RAD-HARD 3 TO 8 LINE DECODER/LATCH (INVERTING)

| M54HC137_04 | M54HC137D | M54HC137 | M54HC137K | M54HC137K1 | M54HC137D1 | |
|---|---|---|---|---|---|---|
| Description | RAD-HARD 3 TO 8 LINE DECODER/LATCH (INVERTING) | RAD-HARD 3 TO 8 LINE DECODER/LATCH (INVERTING) | RAD-HARD 3 TO 8 LINE DECODER/LATCH (INVERTING) | RAD-HARD 3 TO 8 LINE DECODER/LATCH (INVERTING) | RAD-HARD 3 TO 8 LINE DECODER/LATCH (INVERTING) | RAD-HARD 3 TO 8 LINE DECODER/LATCH (INVERTING) |
| Is it lead-free? | - | Contains lead | - | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | - | incompatible | incompatible | incompatible |
| Maker | - | STMicroelectronics | - | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | - | DIP | - | DFP | DFP | DIP |
| package instruction | - | DIP, DIP16,.3 | - | CERAMIC, DFP-16 | CERAMIC, DFP-16 | DIP, DIP16,.3 |
| Contacts | - | 16 | - | 16 | 16 | 16 |
| Reach Compliance Code | - | _compli | - | _compli | _compli | _compli |
| ECCN code | - | EAR99 | - | EAR99 | EAR99 | EAR99 |
| series | - | HC/UH | - | HC/UH | HC/UH | HC/UH |
| Input adjustment | - | LATCHED | - | LATCHED | LATCHED | LATCHED |
| JESD-30 code | - | R-CDIP-T16 | - | R-CDFP-F16 | R-CDFP-F16 | R-CDIP-T16 |
| JESD-609 code | - | e0 | - | e0 | e0 | e0 |
| length | - | 20.32 mm | - | 9.94 mm | 9.94 mm | 20.32 mm |
| Load capacitance (CL) | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | - | OTHER DECODER/DRIVER | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| MaximumI(ol) | - | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A |
| Number of functions | - | 1 | - | 1 | 1 | 1 |
| Number of terminals | - | 16 | - | 16 | 16 | 16 |
| Maximum operating temperature | - | 125 °C | - | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | - | -55 °C | -55 °C | -55 °C |
| Output polarity | - | INVERTED | - | INVERTED | INVERTED | INVERTED |
| Package body material | - | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | - | DIP | - | DFP | DFP | DIP |
| Encapsulate equivalent code | - | DIP16,.3 | - | FL16,.3 | FL16,.3 | DIP16,.3 |
| Package shape | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | - | FLATPACK | FLATPACK | IN-LINE |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | - | 2/6 V | - | 2/6 V | 2/6 V | 2/6 V |
| Prop。Delay @ Nom-Su | - | 22 ns | - | 22 ns | 22 ns | 22 ns |
| propagation delay (tpd) | - | 110 ns | - | 110 ns | 110 ns | 110 ns |
| Certification status | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 3.83 mm | - | 2.38 mm | 2.38 mm | 3.83 mm |
| Maximum supply voltage (Vsup) | - | 6 V | - | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | - | 2 V | - | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | - | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| surface mount | - | NO | - | YES | YES | NO |
| technology | - | CMOS | - | CMOS | CMOS | CMOS |
| Temperature level | - | MILITARY | - | MILITARY | MILITARY | MILITARY |
| Terminal surface | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | - | FLAT | FLAT | THROUGH-HOLE |
| Terminal pitch | - | 2.54 mm | - | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | - | DUAL | - | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| total dose | - | 50k Rad(Si) V | - | 50k Rad(Si) V | 50k Rad(Si) V | 50k Rad(Si) V |
| width | - | 7.62 mm | - | 6.91 mm | 6.91 mm | 7.62 mm |