PC28F256P33BFF TR datasheet, PDF

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PC28F256P33BFF TR: DescriptionIC FLASH 256M PARALLEL 64EASYBGA; Categorystorage; File Size1MB，92 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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PC28F256P33BFF TR Overview

IC FLASH 256M PARALLEL 64EASYBGA

PC28F256P33BFF TR Parametric

Parameter Name	Attribute value
memory type	non-volatile
memory format	flash memory
technology	FLASH - NOR
storage	256Mb （16M x 16）
Clock frequency	52MHz
Write cycle time - words, pages	85ns
interview time	85ns
memory interface	in parallel
Voltage - Power	2.3 V ~ 3.6 V
Operating temperature	-40°C ~ 85°C（TC）
Installation type	surface mount
Package/casing	64-TBGA
Supplier device packaging	64-EasyBGA（8x10）

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256Mb and 512Mb (256Mb/256Mb),

P33-65nm

Features

Micron Parallel NOR Flash Embedded

Memory (P33-65nm)

RC28F256P33TFE, RC28F256P33BFE, RC28F256P33BFF,

PC28F256P33TFE, PC28F256P33BFE, PC28F256P33BFF,

PC28F256P33BFR, RC48F4400P0TB0EJ, PC48F4400P0TB0EE,

PC48F4400P0TB0EH, JS28F256P33TFE, JS28F256P33BFE

Features

• High performance

– 95ns initial access for Easy BGA

– 105ns initial access for TSOP

– 25ns 16-word asychronous page read mode

– 52 MHz (Easy BGA) with zero WAIT states and

17ns clock-to-data output synchronous burst

read mode

– 4-, 8-, 16-, and continuous word options for burst

mode

– Buffered enhanced factory programming (BEFP)

at 2 MB/s (TYP) using a 512-word buffer

– 3.0V buffered programming at 1.14 MB/s (TYP)

using a 512-word buffer

• Architecture

– MLC: highest density at lowest cost

– Asymmetrically blocked architecture

– Four 32KB parameter blocks: top or bottom con-

figuration

– 128KB main blocks

– Blank check to verify an erased block

• Voltage and power

– V

(core) voltage: 2.3V to 3.6V

– V

CCQ

(I/O) voltage: 2.3V to 3.6V

– Standy current: 65µA (TYP) for 256Mb

– 52 MHz continuous synchronous read current:

21mA (TYP), 24mA (MAX)

• Security

– One-time programmable register: 64 OTP bits,

programmed with unique information from Mi-

cron; 2112 OTP bits available for customer pro-

gramming

– Absolute write protection: V

= V

– Power-transition erase/program lockout

– Individual zero-latency block locking

– Individual block lock-down

– Password access

• Software

– 25μs (TYP) program suspend

– 25μs (TYP) erase suspend

– Flash Data Integrator optimized

– Basic command set and extended function Inter-

face (EFI) command set compatible

– Common flash interface

• Density and Packaging

– 56-lead TSOP package (256Mb only)

– 64-ball Easy BGA package (256Mb, 512Mb)

– QUAD+ and SCSP packages (256Mb, 512Mb)

– 16-bit wide data bus

• Quality and reliabilty

– JESD47 compliant

– Operating temperature: –40°C to +85°C

– Minimum 100,000 ERASE cycles per block

– 65nm process technology

PDF: 09005aef845667ad

p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb and 512Mb (256Mb/256Mb),

P33-65nm

Features

Contents

Important Notes and Warnings ......................................................................................................................... 8

General Description ......................................................................................................................................... 9

Virtual Chip Enable Description ........................................................................................................................ 9

Memory Map ................................................................................................................................................. 11

Package Dimensions ....................................................................................................................................... 12

Pinouts and Ballouts ....................................................................................................................................... 14

Signal Descriptions ......................................................................................................................................... 16

Bus Operations ............................................................................................................................................... 18

Read .......................................................................................................................................................... 18

Write .......................................................................................................................................................... 18

Output Disable ........................................................................................................................................... 18

Standby ..................................................................................................................................................... 18

Reset .......................................................................................................................................................... 19

Device Command Codes ................................................................................................................................. 20

Device Command Bus Cycles .......................................................................................................................... 23

Read Operations ............................................................................................................................................. 25

Asynchronous Page Mode Read ................................................................................................................... 25

Asynchronous Single Word Read ................................................................................................................. 25

Synchronous Burst Mode Read ................................................................................................................... 26

Read CFI .................................................................................................................................................... 26

Read Device ID ........................................................................................................................................... 26

Device ID Codes ............................................................................................................................................. 27

Program Operations ....................................................................................................................................... 28

Word Programming (40h) ........................................................................................................................... 28

Buffered Programming (E8h, D0h) .............................................................................................................. 28

Buffered Enhanced Factory Programming (80h, D0h) ................................................................................... 29

Program Suspend ....................................................................................................................................... 31

Program Resume ........................................................................................................................................ 32

Program Protection .................................................................................................................................... 32

Erase Operations ............................................................................................................................................ 33

BLOCK ERASE Command ........................................................................................................................... 33

BLANK CHECK Command .......................................................................................................................... 33

ERASE SUSPEND Command ....................................................................................................................... 34

ERASE RESUME Command ........................................................................................................................ 34

Erase Protection ......................................................................................................................................... 34

Security Operations ........................................................................................................................................ 35

Block Locking ............................................................................................................................................. 35

BLOCK LOCK Command ............................................................................................................................ 35

BLOCK UNLOCK Command ....................................................................................................................... 35

BLOCK LOCK DOWN Command ................................................................................................................. 35

Block Lock Status ....................................................................................................................................... 35

Block Locking During Suspend ................................................................................................................... 36

Selectable OTP Blocks ................................................................................................................................. 37

Password Access ......................................................................................................................................... 37

Status Register ................................................................................................................................................ 38

Read Status Register ................................................................................................................................... 38

Clear Status Register ................................................................................................................................... 39

Configuration Register .................................................................................................................................... 40

Read Configuration Register ....................................................................................................................... 40

Read Mode ................................................................................................................................................. 40

PDF: 09005aef845667ad

p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb and 512Mb (256Mb/256Mb),

P33-65nm

Features

Latency Count ............................................................................................................................................

End of Wordline Considerations ..................................................................................................................

WAIT Signal Polarity and Functionality ........................................................................................................

WAIT Delay ................................................................................................................................................

Burst Sequence ..........................................................................................................................................

Clock Edge .................................................................................................................................................

Burst Wrap .................................................................................................................................................

Burst Length ..............................................................................................................................................

One-Time Programmable Registers .................................................................................................................

Read OTP Registers .....................................................................................................................................

Program OTP Registers ...............................................................................................................................

Lock OTP Registers .....................................................................................................................................

Common Flash Interface ................................................................................................................................

READ CFI Structure Output ........................................................................................................................

Flowcharts .....................................................................................................................................................

Power and Reset Specifications .......................................................................................................................

Power Supply Decoupling ...........................................................................................................................

Maximum Ratings and Operating Conditions ..................................................................................................

AC Test Conditions and Capacitance ...............................................................................................................

DC Electrical Specifications ............................................................................................................................

AC Read Specifications ...................................................................................................................................

AC Write Specifications ...................................................................................................................................

Program and Erase Characteristics ..................................................................................................................

Revision History .............................................................................................................................................

Rev. D – 2/18 ..............................................................................................................................................

Rev. C – 9/15 ...............................................................................................................................................

Rev. B – 12/13 .............................................................................................................................................

Rev. A – 8/13 ...............................................................................................................................................

PDF: 09005aef845667ad

p33_65nm_MLC_256Mb-512mb.pdf - Rev. D 2/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

PC28F256P33BFF TR Related Products

	PC28F256P33BFF TR	PC48F4400P0TB0EE	PC48F4400P0TB0EH	JS28F256P33BFE	JS28F256P33TFE	PC28F256P33BFE	PC28F256P33BFR	PC28F256P33TFE	RC28F256P33BFE	RC28F256P33TFE
Description	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 512M PARALLEL 64EASYBGA	IC FLASH 512M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 56TSOP	IC FLASH 256M PARALLEL 56TSOP	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA	IC FLASH 256M PARALLEL 64EASYBGA
technology	FLASH - NOR	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	conform to	conform to	incompatible	incompatible
Maker	-	Micron Technology	Micron Technology	Micron Technology	Micron Technology	-	-	Micron Technology	-	Micron Technology
package instruction	-	TBGA,	TBGA,	TSSOP, TSSOP56,.8,20	TSSOP, TSSOP56,.8,20	TBGA, BGA64,8X8,40	TBGA, BGA64,8X8,40	TBGA, BGA64,8X8,40	BGA-64	BGA-64
Reach Compliance Code	-	compliant	compliant	compliant	compliant	compliant	compliant	compliant	not_compliant	unknown
Maximum access time	-	95 ns	95 ns	105 ns	105 ns	95 ns	95 ns	95 ns	95 ns	95 ns
Other features	-	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE	TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE
startup block	-	BOTTOM	BOTTOM	BOTTOM	TOP	BOTTOM	BOTTOM	TOP	BOTTOM	TOP
JESD-30 code	-	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56	R-PDSO-G56	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64
JESD-609 code	-	e1	e1	e3	e3	e1	e1	e1	e1	e1
length	-	13 mm	13 mm	18.4 mm	18.4 mm	13 mm	13 mm	13 mm	13 mm	13 mm
memory density	-	536870912 bit	536870912 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit
Memory IC Type	-	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	-	16	16	16	16	16	16	16	16	16
Number of functions	-	1	1	1	1	1	1	1	1	1
Number of terminals	-	64	64	56	56	64	64	64	64	64
word count	-	33554432 words	33554432 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	-	32000000	32000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	-	32MX16	32MX16	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	TBGA	TBGA	TSSOP	TSSOP	TBGA	TBGA	TBGA	TBGA	TBGA
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	260	260	NOT SPECIFIED	260	NOT SPECIFIED	260	NOT SPECIFIED	260	NOT SPECIFIED
Programming voltage	-	3 V	3 V	2.7 V	3 V	3 V	3 V	3 V	2.7 V	3 V
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	-	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	-	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	-	BALL	BALL	GULL WING	GULL WING	BALL	BALL	BALL	BALL	BALL
Terminal pitch	-	1 mm	1 mm	0.5 mm	0.5 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	-	BOTTOM	BOTTOM	DUAL	DUAL	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	-	30	30	NOT SPECIFIED	30	NOT SPECIFIED	30	NOT SPECIFIED	30	NOT SPECIFIED
width	-	10 mm	10 mm	14 mm	14 mm	10 mm	10 mm	10 mm	10 mm	10 mm
command user interface	-	-	-	YES	YES	YES	YES	YES	YES	YES
Universal Flash Interface	-	-	-	YES	YES	YES	YES	YES	YES	YES
Data polling	-	-	-	NO	NO	NO	NO	NO	NO	NO
Number of departments/size	-	-	-	4,255	4,255	4,255	4,255	4,255	4,255	4,255
Encapsulate equivalent code	-	-	-	TSSOP56,.8,20	TSSOP56,.8,20	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40
power supply	-	-	-	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
Certification status	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Department size	-	-	-	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K	16K,64K
Maximum standby current	-	-	-	0.00021 A	0.00021 A	0.00021 A	0.00021 A	0.00021 A	0.00021 A	0.00021 A
Maximum slew rate	-	-	-	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA	0.031 mA
switch bit	-	-	-	NO	NO	NO	NO	NO	NO	NO
type	-	-	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE

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