DIODE GEN PURP 50V 300MA AXIAL
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| Parts packaging code | DO-35 |
| package instruction | SIMILAR TO DO-35, 2 PIN |
| Contacts | 2 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | METALLURGICALLY BONDED |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| JESD-30 code | O-XALF-W2 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 2 |
| Maximum output current | 0.3 A |
| Package body material | UNSPECIFIED |
| Package shape | ROUND |
| Package form | LONG FORM |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Qualified |
| Guideline | MIL-19500/609D |
| Maximum reverse recovery time | 0.004 µs |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |

| JAN1N6640 | JANTX1N6639 | JANTX1N6641 | JANTXV1N6639 | JANTXV1N6641 | JAN1N6639 | JAN1N6641 | 1N6639E3 | 1N6641E3 | 1N6640E3 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | DIODE GEN PURP 50V 300MA AXIAL | DIODE GEN PURP 75V 300MA AXIAL | DIODE GEN PURP 50V 300MA AXIAL | DIODE GEN PURP 75V 300MA AXIAL | DIODE GEN PURP 50V 300MA AXIAL | DIODE GEN PURP 75V 300MA AXIAL | DIODE GEN PURP 50V 300MA AXIAL | Rectifier Diode, 1 Element, 0.3A, Silicon, DO-35, HERMETIC SEALED PACKAGE-2 | Rectifier Diode, 1 Element, 0.3A, Silicon, DO-35, HERMETIC SEALED PACKAGE-2 | Rectifier Diode, 1 Element, 0.3A, Silicon, DO-35, HERMETIC SEALED PACKAGE-2 |
| package instruction | SIMILAR TO DO-35, 2 PIN | SIMILAR TO DO-35, 2 PIN | SIMILAR TO DO-35, 2 PIN | SIMILAR TO DO-35, 2 PIN | SIMILAR TO DO-35, 2 PIN | SIMILAR TO DO-35, 2 PIN | SIMILAR TO DO-35, 2 PIN | O-LALF-W2 | HERMETIC SEALED PACKAGE-2 | O-LALF-W2 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| JESD-30 code | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-XALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Maximum output current | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A | 0.3 A |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | GLASS | GLASS | GLASS |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| Maximum reverse recovery time | 0.004 µs | 0.004 µs | 0.005 µs | 0.004 µs | 0.005 µs | 0.004 µs | 0.005 µs | 0.004 µs | 0.005 µs | 0.004 µs |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Terminal form | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE |
| Terminal location | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - | - | - |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - | - | - |
| Maker | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | - | Microsemi | Microsemi | Microsemi |
| Parts packaging code | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 | - | - | - |
| Contacts | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - | - | - |
| Other features | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | METALLURGICALLY BONDED | - | - | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| Certification status | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | - | - | - |
| Guideline | MIL-19500/609D | MIL-19500/609D | MIL-19500/609D | MIL-19500/609D | MIL-19500/609D | MIL-19500/609D | MIL-19500/609D | - | - | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| JEDEC-95 code | - | DO-35 | DO-35 | DO-35 | DO-35 | - | - | DO-35 | DO-35 | DO-35 |