F10124DCQM datasheet, PDF - EEWORLD Datasheet

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F10124DCQM: DescriptionTTL to ECL Translator, ECL10K, CDIP16,; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size102KB，2 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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F10124DCQM Overview

TTL to ECL Translator, ECL10K, CDIP16,

F10124DCQM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	compliant
Interface integrated circuit type	TTL TO ECL TRANSLATOR
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5,-5.2 V
Certification status	Not Qualified
surface mount	NO
technology	ECL10K
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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F10124DCQM Related Products

	F10124DCQM	F10124DCQR	F10124PCQR	F10124PCQM	F10124PC	F10124FC	F10124FCQM
Description	TTL to ECL Translator, ECL10K, CDIP16,	TTL to ECL Translator, ECL10K, CDIP16,	TTL to ECL Translator, ECL10K, PDIP16,	TTL to ECL Translator, ECL10K, PDIP16,	TTL to ECL Translator, ECL10K, PDIP16,	TTL to ECL Translator, ECL10K, CDFP16,	TTL to ECL Translator, ECL10K, CDFP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Interface integrated circuit type	TTL TO ECL TRANSLATOR	TTL TO ECL TRANSLATOR	TTL TO ECL TRANSLATOR	TTL TO ECL TRANSLATOR	TTL TO ECL TRANSLATOR	TTL TO ECL TRANSLATOR	TTL TO ECL TRANSLATOR
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDFP-F16	R-XDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DFP	DFP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	FLATPACK
power supply	5,-5.2 V	5,-5.2 V	5,-5.2 V	5,-5.2 V	5,-5.2 V	5,-5.2 V	5,-5.2 V
surface mount	NO	NO	NO	NO	NO	YES	YES
technology	ECL10K	ECL10K	ECL10K	ECL10K	ECL10K	ECL10K	ECL10K
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified

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