LBA126L is a Dual 1 Form-A solid state relay that has
two independently controlled optically coupled
MOSFETs with an additional current limiting circuit.
The efficient MOSFET switches and photovoltaic die
use Clare’s patented OptoMOS architecture to provide
3750 V
RMS
of input to output isolation. The optically
coupled inputs are controlled by highly efficient
GaAIAs infrared LEDs. Dual pole OptoMOS relays
provide a more compact design solution than discrete
single pole relays in a variety of applications. The dual
pole relays save board space by incorporating both
relays in a single 8-pin package.
Approvals
•
UL Recognized: File Number E76270
•
CSA Certified: File Number LR 43639-10
•
Certified to:
•
EN 60950
•
EN 41003
•
IEC950
•
AS/NZS 3260
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket
Size)
•
Hookswitch
•
Dial Pulsing
•
Ground Start
•
Ringer Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LBA126L
LBA126PL
LBA126PLTR
LBA126LS
LBA126LSTR
Description
8 Pin DIP (50/Tube)
8 Pin Flatpack (50/Tube)
8 Pin Flatpack (1000/Reel)
8 Pin Surface Mount (50/Tube)
8 Pin Surface Mount (50/Reel)
Pin Configuration
LBA126L Pinout
AC/DC Configuration
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
1
2
3
4
8
7
6
5
Normally Open Pole
Normally Closed Pole
Switching Characteristics
of Normally Open (Form
A) Devices
10ms
CONTROL
Switching Characteristics
of Normally Closed (Form
B) Devices
10ms
CONTROL
+
90%
LOAD
10%
+
T
ON
10%+
T
OFF
+90%
+10%
T
OFF
+
90%
T
ON
DS-LBA126L-R1.0
www.clare.com
1
LBA126L
Absolute Maximum Ratings (@ 25˚ C)
Parameter
Input Power Dissipation
Input Control Current
Peak (10ms)
Blocking Voltage
DC or AC peak
Reverse Input Voltage
Total Power Dissipation
Isolation Voltage
Input to Output
Operational Temperature
Storage Temperature
Soldering Temperature
DIP Package
Flatpack/Surface Mount
Package
(10 Seconds Max.)
1
2
Min
-
-
-
-
-
-
3750
-40
-40
-
-
Typ Max Units
-
-
-
-
-
-
-
-
-
-
-
150
1
50
1
250
5
800
2
-
+85
+125
+260
+220
mW
mA
A
V
V
mW
V
RMS
°C
°C
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure
of the device to the absolute maximum ratings for an
extended period may degrade the device and effect its
reliability.
Derate Linearly 1.33 mw/˚C
Derate Linearly 6.67 mw/˚C
Electrical Characteristics
Parameter
Output Characteristics @ 25°C
Load Current *(Continuous)
AC/DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Load Current Limiting
Input Characteristics @ 25°C
Input Control Current
Input Dropout Current
Input Voltage Drop
Reverse Input Voltage
Reverse Input Current
Common Characteristics @ 25°C
Input to Output Capacitance
-
C
I/O
-
3
-
pF
*NOTE: If both poles operate simultaneously load current must be derated so as not to exceed the package power dissipation value.
Conditions
Symbol
Min
Typ
Max
Units
-
10ms
I
L
=150mA
V
L
=250V
I
F
=5mA, V
L
=10V
I
F
=5mA, V
L
=10V
50V; f=1MHz
I
ON
I
LPK
R
ON
I
LEAK
T
ON
T
OFF
C
OUT
I
CL
-
-
-
-
-
-
170
5
0.4
0.9
-
-
-
-
-
-
-
50
235
-
0.7
1.2
-
-
150
400
20
1
5
5
-
280
50
-
1.4
5
10
mA
mA
Ω
µA
ms
ms
pF
mA
mA
mA
V
V
µA
I
L
=150mA
-
I
F
=5mA
-
V
R
=5V
I
F
-
V
F
V
R
I
R
2
www.clare.com
Rev. 1.0
LBA126L
MECHANICAL DIMENSIONS
9.652
±
.381
(.380
±
.015)
2.540
±
.127
(.100
±
.005)
8 Pin Flatpack (“P” Suffix)
PC Board Pattern
(Top View)
2.540
±
.127
(.100
±
.005)
9.398
±
.127
(.370
±
.005)
2.159 TYP.
(.085)
7.620
±
.254
(.300
±
.010)
6.350
±
.127
(.250
±
.005)
.203
(.008)
.457
±
.076
(.018
±
.003)
8.077
±
.127
(.318
±
.005)
2.286 MAX.
.635
±
.127
(.090)
(.025)
8.763
±
.127
(.345
±
.005)
1.193
(.047)
.787
(.031)
8 Pin DIP Surface Mount (“S” Suffix)
7.620
±
.254
(.300
±
.010)
4.445
±
.127
(.175
±
.005)
3.302
(.130)
.635 TYP.
(.025)
.254 TYP.
(.010)
6.350
±
.127
(.250
±
.005)
9.652
±
.381
(.380
±
.015)
2.540
±
.127
(.100
±
.005)
PC Board Pattern
(Top View)
2.540
±
.127
(.100
±
.005)
9.525
±
.254
(.375
±
.010)
1.905
±
.127
(.075
±
.005)
.457
±
.076
(.018
±
.003)
8.077
±
.127
(.318
±
.005)
1.498
±
.127
(.059
±
.005)
8.305
±
.127
(.327
±
.005)
Tape and Reel Packaging for 8 Pin Flatpack Package
330.2 DIA.
(13.00)
2.007
±
.102 1.498
±
.102 3.987
±
.102
(.079
±
.004) (.059
±
.004) (.157
±
.004)
Top Cover
Tape Thickness
.102 MAX.
(.004)
6.731 MAX.
1.753
±
0.102
(.265)
(.069
±
.004)
.406 MAX.
(.016)
7.493
±
.102
(.295
±
.004)
1
8
16.002
±
.305
(.630
±
.012)
10.287
(.405)
12.090
(.476)
4.877
(.192)
Embossed Carrier
Top Cover
Tape
.050R TYP.
11.988
±
.102
(.472
±
.004)
User Direction of Feed
10.287
±
.102
(.405
±
.004)
1.549
±
.102
(.061
±
.004)
Embossment
Tape and Reel Packaging for 8 Pin Surface Mount Package
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
2.007
±
.102 1.498
±
.102 3.987
±
.102
(.079
±
.004) (.059
±
.004) (.157
±
.004)
6.731 MAX.
1.753
±
.102
(.265)
(.069
±
.004)
.406 MAX.
(.016)
7.493
±
.102
(.295
±
.004)
12.090
(.476)
4.877
(.192)
1
8
16.002
±
.30
(.630
±
.012
10.300
(.405)
Embossed Carrier
Top Cover
Tape
.050R TYP.
11.989
±
.102
(.472
±
.004)
User Direction of Feed
10.300
±
.102
(.405
±
.004)
1.549
±
.102
(.061
±
.004)
Embossment
Dimensions
mm
(inches)
Rev. 1.0
www.clare.com
3
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions
at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to sup-
port or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or
make changes to its products at any time without notice.
Jiangshan Technology's latest JS-9500 memory tester (SD/DDR/DDR2/DDR3) is the industry's leading software and hardware testing system, using the most advanced automatic storage test program in the int...
My keyboard is 4X4, and there are numbers 0-9, and the other 5 keys are menu, confirm, cancel, line feed, left, right, or. In the example I saw yesterday, there were only function keys defined. I woul...
The file system filter driver is not based on sfilter as a template. Almost all functions are written by myself or found from the Internet. (List processes and check file paths, only two functions) Af...
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
Have you ever heard stories about "crazy appliances"? Think of microwaves that turn on automatically or ovens that preheat without any human input? With radios and electromagnetic interfaces ubiqui...[Details]
My career has been closely tied to the semiconductor industry. From product management to content marketing, I've provided countless forecasts and predictions across a variety of roles. Whethe...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
Charging is an essential topic for electric vehicles. Batteries are a core component of new energy vehicles. So, what's the optimal charge level for electric vehicles? Based on current battery tech...[Details]
Tires are a very important component for cars. They are related to the driving experience of the vehicle. We are almost inseparable from cars in our daily lives. For tires, according to the role of...[Details]
From time to time, I see some audiophiles spending a lot of money or a lot of time to DIY speakers, but the results are not what they want. Below I list some of the small experiences I summarized b...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
PCB Design
京公网安备 11010802033920号
EEWORLD
