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2SK2570ZL-TL-E

Description
Silicon N Channel MOS FET Low Frequency Power Switching
CategoryDiscrete semiconductor    The transistor   
File Size166KB,7 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
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2SK2570ZL-TL-E Overview

Silicon N Channel MOS FET Low Frequency Power Switching

2SK2570ZL-TL-E Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeSC-59A
package instructionSMALL OUTLINE, R-PDSO-G3
Contacts3
Reach Compliance Codeunknow
ECCN codeEAR99
Factory Lead Time1 week
ConfigurationSINGLE WITH BUILT-IN DIODE AND RESISTOR
Minimum drain-source breakdown voltage20 V
Maximum drain current (Abs) (ID)0.2 A
Maximum drain current (ID)0.2 A
Maximum drain-source on-resistance1.1 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PDSO-G3
Humidity sensitivity level1
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)0.15 W
Maximum pulsed drain current (IDM)0.4 A
Certification statusNot Qualified
surface mountYES
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Base Number Matches1
2SK2570
Silicon N Channel MOS FET
Low Frequency Power Switching
REJ03G1019-0200
(Previous: ADE-208-574)
Rev.2.00
Sep 07, 2005
Features
Low on-resistance
R
DS(on)
= 0.8
typ. (V
GS
= 4 V, I
D
= 100 mA)
2.5 V gate drive devices.
Small package (MPAK)
Outline
RENESAS Package code: PLSP0003ZB-A
(Package name: MPAK)
D
3
1
2
G
1. Source
2. Gate
3. Drain
S
Note:
Marking is “ZL–”
Rev.2.00 Sep 07, 2005 page 1 of 6

2SK2570ZL-TL-E Related Products

2SK2570ZL-TL-E 2SK2570 2SK2570ZL-TR-E
Description Silicon N Channel MOS FET Low Frequency Power Switching Silicon N Channel MOS FET Low Frequency Power Switching Silicon N Channel MOS FET Low Frequency Power Switching
Parts packaging code SC-59A SOT-23 SC-59A
package instruction SMALL OUTLINE, R-PDSO-G3 TO-236MOD, 3 PIN SMALL OUTLINE, R-PDSO-G3
Contacts 3 3 3
Reach Compliance Code unknow compli unknow
ECCN code EAR99 EAR99 EAR99
Configuration SINGLE WITH BUILT-IN DIODE AND RESISTOR SINGLE WITH BUILT-IN DIODE AND RESISTOR SINGLE WITH BUILT-IN DIODE AND RESISTOR
Minimum drain-source breakdown voltage 20 V 20 V 20 V
Maximum drain current (Abs) (ID) 0.2 A 0.2 A 0.2 A
Maximum drain current (ID) 0.2 A 0.2 A 0.2 A
Maximum drain-source on-resistance 1.1 Ω 1.1 Ω 1.1 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 code R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
Number of components 1 1 1
Number of terminals 3 3 3
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL
Maximum power dissipation(Abs) 0.15 W 0.15 W 0.15 W
Certification status Not Qualified Not Qualified Not Qualified
surface mount YES YES YES
Terminal form GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL
transistor applications SWITCHING SWITCHING SWITCHING
Transistor component materials SILICON SILICON SILICON
Base Number Matches 1 1 1
Is it Rohs certified? conform to - conform to
Peak Reflow Temperature (Celsius) 260 - NOT SPECIFIED
Maximum pulsed drain current (IDM) 0.4 A - 0.4 A
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED

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