HD74AC367 datasheet, PDF - EEWORLD Datasheet

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HD74AC367: DescriptionHex Buffer/Driver with 3-State Output; File Size210KB，8 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD74AC367 Overview

Hex Buffer/Driver with 3-State Output

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HD74AC367

Hex Buffer/Driver with 3-State Output

REJ03D0271–0200Z

(Previous ADE-205-392 (Z))

Rev.2.00

Jul.16.2004

Features

•

3-State Outputs Drive Bus Lines or Buffer Memory Address Registers

•

Outputs Source/Sink 24 mA

•

Ordering Information

Part Name

HD74AC367AP

Package Type

DIP-16 pin

Package Code Package Abbreviation Taping Abbreviation (Quantity)

DP-16E, -16FV

FP-16DAV

TTP-16DAV

—

EL (2,000 pcs/reel)

EL (2,500 pcs/reel)

ELL(2,000 pcs/reel)

HD74AC367AFPEL SOP-16 pin (JEITA)

HD74AC367TELL

TSSOP-16 pin

HD74AC367ARPEL SOP-16 pin (JEDEC) FP-16DNV

Notes: 1. Please consult the sales office for the above package availability.

2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of

the package code.

Pin Arrangement

GND

(Top view)

16 V

14 I

13 O

12 I

11 O

10 I

Rev.2.00, Jul.16.2004, page 1 of 7

HD74AC367 Related Products

	HD74AC367	HD74AC367AP	HD74AC367ARPEL	HD74AC367AFPEL	HD74AC367TELL
Description	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output	Hex Buffer/Driver with 3-State Output
Maker	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	-	DIP	SOIC	SOIC	TSSOP
package instruction	-	DIP, DIP16,.3	SOP, SOP16,.25	SOP, SOP16,.3	TSSOP, TSSOP16,.25
Contacts	-	16	16	16	16
Reach Compliance Code	-	compliant	compliant	compliant	compliant
Other features	-	ONE FUNCTION HAS 2 BITS	ONE FUNCTION HAS 2 BITS	ONE FUNCTION HAS 2 BITS	ONE FUNCTION HAS 2 BITS
Control type	-	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	-	AC	AC	AC	AC
JESD-30 code	-	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
length	-	19.2 mm	9.9 mm	10.06 mm	5 mm
Load capacitance (CL)	-	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	-	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	-	0.012 A	0.012 A	0.012 A	0.012 A
Number of digits	-	4	4	4	4
Number of functions	-	2	2	2	2
Number of ports	-	2	2	2	2
Number of terminals	-	16	16	16	16
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	-	TRUE	TRUE	TRUE	TRUE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	DIP	SOP	SOP	TSSOP
Encapsulate equivalent code	-	DIP16,.3	SOP16,.25	SOP16,.3	TSSOP16,.25
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	-	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Prop。Delay @ Nom-Sup	-	10 ns	10 ns	10 ns	10 ns
propagation delay (tpd)	-	10 ns	10 ns	10 ns	10 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	5.06 mm	1.75 mm	2.2 mm	1.1 mm
Maximum supply voltage (Vsup)	-	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	-	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	-	NO	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	-	THROUGH-HOLE	GULL WING	GULL WING	GULL WING
Terminal pitch	-	2.54 mm	1.27 mm	1.27 mm	0.65 mm
Terminal location	-	DUAL	DUAL	DUAL	DUAL
width	-	7.62 mm	3.95 mm	5.5 mm	4.4 mm
Base Number Matches	-	1	1	1	1
method of packing	-	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL

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