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F10124PCQM

Description
TTL to ECL Translator, ECL10K, PDIP16,
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size102KB,2 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
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F10124PCQM Overview

TTL to ECL Translator, ECL10K, PDIP16,

F10124PCQM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codecompliant
Interface integrated circuit typeTTL TO ECL TRANSLATOR
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5,-5.2 V
Certification statusNot Qualified
surface mountNO
technologyECL10K
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

F10124PCQM Related Products

F10124PCQM F10124DCQR F10124DCQM F10124PCQR F10124PC F10124FC F10124FCQM
Description TTL to ECL Translator, ECL10K, PDIP16, TTL to ECL Translator, ECL10K, CDIP16, TTL to ECL Translator, ECL10K, CDIP16, TTL to ECL Translator, ECL10K, PDIP16, TTL to ECL Translator, ECL10K, PDIP16, TTL to ECL Translator, ECL10K, CDFP16, TTL to ECL Translator, ECL10K, CDFP16,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
Interface integrated circuit type TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR TTL TO ECL TRANSLATOR
JESD-30 code R-PDIP-T16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16 R-PDIP-T16 R-XDFP-F16 R-XDFP-F16
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP DIP DIP DIP DIP DFP DFP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 FL16,.3 FL16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE FLATPACK FLATPACK
power supply 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V 5,-5.2 V
surface mount NO NO NO NO NO YES YES
technology ECL10K ECL10K ECL10K ECL10K ECL10K ECL10K ECL10K
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT FLAT
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1 1 1 1
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified Not Qualified
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