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AM29C01-1PC

Description
Bit-Slice Processor, 4-Bit, CMOS, PDIP40, PLASTIC, DIP-40
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size676KB,23 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

AM29C01-1PC Overview

Bit-Slice Processor, 4-Bit, CMOS, PDIP40, PLASTIC, DIP-40

AM29C01-1PC Parametric

Parameter NameAttribute value
MakerRochester Electronics
package instructionDIP,
Reach Compliance Codeunknown
maximum clock frequency33.3 MHz
External data bus width4
JESD-30 codeR-PDIP-T40
length52.324 mm
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Maximum seat height5.715 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
uPs/uCs/peripheral integrated circuit typeBIT-SLICE MICROPROCESSOR

AM29C01-1PC Related Products

AM29C01-1PC AM29C01DC AM29C01/BUA AM29C01-1DC
Description Bit-Slice Processor, 4-Bit, CMOS, PDIP40, PLASTIC, DIP-40 Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40 Bit-Slice Processor, 4-Bit, CMOS, CQCC44, CERAMIC, LCC-44 Bit-Slice Processor, 4-Bit, CMOS, CDIP40, CERAMIC, DIP-40
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
package instruction DIP, DIP, QCCN, DIP,
Reach Compliance Code unknown unknow unknown unknown
maximum clock frequency 33.3 MHz 32.26 MHz 31.25 MHz 33.3 MHz
External data bus width 4 4 4 4
JESD-30 code R-PDIP-T40 R-GDIP-T40 S-CQCC-N44 R-GDIP-T40
length 52.324 mm 52.324 mm 16.51 mm 52.324 mm
Number of terminals 40 40 44 40
Maximum operating temperature 70 °C 70 °C 125 °C 70 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
encapsulated code DIP DIP QCCN DIP
Package shape RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER IN-LINE
Maximum seat height 5.715 mm 5.715 mm 1.905 mm 5.715 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO YES NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL QUAD DUAL
width 15.24 mm 15.24 mm 16.51 mm 15.24 mm
uPs/uCs/peripheral integrated circuit type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
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