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F10124FC

Description
TTL to ECL Translator, ECL10K, CDFP16,
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size102KB,2 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

F10124FC Overview

TTL to ECL Translator, ECL10K, CDFP16,

F10124FC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codecompliant
Interface integrated circuit typeTTL TO ECL TRANSLATOR
JESD-30 codeR-XDFP-F16
JESD-609 codee0
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL16,.3
Package shapeRECTANGULAR
Package formFLATPACK
power supply5,-5.2 V
Certification statusNot Qualified
surface mountYES
technologyECL10K
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

F10124FC Related Products

F10124FC F10124DCQR F10124DCQM F10124PCQR F10124PCQM F10124PC F10124FCQM
Description TTL to ECL Translator, ECL10K, CDFP16, TTL to ECL Translator, ECL10K, CDIP16, TTL to ECL Translator, ECL10K, CDIP16, TTL to ECL Translator, ECL10K, PDIP16, TTL to ECL Translator, ECL10K, PDIP16, TTL to ECL Translator, ECL10K, PDIP16, TTL to ECL Translator, ECL10K, CDFP16,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
Interface integrated circuit type TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR
JESD-30 code R-XDFP-F16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDIP-T16 R-XDFP-F16
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC
encapsulated code DFP DIP DIP DIP DIP DIP DFP
Encapsulate equivalent code FL16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 FL16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE FLATPACK
power supply 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V
surface mount YES NO NO NO NO NO YES
technology ECL10K ECL10K ECL10K ECL10K ECL10K ECL10K ECL10K
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified Not Qualified
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