MT41K256M16TW-107:P datasheet, PDF

Datasheet> All Categories > MT41K256M16TW-107:P

MT41K256M16TW-107:P: DescriptionDRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA Tray; File Size3MB，217 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

Download Datasheet Parametric Compare View All

MT41K256M16TW-107:P Overview

DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA Tray

MT41K256M16TW-107:P Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
SVHC	Yes
DRAM Type	DDR3L SDRAM
Chip Density (bit)	4G
Organization	256Mx16
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	1866
Maximum Access Time (ns)	0.195
Address Bus Width (bit)	18
Process Technology	CMOS
Minimum Operating Supply Voltage (V)	1.283
Typical Operating Supply Voltage (V)	1.35
Maximum Operating Supply Voltage (V)	1.45
Operating Current (mA)	130
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Packaging	Tray
Supplier Package	FBGA
Pin Count	96
Standard Package Name	BGA
Mounting	Surface Mount
Package Height	0.92
Package Length	14
Package Width	8
PCB changed	96
Lead Shape	Ball

Preview

Download Datasheet

View All

4Gb: x4, x8, x16 DDR3L SDRAM

Description

DDR3L SDRAM

MT41K1G4 – 128 Meg x 4 x 8 banks

MT41K512M8 – 64 Meg x 8 x 8 banks

MT41K256M16 – 32 Meg x 16 x 8 banks

Description

DDR3L SDRAM (1.35V) is a low voltage version of the

DDR3 (1.5V) SDRAM. Refer to DDR3 (1.5V) SDRAM

(Die Rev :E) data sheet specifications when running in

1.5V compatible mode.

•

Self refresh temperature (SRT)

Automatic self refresh (ASR)

Write leveling

Multipurpose register

Output driver calibration

Features

• V

= V

DDQ

= 1.35V (1.283–1.45V)

• Backward compatible to V

= V

DDQ

= 1.5V ±0.075V

– Supports DDR3L devices to be backward com-

patible in 1.5V applications

• Differential bidirectional data strobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• T

of 105°C

– 64ms, 8192-cycle refresh up to 85°C

– 32ms, 8192-cycle refresh at >85°C to 95°C

– 16ms, 8192-cycle refresh at >95°C to 105°C

Options

• Configuration

– 1 Gig x 4

– 512 Meg x 8

– 256 Meg x 16

• FBGA package (Pb-free) – x4, x8

– 78-ball (9mm x 10.5mm) Rev. E

– 78-ball (7.5mm x 10.6mm) Rev. N

– 78-ball (8mm x 10.5mm) Rev. P

• FBGA package (Pb-free) – x16

– 96-ball (9mm x 14mm) Rev. E

– 96-ball (7.5mm x 13.5mm) Rev. N

– 96-ball (8mm x 14mm) Rev. P

• Timing – cycle time

– 938ps @ CL = 14 (DDR3-2133)

– 1.07ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

• Operating temperature

– Commercial (0°C T

+95°C)

– Industrial (–40°C T

+95°C)

– Automotive (–40°C T

+105°C)

• Revision

Marking

1G4

512M8

256M16

-093

-107

-125

None

:E/:N/:P

Table 1: Key Timing Parameters

Speed Grade

-093

1, 2

-107

-125

Notes:

Data Rate (MT/s)

2133

1866

1600

Target

RCD-

RP-CL

14-14-14

13-13-13

11-11-11

RCD

(ns)

CL (ns)

13.09

13.91

13.75

13.09

13.91

13.75

13.09

13.91

13.75

1. Backward compatible to 1600, CL = 11 (-125).

2. Backward compatible to 1866, CL = 13 (-107).

09005aef85af8fa8

4Gb_DDR3L.pdf - Rev. Q 12/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

4Gb: x4, x8, x16 DDR3L SDRAM

Description

Contents

State Diagram ................................................................................................................................................ 11

Functional Description ................................................................................................................................... 12

Industrial Temperature ............................................................................................................................... 12

Automotive Temperature ............................................................................................................................ 12

General Notes ............................................................................................................................................ 13

Functional Block Diagrams ............................................................................................................................. 14

Ball Assignments and Descriptions ................................................................................................................. 16

Package Dimensions ....................................................................................................................................... 22

Electrical Specifications .................................................................................................................................. 28

Absolute Ratings ......................................................................................................................................... 28

Input/Output Capacitance .......................................................................................................................... 29

Thermal Characteristics .................................................................................................................................. 30

Electrical Specifications – I

Specifications and Conditions ............................................................................ 32

Electrical Characteristics – Operating I

Specifications .................................................................................. 43

Electrical Specifications – DC and AC .............................................................................................................. 48

DC Operating Conditions ........................................................................................................................... 48

Input Operating Conditions ........................................................................................................................ 49

DDR3L 1.35V AC Overshoot/Undershoot Specification ................................................................................ 53

DDR3L 1.35V Slew Rate Definitions for Single-Ended Input Signals .............................................................. 56

DDR3L 1.35V Slew Rate Definitions for Differential Input Signals ................................................................. 58

ODT Characteristics ....................................................................................................................................... 59

1.35V ODT Resistors ................................................................................................................................... 60

ODT Sensitivity .......................................................................................................................................... 61

ODT Timing Definitions ............................................................................................................................. 61

Output Driver Impedance ............................................................................................................................... 65

34 Ohm Output Driver Impedance .............................................................................................................. 66

DDR3L 34 Ohm Driver ................................................................................................................................ 67

DDR3L 34 Ohm Output Driver Sensitivity .................................................................................................... 68

DDR3L Alternative 40 Ohm Driver ............................................................................................................... 69

DDR3L 40 Ohm Output Driver Sensitivity .................................................................................................... 69

Output Characteristics and Operating Conditions ............................................................................................ 71

Reference Output Load ............................................................................................................................... 74

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 74

Slew Rate Definitions for Differential Output Signals .................................................................................... 76

Speed Bin Tables ............................................................................................................................................ 77

Electrical Characteristics and AC Operating Conditions ................................................................................... 82

Command and Address Setup, Hold, and Derating .......................................................................................... 102

Data Setup, Hold, and Derating ...................................................................................................................... 109

Commands – Truth Tables ............................................................................................................................. 117

Commands ................................................................................................................................................... 120

DESELECT ................................................................................................................................................ 120

NO OPERATION ........................................................................................................................................ 120

ZQ CALIBRATION LONG ........................................................................................................................... 120

ZQ CALIBRATION SHORT .......................................................................................................................... 120

ACTIVATE ................................................................................................................................................. 120

READ ........................................................................................................................................................ 120

WRITE ...................................................................................................................................................... 121

PRECHARGE ............................................................................................................................................. 122

REFRESH .................................................................................................................................................. 122

SELF REFRESH .......................................................................................................................................... 123

09005aef85af8fa8

4Gb_DDR3L.pdf - Rev. Q 12/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

4Gb: x4, x8, x16 DDR3L SDRAM

Description

DLL Disable Mode ..................................................................................................................................... 124

Input Clock Frequency Change ...................................................................................................................... 128

Write Leveling ............................................................................................................................................... 130

Write Leveling Procedure ........................................................................................................................... 132

Write Leveling Mode Exit Procedure ........................................................................................................... 134

Initialization ................................................................................................................................................. 135

Voltage Initialization / Change ....................................................................................................................... 137

Voltage Switching ............................................................................................................................... 138

Mode Registers .............................................................................................................................................. 139

Mode Register 0 (MR0) ................................................................................................................................... 140

Burst Length ............................................................................................................................................. 140

Burst Type ................................................................................................................................................. 141

DLL RESET ................................................................................................................................................ 142

Write Recovery .......................................................................................................................................... 143

Precharge Power-Down (Precharge PD) ...................................................................................................... 143

CAS Latency (CL) ....................................................................................................................................... 143

Mode Register 1 (MR1) ................................................................................................................................... 145

DLL Enable/DLL Disable ........................................................................................................................... 145

Output Drive Strength ............................................................................................................................... 146

OUTPUT ENABLE/DISABLE ...................................................................................................................... 146

TDQS Enable ............................................................................................................................................. 146

On-Die Termination .................................................................................................................................. 147

WRITE LEVELING ..................................................................................................................................... 147

POSTED CAS ADDITIVE Latency ................................................................................................................ 147

Mode Register 2 (MR2) ................................................................................................................................... 148

CAS Write Latency (CWL) ........................................................................................................................... 149

AUTO SELF REFRESH (ASR) ....................................................................................................................... 149

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 149

SRT vs. ASR ............................................................................................................................................... 150

DYNAMIC ODT ......................................................................................................................................... 150

Mode Register 3 (MR3) ................................................................................................................................... 150

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 151

MPR Functional Description ...................................................................................................................... 152

MPR Register Address Definitions and Bursting Order ................................................................................. 153

MPR Read Predefined Pattern .................................................................................................................... 158

MODE REGISTER SET (MRS) Command ........................................................................................................ 158

ZQ CALIBRATION Operation ......................................................................................................................... 159

ACTIVATE Operation ..................................................................................................................................... 160

READ Operation ............................................................................................................................................ 162

WRITE Operation .......................................................................................................................................... 173

DQ Input Timing ....................................................................................................................................... 181

PRECHARGE Operation ................................................................................................................................. 183

SELF REFRESH Operation .............................................................................................................................. 183

Extended Temperature Usage ........................................................................................................................ 185

Power-Down Mode ........................................................................................................................................ 186

RESET Operation ........................................................................................................................................... 194

On-Die Termination (ODT) ............................................................................................................................ 196

Functional Representation of ODT ............................................................................................................. 196

Nominal ODT ............................................................................................................................................ 196

Dynamic ODT ............................................................................................................................................... 198

Dynamic ODT Special Use Case ................................................................................................................. 198

Functional Description .............................................................................................................................. 198

09005aef85af8fa8

4Gb_DDR3L.pdf - Rev. Q 12/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT41K256M16TW-107:P Related Products

	MT41K256M16TW-107:P	MT41K256M16TW-107:PTR
Description	DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA Tray	DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA T/R
EU restricts the use of certain hazardous substances	Compliant	Compliant
ECCN (US)	EAR99	EAR99
Part Status	Active	Unconfirmed
HTS	8542.32.00.36	8542.32.00.36
DRAM Type	DDR3L SDRAM	DDR3L SDRAM
Chip Density (bit)	4G	4G
Organization	256Mx16	256Mx16
Number of Internal Banks	8	8
Number of Words per Bank	32M	32M
Number of Bits/Word (bit)	16	16
Data Bus Width (bit)	16	16
Maximum Clock Rate (MHz)	1866	1866
Maximum Access Time (ns)	0.195	0.195
Address Bus Width (bit)	18	18
Process Technology	CMOS	CMOS
Minimum Operating Supply Voltage (V)	1.283	1.283
Typical Operating Supply Voltage (V)	1.35	1.35
Maximum Operating Supply Voltage (V)	1.45	1.45
Operating Current (mA)	130	130
Maximum Operating Temperature (°C)	95	95
Supplier Temperature Grade	Commercial	Commercial
Number of I/O Lines (bit)	16	16
Packaging	Tray	Tape and Reel
Supplier Package	FBGA	FBGA
Pin Count	96	96
Standard Package Name	BGA	BGA
Mounting	Surface Mount	Surface Mount
Package Height	0.92	0.92
Package Length	14	14
Package Width	8	8
PCB changed	96	96
Lead Shape	Ball	Ball

Recommended Resources

Six times voltage rectifier circuit

Ringing signal detection circuit

Transistor audio amplifier circuit with DC coupling

KD-156 music integrated circuit

5V-10A regulated power supply circuit diagram composed of 5G14

When using IAR compiler for stm8S103, there is not enough space after writing much code. Does IAR add a lot of its own libraries?: RT, I feel that AT89S51 could write a lot of code back then, and it was also 8K....; lrz123 stm32/stm8

Sun goods + STM32 development board + C8051 development board + FPGA development board + GigaDevice 51 development board + domestic LED driver board + high-precision temperature acquisition board: I've been having issues with these boards lately, :loveliness::loveliness:...; 果轩天 Domestic Chip Exchange

【AN-106 Application Note】A brief discussion on amplifier applications: This application note is intended to explore some of the broad range of applications for operational amplifiers....; EEWORLD社区 ADI Reference Circuit

You [show off your idle time] I have a gift!: [align=left][size=3]It's the end of the year again. Thinking back to the development board exchange group we established at the beginning of the year, it will soon be one year old... [/size][/align][a...; eric_wang Buy&Sell

SigFox Protocol: SigFox wireless technology is based on LTN (Low Throughput Network). It is a WAN-based technology that supports low data rate communications over longer distances. It is used in M2M and IoT applicatio...; Aguilera RF/Wirelessly

An inventor is a device that allows people to invent things.: The inventor, a device that allows people to inventI remember that Mr. Sun Zhengyi, who is known as the emperor of Internet investment, used an interesting inventor to help himself innovate when he wa...; xyh_521 Robotics Development

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components