|
MX23C3210TI-10 |
MX23C3210TI-12 |
MX23C3210TC-12G |
MX23C3210TC-10G |
MX23C3210PC-12G |
MX23C3210PC-10G |
MX23C3210MC-12G |
MX23C3210MC-10G |
| Description |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
5 Volt 32-Mbit (4M x 8 / 2M x 16) Mask ROM |
| Is it Rohs certified? |
incompatible |
incompatible |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Maker |
Macronix |
Macronix |
Macronix |
Macronix |
Macronix |
Macronix |
Macronix |
Macronix |
| Parts packaging code |
TSOP1 |
TSOP1 |
TSOP1 |
TSOP1 |
DIP |
DIP |
SOIC |
SOIC |
| package instruction |
TSSOP, TSSOP48,.8,20 |
TSSOP, TSSOP48,.8,20 |
TSSOP, TSSOP48,.8,20 |
TSSOP, TSSOP48,.8,20 |
DIP, DIP42,.6 |
DIP, DIP42,.6 |
SOP, SOP44,.63 |
SOP, SOP44,.63 |
| Contacts |
48 |
48 |
48 |
48 |
42 |
42 |
44 |
44 |
| Reach Compliance Code |
unknow |
unknow |
unknow |
unknow |
unknow |
unknow |
unknow |
unknow |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum access time |
100 ns |
120 ns |
120 ns |
100 ns |
120 ns |
100 ns |
120 ns |
100 ns |
| Other features |
CAN ALSO BE CONFIGURED AS 2M X 16 |
CAN ALSO BE CONFIGURED AS 2M X 16 |
CAN ALSO BE CONFIGURED AS 2M X 16 |
CAN ALSO BE CONFIGURED AS 2M X 16 |
CAN ALSO BE CONFIGURED AS 2M X 16 |
CAN ALSO BE CONFIGURED AS 2M X 16 |
CAN ALSO BE CONFIGURED AS 2M X 16 |
CAN ALSO BE CONFIGURED AS 2M X 16 |
| Spare memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
| JESD-30 code |
R-PDSO-G48 |
R-PDSO-G48 |
R-PDSO-G48 |
R-PDSO-G48 |
R-PDIP-T42 |
R-PDIP-T42 |
R-PDSO-G44 |
R-PDSO-G44 |
| length |
18.4 mm |
18.4 mm |
18.4 mm |
18.4 mm |
51.94 mm |
51.94 mm |
28.5 mm |
28.5 mm |
| memory density |
33554432 bi |
33554432 bi |
33554432 bi |
33554432 bi |
33554432 bi |
33554432 bi |
33554432 bi |
33554432 bi |
| Memory IC Type |
MASK ROM |
MASK ROM |
MASK ROM |
MASK ROM |
MASK ROM |
MASK ROM |
MASK ROM |
MASK ROM |
| memory width |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
48 |
48 |
48 |
48 |
42 |
42 |
44 |
44 |
| word count |
2097152 words |
2097152 words |
2097152 words |
2097152 words |
2097152 words |
2097152 words |
2097152 words |
2097152 words |
| character code |
2000000 |
2000000 |
2000000 |
2000000 |
2000000 |
2000000 |
2000000 |
2000000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
85 °C |
85 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
| organize |
2MX16 |
2MX16 |
2MX16 |
2MX16 |
2MX16 |
2MX16 |
2MX16 |
2MX16 |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
DIP |
DIP |
SOP |
SOP |
| Encapsulate equivalent code |
TSSOP48,.8,20 |
TSSOP48,.8,20 |
TSSOP48,.8,20 |
TSSOP48,.8,20 |
DIP42,.6 |
DIP42,.6 |
SOP44,.63 |
SOP44,.63 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
260 |
| power supply |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
4.9 mm |
4.9 mm |
3 mm |
3 mm |
| Maximum standby current |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
| Maximum slew rate |
0.06 mA |
0.06 mA |
0.06 mA |
0.06 mA |
0.06 mA |
0.06 mA |
0.06 mA |
0.06 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
NO |
NO |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
40 |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
40 |
| width |
12 mm |
12 mm |
12 mm |
12 mm |
15.24 mm |
15.24 mm |
12.6 mm |
12.6 mm |
| JESD-609 code |
e0 |
e0 |
e6 |
e6 |
- |
- |
e3 |
e3 |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Bismuth (Sn/Bi) |
Tin/Bismuth (Sn/Bi) |
- |
- |
Matte Tin (Sn) |
Matte Tin (Sn) |