AM29C01-1DC datasheet, PDF - EEWORLD Datasheet

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AM29C01-1DC: DescriptionBit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size676KB，23 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM29C01-1DC Overview

Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40

AM29C01-1DC Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknown
Is Samacsys	N
maximum clock frequency	33.3 MHz
External data bus width	4
JESD-30 code	R-GDIP-T40
length	52.324 mm
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum seat height	5.715 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR
Base Number Matches	1

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AM29C01-1DC Related Products

	AM29C01-1DC	AM29C01DC	AM29C01/BUA	AM29C01-1PC
Description	Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40	Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40	Bit-Slice Processor, 4-Bit, CMOS, CQCC44, CERAMIC, LCC-44	Bit-Slice Processor, 4-Bit, CMOS, PDIP40, PLASTIC, DIP-40
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DIP,	DIP,	QCCN,	DIP,
Reach Compliance Code	unknown	unknow	unknown	unknown
maximum clock frequency	33.3 MHz	32.26 MHz	31.25 MHz	33.3 MHz
External data bus width	4	4	4	4
JESD-30 code	R-GDIP-T40	R-GDIP-T40	S-CQCC-N44	R-PDIP-T40
length	52.324 mm	52.324 mm	16.51 mm	52.324 mm
Number of terminals	40	40	44	40
Maximum operating temperature	70 °C	70 °C	125 °C	70 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	QCCN	DIP
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
Maximum seat height	5.715 mm	5.715 mm	1.905 mm	5.715 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL
width	15.24 mm	15.24 mm	16.51 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR
Base Number Matches	1	1	1	-

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