JS28F256P33BFE datasheet, PDF - EEWORLD Datasheet

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JS28F256P33BFE: DescriptionIC FLASH 256M PARALLEL 56TSOP; Categorystorage storage; File Size1MB，92 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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JS28F256P33BFE Overview

IC FLASH 256M PARALLEL 56TSOP

JS28F256P33BFE Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	TSOP
package instruction	TSSOP, TSSOP56,.8,20
Contacts	56
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	105 ns
Other features	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	R-PDSO-G56
JESD-609 code	e3
length	18.4 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	4,255
Number of terminals	56
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP56,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Department size	16K,64K
Maximum standby current	0.00021 A
Maximum slew rate	0.031 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	NO
type	NOR TYPE
width	14 mm
Base Number Matches	1

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256Mb and 512Mb (256Mb/256Mb),

P33-65nm

Features

Micron Parallel NOR Flash Embedded

Memory (P33-65nm)

RC28F256P33TFE, RC28F256P33BFE, RC28F256P33BFF,

PC28F256P33TFE, PC28F256P33BFE, PC28F256P33BFF,

PC28F256P33BFR, RC48F4400P0TB0EJ, PC48F4400P0TB0EE,

PC48F4400P0TB0EH, JS28F256P33TFE, JS28F256P33BFE

Features

• High performance

– 95ns initial access for Easy BGA

– 105ns initial access for TSOP

– 25ns 16-word asychronous page read mode

– 52 MHz (Easy BGA) with zero WAIT states and

17ns clock-to-data output synchronous burst

read mode

– 4-, 8-, 16-, and continuous word options for burst

mode

– Buffered enhanced factory programming (BEFP)

at 2 MB/s (TYP) using a 512-word buffer

– 3.0V buffered programming at 1.14 MB/s (TYP)

using a 512-word buffer

• Architecture

– MLC: highest density at lowest cost

– Asymmetrically blocked architecture

– Four 32KB parameter blocks: top or bottom con-

figuration

– 128KB main blocks

– Blank check to verify an erased block

• Voltage and power

– V

(core) voltage: 2.3V to 3.6V

– V

CCQ

(I/O) voltage: 2.3V to 3.6V

– Standy current: 65µA (TYP) for 256Mb

– 52 MHz continuous synchronous read current:

21mA (TYP), 24mA (MAX)

• Security

– One-time programmable register: 64 OTP bits,

programmed with unique information from Mi-

cron; 2112 OTP bits available for customer pro-

gramming

– Absolute write protection: V

= V

– Power-transition erase/program lockout

– Individual zero-latency block locking

– Individual block lock-down

– Password access

• Software

– 25μs (TYP) program suspend

– 25μs (TYP) erase suspend

– Flash Data Integrator optimized

– Basic command set and extended function Inter-

face (EFI) command set compatible

– Common flash interface

• Density and Packaging

– 56-lead TSOP package (256Mb only)

– 64-ball Easy BGA package (256Mb, 512Mb)

– QUAD+ and SCSP packages (256Mb, 512Mb)

– 16-bit wide data bus

• Quality and reliabilty

– JESD47 compliant

– Operating temperature: –40°C to +85°C

– Minimum 100,000 ERASE cycles per block

– 65nm process technology

PDF: 09005aef845667ad

p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb and 512Mb (256Mb/256Mb),

P33-65nm

Features

Contents

Important Notes and Warnings ......................................................................................................................... 8

General Description ......................................................................................................................................... 9

Virtual Chip Enable Description ........................................................................................................................ 9

Memory Map ................................................................................................................................................. 11

Package Dimensions ....................................................................................................................................... 12

Pinouts and Ballouts ....................................................................................................................................... 14

Signal Descriptions ......................................................................................................................................... 16

Bus Operations ............................................................................................................................................... 18

Read .......................................................................................................................................................... 18

Write .......................................................................................................................................................... 18

Output Disable ........................................................................................................................................... 18

Standby ..................................................................................................................................................... 18

Reset .......................................................................................................................................................... 19

Device Command Codes ................................................................................................................................. 20

Device Command Bus Cycles .......................................................................................................................... 23

Read Operations ............................................................................................................................................. 25

Asynchronous Page Mode Read ................................................................................................................... 25

Asynchronous Single Word Read ................................................................................................................. 25

Synchronous Burst Mode Read ................................................................................................................... 26

Read CFI .................................................................................................................................................... 26

Read Device ID ........................................................................................................................................... 26

Device ID Codes ............................................................................................................................................. 27

Program Operations ....................................................................................................................................... 28

Word Programming (40h) ........................................................................................................................... 28

Buffered Programming (E8h, D0h) .............................................................................................................. 28

Buffered Enhanced Factory Programming (80h, D0h) ................................................................................... 29

Program Suspend ....................................................................................................................................... 31

Program Resume ........................................................................................................................................ 32

Program Protection .................................................................................................................................... 32

Erase Operations ............................................................................................................................................ 33

BLOCK ERASE Command ........................................................................................................................... 33

BLANK CHECK Command .......................................................................................................................... 33

ERASE SUSPEND Command ....................................................................................................................... 34

ERASE RESUME Command ........................................................................................................................ 34

Erase Protection ......................................................................................................................................... 34

Security Operations ........................................................................................................................................ 35

Block Locking ............................................................................................................................................. 35

BLOCK LOCK Command ............................................................................................................................ 35

BLOCK UNLOCK Command ....................................................................................................................... 35

BLOCK LOCK DOWN Command ................................................................................................................. 35

Block Lock Status ....................................................................................................................................... 35

Block Locking During Suspend ................................................................................................................... 36

Selectable OTP Blocks ................................................................................................................................. 37

Password Access ......................................................................................................................................... 37

Status Register ................................................................................................................................................ 38

Read Status Register ................................................................................................................................... 38

Clear Status Register ................................................................................................................................... 39

Configuration Register .................................................................................................................................... 40

Read Configuration Register ....................................................................................................................... 40

Read Mode ................................................................................................................................................. 40

PDF: 09005aef845667ad

p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb and 512Mb (256Mb/256Mb),

P33-65nm

Features

Latency Count ............................................................................................................................................

End of Wordline Considerations ..................................................................................................................

WAIT Signal Polarity and Functionality ........................................................................................................

WAIT Delay ................................................................................................................................................

Burst Sequence ..........................................................................................................................................

Clock Edge .................................................................................................................................................

Burst Wrap .................................................................................................................................................

Burst Length ..............................................................................................................................................

One-Time Programmable Registers .................................................................................................................

Read OTP Registers .....................................................................................................................................

Program OTP Registers ...............................................................................................................................

Lock OTP Registers .....................................................................................................................................

Common Flash Interface ................................................................................................................................

READ CFI Structure Output ........................................................................................................................

Flowcharts .....................................................................................................................................................

Power and Reset Specifications .......................................................................................................................

Power Supply Decoupling ...........................................................................................................................

Maximum Ratings and Operating Conditions ..................................................................................................

AC Test Conditions and Capacitance ...............................................................................................................

DC Electrical Specifications ............................................................................................................................

AC Read Specifications ...................................................................................................................................

AC Write Specifications ...................................................................................................................................

Program and Erase Characteristics ..................................................................................................................

Revision History .............................................................................................................................................

Rev. D – 2/18 ..............................................................................................................................................

Rev. C – 9/15 ...............................................................................................................................................

Rev. B – 12/13 .............................................................................................................................................

Rev. A – 8/13 ...............................................................................................................................................

PDF: 09005aef845667ad

p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

JS28F256P33BFE Related Products

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Description	IC FLASH 256M PARALLEL 56TSOP	IC FLASH 512M PARALLEL 64EASYBGA	IC FLASH 512M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 56TSOP	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	FLASH - NOR
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	incompatible	incompatible	-
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	-	-	Micron Technology	-	Micron Technology	-
package instruction	TSSOP, TSSOP56,.8,20	TBGA,	TBGA,	TSSOP, TSSOP56,.8,20	TBGA, BGA64,8X8,40	TBGA, BGA64,8X8,40	TBGA, BGA64,8X8,40	BGA-64	BGA-64	-
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	not_compliant	unknown	-
Maximum access time	105 ns	95 ns	95 ns	105 ns	95 ns	95 ns	95 ns	95 ns	95 ns	-
Other features	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	-
startup block	BOTTOM	BOTTOM	BOTTOM	TOP	BOTTOM	BOTTOM	TOP	BOTTOM	TOP	-
command user interface	YES	-	-	YES	YES	YES	YES	YES	YES	-
Universal Flash Interface	YES	-	-	YES	YES	YES	YES	YES	YES	-
Data polling	NO	-	-	NO	NO	NO	NO	NO	NO	-
JESD-30 code	R-PDSO-G56	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	-
JESD-609 code	e3	e1	e1	e3	e1	e1	e1	e1	e1	-
length	18.4 mm	13 mm	13 mm	18.4 mm	13 mm	13 mm	13 mm	13 mm	13 mm	-
memory density	268435456 bit	536870912 bit	536870912 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	-
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	-
memory width	16	16	16	16	16	16	16	16	16	-
Number of functions	1	1	1	1	1	1	1	1	1	-
Number of departments/size	4,255	-	-	4,255	4,255	4,255	4,255	4,255	4,255	-
Number of terminals	56	64	64	56	64	64	64	64	64	-
word count	16777216 words	33554432 words	33554432 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	-
character code	16000000	32000000	32000000	16000000	16000000	16000000	16000000	16000000	16000000	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
organize	16MX16	32MX16	32MX16	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSSOP	TBGA	TBGA	TSSOP	TBGA	TBGA	TBGA	TBGA	TBGA	-
Encapsulate equivalent code	TSSOP56,.8,20	-	-	TSSOP56,.8,20	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	-
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	260	NOT SPECIFIED	260	NOT SPECIFIED	260	NOT SPECIFIED	-
power supply	2.5/3.3 V	-	-	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	-
Programming voltage	2.7 V	3 V	3 V	3 V	3 V	3 V	3 V	2.7 V	3 V	-
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-
Department size	16K,64K	-	-	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	-
Maximum standby current	0.00021 A	-	-	0.00021 A	0.00021 A	0.00021 A	0.00021 A	0.00021 A	0.00021 A	-
Maximum slew rate	0.031 mA	-	-	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	-
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	-
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	TIN SILVER COPPER	-
Terminal form	GULL WING	BALL	BALL	GULL WING	BALL	BALL	BALL	BALL	BALL	-
Terminal pitch	0.5 mm	1 mm	1 mm	0.5 mm	1 mm	1 mm	1 mm	1 mm	1 mm	-
Terminal location	DUAL	BOTTOM	BOTTOM	DUAL	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-
Maximum time at peak reflow temperature	NOT SPECIFIED	30	30	30	NOT SPECIFIED	30	NOT SPECIFIED	30	NOT SPECIFIED	-
switch bit	NO	-	-	NO	NO	NO	NO	NO	NO	-
type	NOR TYPE	-	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-
width	14 mm	10 mm	10 mm	14 mm	10 mm	10 mm	10 mm	10 mm	10 mm	-

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