HD74AC367AP datasheet, PDF - EEWORLD Datasheet

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HD74AC367AP: DescriptionHex Buffer/Driver with 3-State Output; Categorylogic logic; File Size210KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD74AC367AP Overview

Hex Buffer/Driver with 3-State Output

HD74AC367AP Parametric

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	compliant
Other features	ONE FUNCTION HAS 2 BITS
Control type	ENABLE LOW
series	AC
JESD-30 code	R-PDIP-T16
length	19.2 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.012 A
Number of digits	4
Number of functions	2
Number of ports	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	3.3/5 V
Prop。Delay @ Nom-Sup	10 ns
propagation delay (tpd)	10 ns
Certification status	Not Qualified
Maximum seat height	5.06 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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HD74AC367

Hex Buffer/Driver with 3-State Output

REJ03D0271–0200Z

(Previous ADE-205-392 (Z))

Rev.2.00

Jul.16.2004

Features

•

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers

•

Outputs Source/Sink 24 mA

•

Ordering Information

Part Name

HD74AC367AP

Package Type

DIP-16 pin

Package Code Package Abbreviation Taping Abbreviation (Quantity)

DP-16E, -16FV

FP-16DAV

TTP-16DAV

—

EL (2,000 pcs/reel)

EL (2,500 pcs/reel)

ELL(2,000 pcs/reel)

HD74AC367AFPEL SOP-16 pin (JEITA)

HD74AC367TELL

TSSOP-16 pin

HD74AC367ARPEL SOP-16 pin (JEDEC) FP-16DNV

Notes: 1. Please consult the sales office for the above package availability.

2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of

the package code.

Pin Arrangement

GND

(Top view)

16 V

14 I

13 O

12 I

11 O

10 I

Rev.2.00, Jul.16.2004, page 1 of 7

HD74AC367AP Related Products

	HD74AC367AP	HD74AC367ARPEL	HD74AC367	HD74AC367AFPEL	HD74AC367TELL
Description	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	DIP	SOIC	-	SOIC	TSSOP
package instruction	DIP, DIP16,.3	SOP, SOP16,.25	-	SOP, SOP16,.3	TSSOP, TSSOP16,.25
Contacts	16	16	-	16	16
Reach Compliance Code	compliant	compliant	-	compliant	compliant
Other features	ONE FUNCTION HAS 2 BITS	ONE FUNCTION HAS 2 BITS	-	ONE FUNCTION HAS 2 BITS	ONE FUNCTION HAS 2 BITS
Control type	ENABLE LOW	ENABLE LOW	-	ENABLE LOW	ENABLE LOW
series	AC	AC	-	AC	AC
JESD-30 code	R-PDIP-T16	R-PDSO-G16	-	R-PDSO-G16	R-PDSO-G16
length	19.2 mm	9.9 mm	-	10.06 mm	5 mm
Load capacitance (CL)	50 pF	50 pF	-	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	-	BUS DRIVER	BUS DRIVER
MaximumI(ol)	0.012 A	0.012 A	-	0.012 A	0.012 A
Number of digits	4	4	-	4	4
Number of functions	2	2	-	2	2
Number of ports	2	2	-	2	2
Number of terminals	16	16	-	16	16
Maximum operating temperature	85 °C	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE
Output polarity	TRUE	TRUE	-	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	-	SOP	TSSOP
Encapsulate equivalent code	DIP16,.3	SOP16,.25	-	SOP16,.3	TSSOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	3.3/5 V	3.3/5 V	-	3.3/5 V	3.3/5 V
Prop。Delay @ Nom-Sup	10 ns	10 ns	-	10 ns	10 ns
propagation delay (tpd)	10 ns	10 ns	-	10 ns	10 ns
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	5.06 mm	1.75 mm	-	2.2 mm	1.1 mm
Maximum supply voltage (Vsup)	6 V	6 V	-	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	-	2 V	2 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	-	3.3 V	3.3 V
surface mount	NO	YES	-	YES	YES
technology	CMOS	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	-	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	-	1.27 mm	0.65 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL
width	7.62 mm	3.95 mm	-	5.5 mm	4.4 mm
Base Number Matches	1	1	-	1	1
method of packing	-	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL

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