles

The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The SRAM executes "late write" data transfers.

Data in is due at the device inputs on the rising edge of K following the rising edge of K clock used to clock in the write command

(LD and R/W low) and the write address. To complete the remaining beat of the burst of two write transfer, the SRAM captures

data in on the next rising edge of K, for a total of two transfers per address load.

Special Functions

Byte Write Control

Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with

a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be

stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven High or Low

during the data in sample times in a write sequence.

Each write enable command and write address loaded into the RAM provides the base address for a 2-beat data transfer. The x18

version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any

write sequence.

Rev: 1.04b 11/2017

5/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS82582T37GE-333 Related Products

	GS82582T37GE-333	GS82582T37GE-450	GS82582T37GE-400I	GS82582T19GE-400I	GS82582T19GE-450	GS82582T19GE-375I	GS82582T37GE-450I	GS82582T19GE-450I	GS82582T37GE-375	GS82582T19GE-333I
Description	SRAM 1.5/1.8V 8M x 36 288M	SRAM 1.5/1.8V 8M x 36 288M	SRAM 1.5/1.8V 8M x 36 288M	Standard SRAM, 16MX18, 0.45ns, CMOS, PBGA165, BGA-165	Standard SRAM, 16MX18, 0.45ns, CMOS, PBGA165, BGA-165	Standard SRAM, 16MX18, 0.45ns, CMOS, PBGA165, BGA-165	SRAM 1.5/1.8V 8M x 36 288M	SRAM 1.5/1.8V 16M x 18 288M	SRAM 1.5/1.8V 8M x 36 288M	Static random access memory 1.5/1.8V 16M x 18 288M
Product Attribute	Attribute Value	Attribute Value	Attribute Value	-	-	-	Attribute Value	Attribute Value	Attribute Value	-
Manufacturer	GSI Technology	GSI Technology	GSI Technology	-	-	-	GSI Technology	GSI Technology	GSI Technology	-
Product Category	SRAM	SRAM	SRAM	-	-	-	SRAM	SRAM	SRAM	static random access memory
RoHS	Details	Details	Details	-	-	-	Details	Details	Details	-
Memory Size	288 Mbit	288 Mbit	288 Mbit	-	-	-	288 Mbit	288 Mbit	288 Mbit	-
Organization	8 M x 36	8 M x 36	8 M x 36	-	-	-	8 M x 36	16 M x 18	8 M x 36	-
Maximum Clock Frequency	333 MHz	450 MHz	400 MHz	-	-	-	450 MHz	450 MHz	375 MHz	-
Interface Type	Parallel	Parallel	Parallel	-	-	-	Parallel	Parallel	Parallel	Parallel
Supply Voltage - Max	1.9 V	1.9 V	1.9 V	-	-	-	1.9 V	1.9 V	1.9 V	-
Supply Voltage - Min	1.7 V	1.7 V	1.7 V	-	-	-	1.7 V	1.7 V	1.7 V	-
Supply Current - Max	660 mA	860 mA	790 mA	-	-	-	880 mA	820 mA	730 mA	-
Minimum Operating Temperature	0 C	0 C	- 40 C	-	-	-	- 40 C	- 40 C	0 C	-
Maximum Operating Temperature	+ 70 C	+ 70 C	+ 85 C	-	-	-	+ 85 C	+ 85 C	+ 70 C	-
Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	-	-	-	SMD/SMT	SMD/SMT	SMD/SMT	-
Package / Case	BGA-165	BGA-165	BGA-165	-	-	-	BGA-165	BGA-165	BGA-165	-
Packaging	Tray	Tray	Tray	-	-	-	Tray	Tray	Tray	-
Memory Type	DDR-II	DDR-II	DDR-II	-	-	-	DDR-II	DDR-II	DDR-II	-
Type	SigmaDDR-II+ B2	SigmaDDR-II+ B2	SigmaDDR-II+ B2	-	-	-	SigmaDDR-II+ B2	SigmaDDR-II+ B2	SigmaDDR-II+ B2	-
Moisture Sensitive	Yes	Yes	Yes	-	-	-	Yes	Yes	Yes	-
Factory Pack Quantity	10	10	10	-	-	-	10	10	10	-

Recommended Resources

High-precision nanoamp level current generator circuit diagram

Magnetic remote control switch circuit diagram b

Anti-theft alarm circuit for cultural relics

Simple electronic car speed limiter

AN7116 power amplifier

Safe and energy-saving button bedside lamp circuit

TI's new power management controller integrates 700V startup switch: TI recently announced a power management controller with a 700V startup switch that enables "no-load" standby power consumption of less than 10 mW in 5- to 10-watt cube adapters used in smartphones an...; qwqwqw2088 Analogue and Mixed Signal

(Repost) This topic comes up again,,,,: [align=left][color=#000][size=4]Author: TI Expert Bruce Trump[/size][/color][/align][align=left][color=#000][size=4]Translation: TI Signal Chain Engineer Michael Huang (Huang Xiang)[/size][/color][/al...; qwqwqw2088 Analogue and Mixed Signal

Help: How to use OBEX protocol to encapsulate data in wince socket Bluetooth programming: I am new to Bluetooth development. Recently, I want to develop a Bluetooth file transfer application to transfer files between Bluetooth devices. I have studied the API functions implemented by SOCKET...; 红颜动漫组 Embedded System

【Video Sharing】 Demonstration of the powerful graphics capabilities of TI OMAP 5 processor platform: Introduction: According to the industry-renowned GL Benchmark 2.5 test, TI's OMAP 5 processor platform has powerful graphics capabilities, leading the most advanced tablet computers on the market by a...; 德州仪器_视频 DSP and ARM Processors

The 2.8-inch LCD was successfully driven on the MINISTM32 board!: First, let’s take a look at the picture to see the effectHere is another picture of the back of the LCD screen[[i]This post was last edited by jiaxinhui2011 on 2011-7-8 07:05[/i]]...; jiaxinhui2011 stm32/stm8

How to learn electronic technology well: [size=2][size=4]How to learn electronic technology well is a big question. Solving this problem is a systematic project. First of all, it takes time, more reading and more practice. Electronic technol...; kandy2059 Analog electronics

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components