AM29C01DC datasheet, PDF - EEWORLD Datasheet

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AM29C01DC: DescriptionBit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size676KB，23 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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AM29C01DC Overview

Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40

AM29C01DC Parametric

Parameter Name	Attribute value
Maker	Rochester Electronics
package instruction	DIP,
Reach Compliance Code	unknow
maximum clock frequency	32.26 MHz
External data bus width	4
JESD-30 code	R-GDIP-T40
length	52.324 mm
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum seat height	5.715 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR
Base Number Matches	1

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AM29C01DC Related Products

	AM29C01DC	AM29C01/BUA	AM29C01-1DC	AM29C01-1PC
Description	Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40	Bit-Slice Processor, 4-Bit, CMOS, CQCC44, CERAMIC, LCC-44	Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40	Bit-Slice Processor, 4-Bit, CMOS, PDIP40, PLASTIC, DIP-40
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
package instruction	DIP,	QCCN,	DIP,	DIP,
Reach Compliance Code	unknow	unknown	unknown	unknown
maximum clock frequency	32.26 MHz	31.25 MHz	33.3 MHz	33.3 MHz
External data bus width	4	4	4	4
JESD-30 code	R-GDIP-T40	S-CQCC-N44	R-GDIP-T40	R-PDIP-T40
length	52.324 mm	16.51 mm	52.324 mm	52.324 mm
Number of terminals	40	44	40	40
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	QCCN	DIP	DIP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
Maximum seat height	5.715 mm	1.905 mm	5.715 mm	5.715 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL
width	15.24 mm	16.51 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR
Base Number Matches	1	1	1	-

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