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S25FL256SAGNFI001

Categorystorage    The FLASH memory   
File Size5MB,146 Pages
ManufacturerCypress Semiconductor
Download Datasheet Compare View All

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S25FL128S/S25FL256S
128 Mb (16 MB)/256 Mb (32 MB)
3.0V SPI Flash Memory
Features
CMOS 3.0 Volt Core with Versatile I/O
SPI with Multi-I/O
SPI Clock polarity and phase modes 0 and 3
DDR option
Extended Addressing: 24- or 32-bit address options
Serial Command set and footprint compatible with
S25FL-A, S25FL-K, and S25FL-P SPI families
Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
AutoBoot - power up or reset and execute a Normal or Quad
read command automatically at a preselected address
Common Flash Interface (CFI) data for configuration infor-
mation.
Programming (1.5 MBps)
256 or 512 Byte Page Programming buffer options
Quad-Input Page Programming (QPP) for slow clock sys-
tems
Automatic ECC-internal hardware Error Correction Code
generation with single bit error correction
Erase (0.5 to 0.65 MBps)
Hybrid sector size option - physical set of thirty two 4-KB
sectors at top or bottom of address space with all remaining
sectors of 64 KB, for compatibility with prior generation S25-
FL devices
Uniform sector option - always erase 256-KB blocks for soft-
ware compatibility with higher density and future devices.
Cycling Endurance
100,000 Program-Erase Cycles, minimum
Data Retention
20 Year Data Retention, minimum
Security features
OTP array of 1024 bytes
Block Protection:
• Status Register bits to control protection against program
or erase of a contiguous range of sectors.
• Hardware and software control options
Advanced Sector Protection (ASP)
• Individual sector protection controlled by boot code or
password
Cypress
®
65 nm MirrorBit
®
Technology with Eclipse
Architecture
Core Supply Voltage: 2.7V to 3.6V
I/O Supply Voltage: 1.65V to 3.6V
SO16 and FBGA packages
Temperature Range / Grade:
Industrial (40°C to +85°C)
Industrial Plus (40°C to +105°C)
Automotive AEC-Q100 Grade 3 (40°C to +85°C)
Automotive AEC-Q100 Grade 2 (40°C to +105°C)
Automotive AEC-Q100 Grade 1 (40°C to +125°C)
Packages (all Pb-free)
16-lead SOIC (300 mil)
WSON 6
8 mm
BGA-24 6
8 mm
• 5
5 ball (FAB024) and 4
6 ball (FAC024) footprint
options
• Known Good Die (KGD) and Known Tested Die
Logic Block Diagram
CS#
SCK
SI/IO0
SO/IO1
I/O
WP#/IO2
HOLD#/IO3
RESET#
Data Path
Control
Logic
X Decoders
SRAM
MirrorBit Array
Y Decoders
Data Latch
Cypress Semiconductor Corporation
Document Number: 001-98283 Rev. *Q
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised April 30, 2019

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