TTL to ECL Translator, ECL10K, CDFP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | compliant |
| Interface integrated circuit type | TTL TO ECL TRANSLATOR |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5,-5.2 V |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | ECL10K |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| F10124FCQM | F10124DCQR | F10124DCQM | F10124PCQR | F10124PCQM | F10124PC | F10124FC | |
|---|---|---|---|---|---|---|---|
| Description | TTL to ECL Translator, ECL10K, CDFP16, | TTL to ECL Translator, ECL10K, CDIP16, | TTL to ECL Translator, ECL10K, CDIP16, | TTL to ECL Translator, ECL10K, PDIP16, | TTL to ECL Translator, ECL10K, PDIP16, | TTL to ECL Translator, ECL10K, PDIP16, | TTL to ECL Translator, ECL10K, CDFP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Interface integrated circuit type | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR |
| JESD-30 code | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDFP-F16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DFP | DIP | DIP | DIP | DIP | DIP | DFP |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| power supply | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| surface mount | YES | NO | NO | NO | NO | NO | YES |
| technology | ECL10K | ECL10K | ECL10K | ECL10K | ECL10K | ECL10K | ECL10K |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Certification status | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
京公网安备 11010802033920号
EEWORLD
