HD74AC367AFPEL datasheet, PDF - EEWORLD Datasheet

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HD74AC367AFPEL: DescriptionHex Buffer/Driver with 3-State Output; Categorylogic logic; File Size210KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD74AC367AFPEL Overview

Hex Buffer/Driver with 3-State Output

HD74AC367AFPEL Parametric

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
Parts packaging code	SOIC
package instruction	SOP, SOP16,.3
Contacts	16
Reach Compliance Code	compliant
Other features	ONE FUNCTION HAS 2 BITS
Control type	ENABLE LOW
series	AC
JESD-30 code	R-PDSO-G16
length	10.06 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.012 A
Number of digits	4
Number of functions	2
Number of ports	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
method of packing	TAPE AND REEL
power supply	3.3/5 V
Prop。Delay @ Nom-Sup	10 ns
propagation delay (tpd)	10 ns
Certification status	Not Qualified
Maximum seat height	2.2 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	5.5 mm
Base Number Matches	1

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HD74AC367

Hex Buffer/Driver with 3-State Output

REJ03D0271–0200Z

(Previous ADE-205-392 (Z))

Rev.2.00

Jul.16.2004

Features

•

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers

•

Outputs Source/Sink 24 mA

•

Ordering Information

Part Name

HD74AC367AP

Package Type

DIP-16 pin

Package Code Package Abbreviation Taping Abbreviation (Quantity)

DP-16E, -16FV

FP-16DAV

TTP-16DAV

—

EL (2,000 pcs/reel)

EL (2,500 pcs/reel)

ELL(2,000 pcs/reel)

HD74AC367AFPEL SOP-16 pin (JEITA)

HD74AC367TELL

TSSOP-16 pin

HD74AC367ARPEL SOP-16 pin (JEDEC) FP-16DNV

Notes: 1. Please consult the sales office for the above package availability.

2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of

the package code.

Pin Arrangement

GND

(Top view)

16 V

14 I

13 O

12 I

11 O

10 I

Rev.2.00, Jul.16.2004, page 1 of 7

HD74AC367AFPEL Related Products

	HD74AC367AFPEL	HD74AC367AP	HD74AC367ARPEL	HD74AC367	HD74AC367TELL
Description	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	-	Renesas Electronics Corporation
Parts packaging code	SOIC	DIP	SOIC	-	TSSOP
package instruction	SOP, SOP16,.3	DIP, DIP16,.3	SOP, SOP16,.25	-	TSSOP, TSSOP16,.25
Contacts	16	16	16	-	16
Reach Compliance Code	compliant	compliant	compliant	-	compliant
Other features	ONE FUNCTION HAS 2 BITS	ONE FUNCTION HAS 2 BITS	ONE FUNCTION HAS 2 BITS	-	ONE FUNCTION HAS 2 BITS
Control type	ENABLE LOW	ENABLE LOW	ENABLE LOW	-	ENABLE LOW
series	AC	AC	AC	-	AC
JESD-30 code	R-PDSO-G16	R-PDIP-T16	R-PDSO-G16	-	R-PDSO-G16
length	10.06 mm	19.2 mm	9.9 mm	-	5 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	-	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	-	BUS DRIVER
MaximumI(ol)	0.012 A	0.012 A	0.012 A	-	0.012 A
Number of digits	4	4	4	-	4
Number of functions	2	2	2	-	2
Number of ports	2	2	2	-	2
Number of terminals	16	16	16	-	16
Maximum operating temperature	85 °C	85 °C	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	-	3-STATE
Output polarity	TRUE	TRUE	TRUE	-	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SOP	-	TSSOP
Encapsulate equivalent code	SOP16,.3	DIP16,.3	SOP16,.25	-	TSSOP16,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL	-	TAPE AND REEL	-	TAPE AND REEL
power supply	3.3/5 V	3.3/5 V	3.3/5 V	-	3.3/5 V
Prop。Delay @ Nom-Sup	10 ns	10 ns	10 ns	-	10 ns
propagation delay (tpd)	10 ns	10 ns	10 ns	-	10 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	2.2 mm	5.06 mm	1.75 mm	-	1.1 mm
Maximum supply voltage (Vsup)	6 V	6 V	6 V	-	6 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	-	2 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	-	3.3 V
surface mount	YES	NO	YES	-	YES
technology	CMOS	CMOS	CMOS	-	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	-	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	-	0.65 mm
Terminal location	DUAL	DUAL	DUAL	-	DUAL
width	5.5 mm	7.62 mm	3.95 mm	-	4.4 mm
Base Number Matches	1	1	1	-	1

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