D Latch, 1-Func, 8-Bit, CMOS, CQCC20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| JESD-30 code | S-XQCC-N20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D LATCH |
| MaximumI(ol) | 0.032 A |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 12 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 54FCT533L | 54FCT533D | 54FCT533AE | 54FCT533E | 54FCT2573CTDB | 54FCT2573TDB | 74FCT2573CTP | 74FCT573AE | |
|---|---|---|---|---|---|---|---|---|
| Description | D Latch, 1-Func, 8-Bit, CMOS, CQCC20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, CDFP20 | D Latch, 1-Func, 8-Bit, CMOS, CDFP20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | PDIP-20, Tube | Jbar-Kbar Flip-Flop, 1-Func, 8-Bit, CMOS, CDFP20 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | unknown | not_compliant |
| JESD-30 code | S-XQCC-N20 | R-XDIP-T20 | R-XDFP-F20 | R-XDFP-F20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 | R-XDFP-F20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | JBAR-KBAR FLIP-FLOP |
| MaximumI(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.012 A | 0.012 A | 0.012 A | 0.048 A |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | QCCN | DIP | DFP | DFP | DIP | DIP | DIP | DFP |
| Encapsulate equivalent code | LCC20,.35SQ | DIP20,.3 | FL20,.3 | FL20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 12 ns | 12 ns | 5.6 ns | 12 ns | 5.1 ns | 8.5 ns | 4.2 ns | 5.2 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | NO | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | - | 225 |
| Maximum time at peak reflow temperature | 30 | 20 | 30 | 30 | 20 | 20 | - | 30 |
| package instruction | - | - | DFP, FL20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 |
京公网安备 11010802033920号
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