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KC2016B27.0000C1GE00

Description
OSC XO 27.000MHZ CMOS SMD
CategoryPassive components   
File Size171KB,3 Pages
ManufacturerKyocera
Environmental Compliance
Download Datasheet Parametric View All

KC2016B27.0000C1GE00 Overview

OSC XO 27.000MHZ CMOS SMD

KC2016B27.0000C1GE00 Parametric

Parameter NameAttribute value
typeXO (Standard)
frequency27MHz
Functionenable/disable
outputCMOS
Voltage - Power1.6 V ~ 3.63 V
frequency stability±50ppm
Operating temperature-40°C ~ 85°C
Current - Power (maximum)5mA
grade-
Installation typesurface mount
Package/casing4-SMD, no leads
size/dimensions0.079" long x 0.063" wide (2.00mm x 1.60mm)
Height - Installation (maximum)0.022"(0.55mm)
Current - Power (disabled) (maximum)10µA
Handling Notes for Clock Oscillators
1. Shock & Drop • Vibration
Do not inflict excessive shock and mechanical vibration that
exceeds the norm, such as hitting or mistakenly dropping,
when transporting and mounting on a board. There are cases
when pieces of crystal break, and pieces that are used become
damaged, and become inoperable. When a shock or vibration
that exceeds the norm has been inflicted, make sure to check the
characteristics.
2. Cleaning
Since a crystal piece can be broken by resonance when a crystal
device is cleaned by ultrasonic cleaning, be careful when carrying
out ultrasonic cleaning.
3. Soldering conditions
To maintain the product reliability, please follow recommended conditions.
Standard soldering iron conditions
Clock Oscillators
Soldering iron
Time
280
°
C to 340
°
C
3
+
1/
0 sec. max.
Reflow conditions (Example)
0
Peak: 260
10
C
10 sec. max.
Temperature ( C)
180
0
10
C
230 C min.
40 sec. max.
120 sec. max.
Time (sec.)
Clock Oscillators
Recommended reflow Conditions vary depending upon products.
Please check with the respective specification for details.
4. Mounting Precautions
The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern,
tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates
and operation fails, use it within the stipulated bending conditions. Due to the small cracks in the board resulting from mounting, please pay
sufficient attention when attaching a device at the position where the warping of the board is great.
When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confirming that there is
no damage.
Surface mount devices are NOT flow soldering compatible.
5. Storage Condition
Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in
frequency accuracy and solderability.
Parts should be stored in temperature range of
5 to
+
40
°
C, humidity 40 to 60% RH, and avoid direct sunlight. Then use within 6 months.
As of March 2018
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